| 出版年月 |
著作類別 |
著作名稱 |
作者 |
收錄出處 |
| 2023-08 |
期刊論文
|
Temperature-Dependence Mechanical Characteristics Investigation of Cu Wire and Corresponding High Strain Rate Plasticity Behaviors Enabled by Johnson-Cook Constitutive Model |
De-Shin Liu, Po-Chun Wen, Zhen-Wei Zhuang, Yung-Ching Chao, and Pei-Chen Huang |
Journal of Mechanics
|
| 2022-11 |
期刊論文
|
Development of a Novel Dynamic Modeling Approach for a Three Axis Machine Tool in Mechatronic Integration |
De-Shin Liu, Jen-Chang Lu *, Meng-Shiun Tsai, Chih-Ta Wu, Zhen-Wei Zhuang |
Machines
|
| 2022-02 |
期刊論文
|
Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging |
Meng-Kai Shih*, Sean Shih, Tse-Wei Liao, Dao-Long Chen, D.S. Liu, David Tarng |
Microelectronics Reliability
|
| 2021-10 |
期刊論文
|
A novel identification technique of machine tool support stiffness under the variance of structural weight. |
Zhen-Wei Zhuang, Jen-Chang Lu, De-Shin Liu |
International Journal of Advanced Manufacturing Technology
|
| 2020-10 |
期刊論文
|
Development of High-Order Infinite Element Method for Bending Analysis of Mindlin–Reissner Plates |
D. S. Liu, Y. W. Chen and C. J. Lu |
Mathematical Problems in Engineerings
|
| 2020-08 |
期刊論文
|
Coupled ANN-based prediction of a foam expansion ratio using an FEM computational scheme to predict the material EVA expansion shape |
Yi-Ren Jeng, De-Shin Liu, and Hong-Tzong Yau |
Journal of the Chinese Society of Mechanical Engineers
|
| 2020-03 |
期刊論文
|
Bifurcation Analysis of Gear Pair with Continuous and Intermittent Mesh Stiffness Using Enhanced Compliance Method |
De-Shin Liu, Chuen-Ren Wang, Ting-Nung Shiau, Kuo-Hsuan Huang, and Wei-Chun Hsu |
International Journal of Bifurcation and Chaos
|
| 2019-08 |
期刊論文
|
Application of Craig-Bampton Reduction Technique and 2D Dynamic Infinite Element Modeling Approach to Membrane Vibration Problems |
De-Shin Liu and Yu-Wei Chen |
Journal of Mechanics
|
| 2019-08 |
期刊論文
|
Eigenvalue Analysis Of Thin Plate With Complicated Shapes by a Novel Infinite Element Method |
De-Shin Liu and Yu-Wei Chen |
CMES-Computer Modeling in Engineering & Science
|
| 2018-12 |
期刊論文
|
Effect of Environmental Temperature on Dynamic Behavior of an Adjustable Preload Double-nut Ball Screw |
De-Shin Liu, Pen-Chen Lin, Jheng-Jie Lin, Chuen-Ren Wang, and Ting-Nung Shiau |
The International Journal of Advanced Manufacturing Technology
|
| 2018-11 |
期刊論文
|
Effects of PTFE Micro-Particles on the Fiber-Matrix Interface of Polyoxymethylene/Glass Fiber/Polytetrafluoroethylene Composites |
Jasbir Singh, Shaifulazuar Rozali, Yern Chee ching, De-Shin Liu, Kuan Yong Ching, Shaifulazuar Razali and Seng Neon Gan |
Materials
|
| 2018-10 |
期刊論文
|
Simplified Numerical Model for Rapid Design of AF Module Spring Shape Parameters |
De-Shin Liu, C. J. Lu, S. H. Chen, C. S. Liu and T. W. Liao |
Journal of Mechanics
|
| 2018-10 |
期刊論文
|
Thermal Stress Analysis of Chip Scale Packaging by using Novel Multi-Scale Interface Element Method |
D. S. Liu, Yu-Wei Chen and Chin-Yuan Tsai |
Mathematical Problems in Engineerings
|
| 2017-10 |
期刊論文
|
An Improved Compliance Model for Gear Mesh Performance of Spur Gear Pair by Generating Method of Rack Cutter with Various Gear Parameters Generated by Rack Cutter |
Chuen-Ren Wang, Ting-Nung Shiau, Kuo-Hsuan Huang, De-Shin Liu, and Wei-Chun Hsu |
Journal of the Chinese Society of Mechanical Engineers
|
| 2017-08 |
期刊論文
|
Compressive Mechanical Property Analysis of EVA Foam: Its Buffering Effects at Different Impact Velocities |
De-Shin Liu, Z. H. Chen, C. Y. tsai, R. J. Ye and K. T. Yu |
Journal of Mechanics
|
| 2017-05 |
期刊論文
|
Design of Miniaturized Optical Image Stabilization and Autofocusing Camera Module for Cellphones |
Yu-Hao Chang, Chieh-Jung Lu, Chien-Sheng Liu, De-Shin Liu, Shih-Han Chen, Tse-Wei Liao, Wen-Yang Peng and Cheng-Hsuan Lin |
Sensors and Materials
|
| 2017-05 |
期刊論文
|
Synthesis, Characterization and the Solvent Effects on Interfacial Phenomena of Jatropha Curcas Oil Based Non-Isocyanate Polyurethan |
Mohamed Haniffa, Ching Yern Chee, Cheng Hock Chuah, Yong Ching Kuan, De-Shin Liu, and Nai-Shang Liou |
Polymers
|
| 2017-03 |
期刊論文
|
Finite Element Investigation into Impact Performance of Open-Face Motorcycle Helmet with Ventilation Slots |
De-Shin Liu and Yao-Te Chen |
Applied Sciences
|
| 2016-10 |
期刊論文
|
Numerical Investigation into Dynamic Behavior of Adjustable Preload Double-nut Ball Screw |
Chuen-Ren Wang, De-Shin Liu, Chien-Hsun Huang, and Ting-Nung Shiau |
Journal of Mechanical Science and Technology
|
| 2016-06 |
期刊論文
|
Experimental method and Finite Element simulation model for Investigation Into Flip-Chip-on-Film inner lead bonding parameters |
De-Shin Liu, Chieh-Jung Lu, Chen-Wei Hung, and Yi-Chiuan Huang |
IEEE Transactions on Device and Materials Reliability
|
| 2016-04 |
期刊論文
|
Vibration Analysis of the Multiple-Hole Membrane by Using the Coupled DIEM-FE Scheme |
De-Shin Liu, and I-Hung Lin |
Journal of Mechanics
|
| 2016-03 |
期刊論文
|
High-speed camera investigation into fracture behavior of solder ball joints under dynamic loading |
De-Shin Liu, Chang-Lin Hsu, and Cho-Liang Chung |
Experimental Techniques
|
| 2015-04 |
期刊論文
|
Effect of Thermoplastic Appliance Thickness on Initial Stress Distribution in Periodontal Ligament |
De-Shin Liu and Yao-Te Chen |
Advances in Mechanical Engineering
|
| 2015-01 |
期刊論文
|
An experimental and numerical investigation into wafer probing parameters base on thin wafer breaking strength |
De-Shin Liu, Zi-Hau Chen, Chi-Min Chang, Chung-Yu Li, and Hsiang-Chin Hsu |
IEEE Transactions on Components, Packaging and Manufacturing Technology
|
| 2014-10 |
期刊論文
|
Optimization of Johnson-Cook Constitutive Model for Lead-free Solder Using Genetic Algorithm and Finite Element Simulations |
D. S. Liu and C. L. Hsu |
CMC-Computers materials & Continua
|
| 2014-09 |
期刊論文
|
Forged HITEMAL: Al-based MMCs strengthened with nanometric thick Al2O3 skeleton |
Martin Balog, PeterKrizik, MartinNosko, ZuzanaHajovska, Maria Victoria Castro Riglos, Walter Rajner, De-Shin Liu, and Frantisek Simancigk |
Materials Science and Engineering A
|
| 2014-06 |
期刊論文
|
Experimental and numerical investigations of the influence of chip-on-film packages: component operating temperature in natural convection |
D. S. Liu, C. M. Chang, A.H. Liu , C.F. Huang , Y.C. Lee, and C.Y. Tu |
IEEE Transactions on Device and Materials Reliability
|
| 2013-11 |
期刊論文
|
Relationship between medial plica and medial femoral condyle - a three-dimensional dynamic finite element model |
De-Shin Liu, Zhen-Wei Zhuang, Shaw-Ruey Lyu |
Clinical Biomechanics
|
| 2013-10 |
期刊論文
|
Modeling of Moisture Diffusion in Permeable Particle-Reinforced Epoxy Rgesins Using Three-Dimensional Heterogeneous Hybrid Moisture Element Method |
D. S. Liu, Z. H. Fong, I. H. Lin and Z. W. Zhuang |
CMES-Computer Modeling in Engineering & Science
|
| 2013-09 |
期刊論文
|
Development of Plate Infinite Element Method for Stress Analysis of Elastic Bodies with |
D. S. Liu, K. L. Cheng, Z. W. Zhuang |
Journal of Mechanics
|
| 2013-06 |
期刊論文
|
Fast Numerical Algorithm for Optimization Mold Shape
of Direct Injection Molding Process
|
Yi-Ren Jeng, De-Shin Liu,Hong-Tzong Yau |
Materials and Manufacturing Processes
|
| 2013-03 |
期刊論文
|
Coupled PIEM/FEM algorithm based on Mindlin-Reissner plate theory for bending analysis of plates with through-thickness hole |
De-Shin Liu, Chin-Yi Tu, and Cho-Liang Chung |
CMES-Computer Modeling in Engineering & Science
|
| 2012-09 |
期刊論文
|
Designing Experimental Methods to Predict the Expansion Ratio of EVA Foam Material and Using Finite Element Simulation to Estimate the Shoe Expansion Shape |
Yi-Ren Jeng, De-Shin Liu,Hong-Tzong Yau |
Materials Transactions
|
| 2012-01 |
期刊論文
|
A Novel High Speed Impact Testing Method for Evaluating the Low Temperature Effects of Eutectic and Lead-free Solder Joints |
De-Shin Liu*, Chang-Lin Hsu, Chia-Yuan Kuo, Ya-Ling Huang, Kwang-Lung Lin and Geng-Shin Shen |
Soldering & Surface Mount Technology
|
| 2011-01 |
期刊論文
|
A Hybrid FEM-Neural Network Approach for Predicting EVA expansion shape on injection molding process |
Yi-Ren Jeng, De-Shin Liu, and Honz-Tzong Yau |
Advanced Science Letters
|
| 2011-01 |
期刊論文
|
Modeling of moisture diffusion in permeable fiber-reinforced polymer composites using heterogeneous hybrid mositure element method |
De-Shin Liu*, Zhen-Wei Zhuang, Shaw-Ruey Lyu, Cho-Liang Chung, and Pai-Chen Lin |
CMC-Computers materials & Continua
|
| 2011-01 |
期刊論文
|
Optimization of multi-layer probe card using strain energy-base analytical model and multi-objective programming algorithm |
D. S. Liu, C. M. Chang, A.H. Liu , C.F. Huang , Y.C. Lee, and C.Y. Tu |
IEEE Transactions on Electronics Packaging Manufacturing
|
| 2010-11 |
期刊論文
|
Finite Element Method Investigation into Nanoimprinting of Aluminum / Polyimide Bi-Layer Substrates |
De-Shin Liu*, Chin-Yuan Tsai, Ying-Ti Lu, Cheng-Kuo Sung and Cho-Liang Chung |
Microelectronic Engineering
|
| 2010-11 |
期刊論文
|
Numerical study of a novel built-in energy-absorbing component for adaptive steering columns |
De-Shin Liu*, Chin-Yi Tua, Chih-Ming Fan, and Shu-Shen Yeh |
Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering
|
| 2010-10 |
期刊論文
|
An Experimental and Numerical Investigation into the Effects of the Chip-on-Film (COF) Processing Parameters on the Au-Sn Bonding Temperature |
De-Shin Liu*, Shu-Shen Yeh, Chun-Teh Kao, Pay-Yau Huang, Chia-I Tsai, An-Hong Liu and Shu-Ching Ho |
Soldering & Surface Mount Technology
|
| 2010-07 |
期刊論文
|
Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test |
Ya-Ling Huang, Kwang-Lung Lin, and De-Shin Liu |
Journal of Materials Research
|
| 2010-05 |
期刊論文
|
A Novel Analysis Model to Investigation of Contact Force and Scrub Length for Design of Probe Card |
D. S. Liu*, and C. M. Chang |
Microelectronics Reliability
|
| 2010-05 |
期刊論文
|
A high-speed micro-impact testing system for evaluating the properties of lead-free solder joints |
De-Shin Liu, Chia-Yuan Kuo, Chang-Lin Hsu and Cho-Liang |
Experimental Techniques
|
| 2010-02 |
期刊論文
|
Modeling of moisture diffusion in heterogeneous epoxy resin containing multiple randomly distributed particles using hybrid moisture element method |
D. S. Liu*, Zhen-Wei Zhuang, Cho-Liang Chung, and Ching-Yang Chen |
CMC-Computers, materials & Continua
|
| 2010-01 |
期刊論文
|
Development of High-Order Infinite Element Method for Stress Analysis of Elastic Bodies with Singularities |
De-Shin Liu, Kuo-Liang Cheng, and Zhen-Wei Zhuang |
Journal of Solid Mechanics and Materials Engineering
|
| 2010-01 |
期刊論文
|
Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method |
De-Shin Liu, Zhen-Wei Zhuang, Ching-Yang Chenb, Cho-Liang Chungc |
Microelectronics Reliability
|
| 2009-11 |
期刊論文
|
Determination of temperature-dependent elasto-plastic properties of thin-film by MD nanoindentation simulations and an inverse GA/FEM computational scheme |
D. S. Liu, C. Y. Tsai, and S. R. Lyu |
CMC-Computers, materials & Continua,
|
| 2009-08 |
期刊論文
|
Optimization of bonding force, sinking value and potting gap size in COF inner lead bonding process |
D. S. Liu*, S. S. Yeh ,C. T. Kao, H. C. Shen, G. S. Shen, and H. H. Liu |
IEEE Transactions on Advanced Packaging
|
| 2009-01 |
期刊論文
|
Application of a genetic algorithm to the design optimization of a multilayer probe card for wafer level testing |
D. S. Liu*, M. K. Shih, and C. M. Chang |
IEEE Transactions on Electronics Packaging Manufacturing
|
| 2009-01 |
期刊論文
|
Estimation of thermo-elasto-plastic properties of thin-film mechanical properties using MD nanoindentation simulations and an inverse FEM/ANN computational scheme |
D. S. Liu* and C. Y. Tsay |
CMES-Computer Modeling in Engineering & Science
|
| 2008-10 |
期刊論文
|
Failure Mode Analysis of Lead-free Solder Joints under High Speed Impact Testing |
D. S. Liu, Chia-Yuan Kuo, Chang-Lin Hsu, Geng-Shin Shen, Yu-Ren Chen, and Kuo-Cheng Lo |
Materials Science & Engineering A
|
| 2008-06 |
期刊論文
|
Interval optimization of rotor-bearing systems with dynamic behavior constraints using an interval-genetic algorithm |
T. N. Shiau, C. H. Kang, and D. S. Liu |
Structural and Multidisciplinary Optimization
|
| 2008-04 |
期刊論文
|
The micro-impact fracture behavior of lead-free solderball joints |
Y. L. Huang, K. L. Lin, and D. S. Liu |
Journal of Materials Research
|
| 2008-03 |
期刊論文
|
An investigation of Wafer Probe Needles Mechanical Properties and Contact Resistance Changing Under Multi-probing Process |
D. S. Liu*, M. K. Shih, and F. M. Zheng |
IEEE Transactions on Components and Packaging Technologies
|
| 2007-10 |
期刊論文
|
Global-to-Local Modeling and Experiment Investigation of a HFCBGA Package Board-level Solder Joint Reliability |
C. I. Chen, S. C. Wu, D. S. Liu, C. Y. Ni, T. D. Yuan |
Journal of Microelectronics and Electronic Packaging
|
| 2007-06 |
期刊論文
|
Measurement and Analysis of Wafer Probe Testing Contact Resistance |
D.S. Liu, M.K. Shih, W.H. Huang |
Microelectronics Reliability
|
| 2006-10 |
期刊論文
|
Experimental Aided Performance Evaluation Methods for Wafer Probe Test |
D. S. Liu, M. K. Shih, S. M. Liu, Tony Huang, Y. C. Chao, and C. C. Yu |
Experimental Techniques
|
| 2006-10 |
期刊論文
|
Mechanical Strength of Mediopatellar Plica - the Influence of Its Fiber Content |
Shaw-Ruey Lyu, Jeh-En Tzeng, Chia-Yuan Chang, Ai-Ru Jian, and De-Shin Liu |
Clinical Biomechanics
|
| 2006-09 |
期刊論文
|
Experimental Method and FE Simulation Model for Evaluation Wafer Probing Parameters |
D. S. Liu, and M. K. Shih |
Microelectronics Journal
|
| 2006-08 |
期刊論文
|
An experimental and numerical investigation into multilayer probe card layout design |
D. S. Liu and M. K. Shih |
IEEE Transactions on Electronics Packaging Manufacturing
|
| 2006-08 |
期刊論文
|
Design of a Novel Chip on Glass Packaging Solution for CMOS Image Sensor Device |
C. Y. Chen, Y. C. Chao, D. S. Liu, and Zhen-Wei Zhuang |
Microelectronics Reliability
|
| 2006-05 |
期刊論文
|
A Thermo-mechanical Study on Electrical Resistance of Cu Lead Interconnection |
D. S. Liu*, C. Y. Chen, and Y. C. Chao |
Journal of Electronic Materials
|
| 2005-09 |
期刊論文
|
2-D infinite element modeling for elastostatic problems
with geometric singularity and unbounded domain |
D.S. Liu *, D.Y. Chiou |
Computers and Structures
|
| 2005-08 |
期刊論文
|
3-D Modeling of a composite material reinforced with multiple thickly coated particles using the infinite element method |
D.S. Liu, C.Y. Chen, D.Y. Chiou |
Computer Modeling in Engineering & Science
|
| 2004- |
期刊論文
|
A hybrid 3D thermo-elastic in nite element modeling for area-array package solder joints |
D.S. Liu*, D.Y. Chiou, C.H. Lin |
Finite Elements in Analysis and Design
|
| 2004- |
期刊論文
|
Modeling of inclusions with interphases in heterogeneous material using the infinite element method |
D.S. Liu*, D.Y. Chiou |
Computational Materials Science
|
| 2004- |
期刊論文
|
Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method |
D.S. Liu*, Y.C. Chao, C.H. Wang |
Finite Elements in Analysis and Design
|
| 2003- |
期刊論文
|
3D IEM formulation with an IEM/FEM coupling scheme for solving elastostatic problems |
D.S. Liu*, D.Y. Chiou, C.H. Lin |
Advances in Engineering Software
|
| 2003- |
期刊論文
|
A coupled IEM/FEM approach for solving elastic problems with multiple cracks |
D.S. Liu*, D.Y. Chiou |
International Journal of Solids and Structures
|
| 2003- |
期刊論文
|
Influence of environmental factors on energy absorption degradation of polystyrene foam in protective helmets |
De-Shin Liu*, Chia-Yuan Chang, Chin-Ming Fan, Shu-Lin Hsu |
Engineering Failure Analysis
|
| 2003- |
期刊論文
|
Integrated design method for flip chip CSP with electrical, thermal and thermo-mechanical qualifications |
De-Shin Liu*, Chin-Yu Ni, Ching-Yang Chen |
Finite Elements in Analysis and Design
|
| 2003- |
期刊論文
|
Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability |
D.S. Liu*, Y.C. Chao, C.H. Lin, G.S. Shen, H.S. Liu |
Microelectronics Reliability
|
| 2002- |
期刊論文
|
A study on the electrical resistance of solder joint |
De-Shin Liu*, Chin-Yu Ni |
Microelectronic Engineering
|
| 2002- |
期刊論文
|
A thermo-mechanical study on the electrical resistance
of aluminum wire conductors |
De-Shin Liu*, Chin-Yu Ni |
Microelectronics Reliability
|
| 2002- |
期刊論文
|
Procedure for design optimization of a T-cap flip chip package |
Chin-Yu Ni, De-Shin Liu*, Ching-Yang Chen |
Microelectronics Reliability
|
| 2002- |
期刊論文
|
The optimization design of bump interconnections
in flip chip packages from the electrical standpoint |
De-Shin Liu*, Chin-Yu Ni |
Microelectronics Reliability
|
主要學歷