| 出版年月 |
著作類別 |
著作名稱 |
作者 |
收錄出處 |
| 2024-08 |
期刊論文
|
Systematic study of liquid-state interfacial reactions between Co and In-Sn solders with varying Sn contents |
C.-H. Wang* and T.-Y. Chang |
Journal of Electronic Materials
|
| 2024-05 |
期刊論文
|
Interfacial reactions between Sn-based solders and n-type Bi2(Te,Se)3 thermoelectric material |
C.-H. Wang*, C.-W. Chiu, and M.-H. Li |
Materials
|
| 2024-02 |
期刊論文
|
Effects of minor Ga addition on interfacial reactions between Sn-Ga solders and Cu |
C.-H. Wang*, K.-T. Li, and Y.-W. Yen, |
JOM
|
| 2023-06 |
期刊論文
|
Unexpected interfacial reactions in Co/Sb2Te3 and Co/GeTe couples |
S.-W. Chen, C.-H. Wang, J.-R. Chang, H.-C. Yang, Y.-H. Lai , and Y. Chen, |
Journal of the Taiwan Institute of Chemical Engineers
|
| 2023-05 |
期刊論文
|
Strong inhibition of boron dopant on IMC growth between electroplating Co(B) deposits and lead-free solders at 250 oC |
C.-H. Wang and T.-Y. Chang |
Journal of Materials Science: Materials in Electronics
|
| 2023-04 |
期刊論文
|
Investigation of the interfacial reactions between the CoCuFeNi high entropy alloy and Sn solder |
T.-Y. Chiang, Y.-C. Chang, C.-H. Wang, A. D. Laksono, and Y.-W. Yen |
Metals
|
| 2022-04 |
期刊論文
|
Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In-48at.%Sn solders |
C.-H. Wang* and T.-Y. Chang, |
Journal of Materials Science: Materials in Electronics
|
| 2022-02 |
期刊論文
|
Minor Ge addition to suppress the IMC growth in interfacial reactions of Co with Sn‑Ag‑Ge and Sn‑Ag‑Cu‑Ge solders |
C.‑H Wang, K.‑H. Chen, and J.‑Y. Tsai |
Journal of Electronic Materials
|
| 2020-10 |
期刊論文
|
Liquid-state interfacial reactions of Sn and Sn-Ag-Cu solders with p-type (Bi,Sb)2Te3 thermoelectric material |
C.-H. Wang*, M.-H. Li, C.-W. Chiu and X.-H. Wang |
JOM
|
| 2020-03 |
期刊論文
|
Phase diagram of Bi–In–Se ternary system |
S.-W. Chen, Y. Hutabalian, W. Gierlotka, C. H. Wang, S.-T. Lu |
Calphad
|
| 2019-09 |
期刊論文
|
Effects of minor Cu, Ni and Ag additions on the reactions between Sn-based solders and Co substrate |
C.-H. Wang*, C.-Y. Kuo, and Y.-B. Guo |
JOM
|
| 2019-07 |
期刊論文
|
Minor P doping to effectively suppress IMC growth in solder joints of electroplating Co(P) metallization |
C.-H. Wang* and C.-Y. Lin |
Journal of Electronic Materials
|
| 2018-10 |
期刊論文
|
Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn-Ag-Cu solders |
C.-H. Wang*, M.-H. Li, C.-W. Chiu, and T. Y. Chang |
Journal of Alloys and Compounds
|
| 2018-01 |
期刊論文
|
Effects of Zn and Ga additions to suppress PdSn4 growth at a solder/Pd interface under current stressing |
C.-H Wang, K.-T. Li, K.-H Chen |
Journal of Electronic Materials
|
| 2017-12 |
期刊論文
|
Liquidus projection and thermodynamic modeling of a Sn-Ag-Zn system |
S.-W. Chen, W.-T. Chiu, W. Gierlotka, J.-S. Chang, C.-H. Wang |
Journal of Electronic Materials
|
| 2016-12 |
期刊論文
|
Effects of Ga addition on interfacial reactions between Sn-based solders and Ni |
C.-H. Wang and K.-T. Li |
Journal of Electronic Materials
|
| 2016-08 |
期刊論文
|
Metastable CoSn4 formation induced by minor Ga
addition and effective suppression effect on the IMC
growth in solid-state Sn–Ga/Co reactions |
C.-H. Wang, K.-T. Li, and P.-Y. Huang |
Journal of Materials Science
|
| 2016-03 |
期刊論文
|
Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate |
C.-H. Wang*, C.-C. Wen, and C.-Y. Lin |
Journal of Alloys and Compounds
|
| 2016-01 |
期刊論文
|
Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints |
C.-H. Wang* and K.-T. Li |
Journal of Alloys and Compounds
|
| 2015-12 |
期刊論文
|
Minor Ga addition to effectively inhibit PdSn4 growth between Sn solder and Pd substrate |
C.-H. Wang*, K.-T. Li, and C.-Y. Lin |
Intermetallics
|
| 2015-12 |
期刊論文
|
Phase equilibria of the ternary Sn-Zn-Co system at 250oC and 500oC |
C.-H. Wang*, S.-E. Huang, and P.-Y. Huang |
Journal of Electronic Materials
|
| 2015-11 |
期刊論文
|
Phase equilibria of the ternary Sn-Pb-Co system at 250oC and interfacial reactions of Co with Sn-Pb alloys |
C.-H. Wang*, C.-Y. Kuo, and N.-C. Yang |
Journal of Electronic Materials
|
| 2015-11 |
期刊論文
|
Pseudocapacitive performance of Co(OH)2 enhanced by Ni(OH)2 formation on porous Ni/Cu electrode |
C.-H. Wang*, J.-L. Liu, and H.-Y. Huang |
Electrochimica Acta
|
| 2015-11 |
期刊論文
|
Strong effects of minor Ga addition on liquid-state Sn-Ga/Co interfacial reactions |
C.-H. Wang* and K.-T. Li |
Journal of Alloys and Compounds
|
| 2015-08 |
期刊論文
|
Growth kinetics and mechanism of Pd2Zn9 at the interface of Pd substrate with molten Sn-9wt.%Zn solder |
C.-H. Wang* and K.-T. Li |
Materials Chemistry and Physics
|
| 2015-07 |
期刊論文
|
Interfacial reactions in In/Ag2Se couples |
S.-W. Chen*, J.-S. Chang, C.-M. Hsu, J.-Y. Lin, and C.-H. Wang |
Materials Chemistry and Physics
|
| 2015-06 |
期刊論文
|
Effects of Sn thickness on morphology and evolution of Ni3Sn4 grains formed between molten Sn and Ni substrate |
C.-H. Wang* and J.-L. Liu |
Intermetallics
|
| 2015-04 |
期刊論文
|
Liquid-state interfacial reactions in Sn-Zn/Pd couples and phase equilibria of the Sn-Zn-Pd system at 260oC |
C.-H. Wang*, P.-Y. Li, and K.-T. Li |
Intermetallics
|
| 2015-03 |
期刊論文
|
Peltier effect on CoSn3 growth in Sn/Co/Sn couples with different substrate lengths |
C.-H. Wang* and C.-Y. Kuo |
Materials Chemistry and Physics
|
| 2015-01 |
期刊論文
|
Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate |
C.-H. Wang*, S.-E. Huang, and C.-W. Chiu |
Journal of Alloys and Compounds
|
| 2015-01 |
期刊論文
|
Inhibiting CoSn3 growth at the Sn/Co system by minor Zn addition |
C.-H. Wang*, S.-E. Huang, and K.-T. Li |
Intermetallics
|
| 2014-12 |
期刊論文
|
Interfacial microstructure evolution between Sn-Zn solders and Ag substrate during solid-state annealing |
C.-H. Wang* and P.-Y. Li |
Journal of Electronic Materials
|
| 2014-07 |
專書
|
材料分析: 第20章 熱分析 |
王朝弘、陳信文 |
中國材料科學學會
|
| 2014-05 |
期刊論文
|
Cruciform pattern formation of Ni5Zn21 in interfacial reactions between Ni and Sn-Zn solders |
C.-H. Wang* and H.-H. Chen |
Journal of Electronic Materials
|
| 2014-01 |
期刊論文
|
Dissolution and interfacial reactions of (Cu,Ni)6Sn5 intermetallic compound in molten Sn-Cu-Ni solders |
C.-H. Wang*, W.-H. Lai, and S.-W. Chen |
Journal of Electronic Materials
|
| 2013-12 |
期刊論文
|
Ag whisker formation in Ag-In-Se alloys |
S.-W. Chen , J.-Y. Lin, C.-M. Hsu, J.-S. Chang, J.-G. Duh, and C.-H. Wang |
Metallurgical and Materials Transactions A
|
| 2013-07 |
期刊論文
|
Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints |
C.-H. Wang*, H.-T. Shen, and W.-H. Lai |
Journal of Alloys and Compounds
|
| 2013-03 |
期刊論文
|
Microstructure evolution of Ni5Zn21 intermetallic compound at Sn-9 wt %Zn/Ni interface |
C.-H. Wang* and P.-Y. Li |
Materials Chemistry and Physics
|
| 2013-01 |
期刊論文
|
Temperature effects on liquid-state Sn/Co interfacial reactions |
C.-H. Wang* and C.-Y. Kuo, S.-E. Huang, and P.-Y. Li |
Intermetallics
|
| 2012-12 |
期刊論文
|
Liquid-state interfacial reactions of Sn-Zn/Co couples at 250oC |
C.-H. Wang*, S.-E. Huang, and J.-L. Liu |
Journal of Electronic Materials
|
| 2012-08 |
期刊論文
|
Interfacial reactions of high-temperature Zn-Sn solders with Ni substrate |
C.-H. Wang*, H.-H. Chen, and P.-Y. Li |
Materials Chemistry and Physics
|
| 2012-04 |
專書論文
|
Effects of electromigration on electronic solder joints. |
S.-W. Chen, C.-M. Chen, C.-H. Wang, and C.-M. Hsu |
Lead-free solders: materials reliability for electronics
|
| 2012-03 |
期刊論文
|
Kinetic analysis of Ni5Zn21 growth at the interface between Sn-Zn solders and Ni |
C.-H. Wang*, H.-H. Chen, P.-Y. Li, and P.-Y. Chu |
Intermetallics
|
| 2012-02 |
期刊論文
|
Phase equilibria of Sn-Sb-Cu system |
S.-W. Chen*, A.-R. Zi, W. Gierlotka, C.-F. Yang, C.-H. Wang, S.-K. Lin, and C.-M. Hsu |
Materials Chemistry and Physics
|
| 2011-11 |
期刊論文
|
Effects of minor amounts of Zn on the Sn-Zn/Ni interfacial reactions and phase equilibria of the ternary Sn-Zn-Ni system at 250oC |
C.-H. Wang*, H.-H. Chen, and W.-H. Lai |
Journal of Electronic Materials
|
| 2011-10 |
期刊論文
|
Growth kinetics of the solid-state interfacial reactions in the Sn-Cu/Co and Sn/Co-Cu couples |
C.-H. Wang* and C.-Y. Kuo |
Materials Chemistry and Physics
|
| 2011-08 |
期刊論文
|
Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains |
W.-K. Liao, C.-M. Chen*, M.-T. Lin, and C.-H. Wang |
Scripta Materialia
|
| 2011-08 |
期刊論文
|
Interfacial reactions between eutectic Sn-Pb solder and Co substrate |
C.-H. Wang* and C.-Y. Kuo |
Journal of Materials Science
|
| 2011-01 |
期刊論文
|
Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing |
C.-H. Wang*, C.-Y. Kuo, H.-H. Chen, and S.-W. Chen |
Intermetallics
|
| 2010-12 |
期刊論文
|
Electromotive force measurements in the ternary system Bi-In-Zn |
S. Knott, Z. Li, C.-H Wang, and A. Mikula |
Metallurgical and Materials Transactions A
|
| 2010-11 |
期刊論文
|
Study of the effects of Zn content on the interfacial reactions between Sn-Zn solders and Ni substrate at 250oC |
C.-H. Wang* and H.-H. Chen |
Journal of Electronic Materials
|
| 2010-08 |
期刊論文
|
Coupling effect of interfacial reaction in Co/Sn/Cu diffusion couples |
C.-H. Wang* and C.-Y. Kuo |
Journal of Electronic Materials
|
| 2010-05 |
期刊論文
|
Investigations on interfacial reactions at reentrant corners |
C.-H. Wang, C.-N. Chiu, and S.-W. Chen* |
Journal of Materials Research
|
| 2010-04 |
期刊論文
|
Effects of Ni addition on the interfacial reactions between Sn-Cu solders and Ni substrate |
C.-H. Wang*, H.-T. Shen |
Intermetallics
|
| 2009-05 |
期刊論文
|
Peltier effect on Sn/Co interfacial reaction |
C.-H. Wang and S.-W. Chen |
Journal of Electronic Materials
|
| 2008-12 |
期刊論文
|
Phase equilibria of Sn-Sb-Ag ternary system (I): Experimental |
S.-W. Chen*, P.-Y. Chen, C.-N. Chiu, Y.-C. Huang, and C.-H. Wang |
Metallurgical and Materials Transactions A
|
| 2008-04 |
期刊論文
|
Interfacial reactions in Sn-(Cu)/Cu6Sn5/Ni couples at 210oC |
C.-H. Wang, S.-W. Chen* |
Intermetallics
|
| 2008-04 |
期刊論文
|
Sn/Co solid/solid interfacial reactions |
C.-H. Wang, S.-W. Chen* |
Intermetallics
|
| 2008-01 |
期刊論文
|
Interfacial Reactions in the Sn-Bi/Te Couples |
C.-N. Chen, C.-H. Wang, S.-W. Chen* |
Journal of Electronic Materials
|
| 2008-01 |
期刊論文
|
Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples |
S.-W. Chen*, A.-R Zi, P.-Y. Chen, H.-J. Wu, Y.-K. Chen and C.-H. Wang |
Materials Chemistry and Physics
|
| 2007-12 |
期刊論文
|
Cruciform pattern formation in Sn/Co couples |
C.-H. Wang, S.-W. Chen* |
Journal of Materials Research
|
| 2007-03 |
期刊論文
|
Effects of electromigration on interfacial reactions in cast Sn/Cu joints |
S.-W. Chen*, C.-H. Wang |
Journal of Materials Research
|
| 2007-01 |
期刊論文
|
Phase diagrams of Pb-Free solders and their related materials systems |
S.-W. Chen*, C.-H. Wang, S.-K. Lin, C.-N. Chiu |
Journal of Materials Science: Materials in Electronics
|
| 2007-01 |
期刊論文
|
Phase transformation and microstructural evolution in solder joints |
S.-W. Chen*, C.-H. Wang, S.-K. Lin, C.-N. Chiu, C.-C. Chen |
JOM
|
| 2006-11 |
期刊論文
|
Lowering of Sn-Sb alloy melting points caused by substrate dissolution |
S.-W. Chen*, P.-Y. Chen, C.-H. Wang |
Journal of Electronic Materials
|
| 2006-09 |
期刊論文
|
Interfacial reactions of Sn-Cu/Ni couples at 250oC |
S.-W. Chen*, C.-H. Wang |
Journal of Materials Research
|
| 2006-02 |
期刊論文
|
Electric current effects in the flip chip solder joints |
C.-H. Wang, S.-W. Chen* |
Journal of the Chinese Institute of Chemical Engineers
|
| 2006-01 |
期刊論文
|
Sn-0.7wt%Cu/Ni interfacial reactions at 250oC |
C.-H. Wang, S.-W. Chen* |
Acta MAterialia
|
| 2003-10 |
期刊論文
|
Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800oC |
C.-H. Wang, S.-W. Chen* |
Metallurgical and Materials Transactions A
|
| 2003-02 |
期刊論文
|
Phase equilibria of the ternary Al-Cu-Ni system and interfacial reactions of related systems at 800oC |
C.-H. Wang, S.-W. Chen*, C.-H. Chang and J.-C. Wu |
Metallurgical and Materials Transactions A
|
| 2002-09 |
期刊論文
|
Phase Equilibria and Solidification Properties of Sn-Cu-Ni Alloys |
C.-H. Lin, S.-W. Chen*, C.-H. Wang |
Journal of Electronic Materials
|
| 2002-04 |
期刊論文
|
Phase Equilibria of the Ternary Ni-Cr-Zr System and Interfacial Reactions in the Ni-Cr/Zr Couples |
S.-J. Luo, C.-H. Wang and S.-W. Chen* |
Metallurgical and Materials Transactions A
|
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