| 出版年月 |
著作類別 |
著作名稱 |
作者 |
收錄出處 |
| 2023-05 |
期刊論文
|
Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention |
Pei-Tzu Lee, Cheng-Yu Lee, Wan-Zhen Hsieh, Chih-Tsung Chen,
Cheng-En Ho |
Journal of Materials Research and Technology
|
| 2022-06 |
期刊論文
|
Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure |
Pei-TzuLee, Wan-Zhen Hsieh, Cheng-YuLee, Shao-Chin Tseng, Mau-TsuTang, Ching-YuChiang, C.R.Kao, Cheng-EnHo |
Scripta Materialia
|
| 2021-08 |
期刊論文
|
Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 |
P. T. Lee, W. Z. Hsieh, C. Y. Lee, Y. H. Huang, C. Y. Chiang, C. S. Ku, C. R. Kao, and C. E. Ho |
Journal of Materials Research and Technology,
|
| 2021-05 |
研討會論文
|
White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 |
P. T. Lee, W. Z. Hsieh, C. Y. Lee, C. R. Kao, and C. E. Ho |
|
| 2020-11 |
研討會論文
|
Thermal Stability and Electrochemical Corrosion of ENEPIG Surface Finish Deposited on the Cu Traces |
C. Y. Lee, W. Z. Hsieh, P. T. Lee, C. H. Li, S. P. Yang, and C. E. Ho |
|
| 2019-11 |
研討會論文
|
Nano-XRF and X-ray Nanodiffraction Studies on the Working Mechanism of Flexible Ni(P) Thin Films |
W. L. Chou, C. Y. Lee, P. T. Lee, W. Z. Hsieh, C. S. Ku, X. Y. Li, S. C. Tseng, M. T. Tang, and C. E. Ho |
|
| 2019-11 |
研討會論文
|
White X-ray Laue Diffraction Characterization of Microstructure Transition and Stress Relaxation of Electroplating Cu upon Self-annealing |
Y. H. Huang, W. Z. Hsieh, C. Y. Lee, C. H. Yang, S. J. Chiu, C. S. Ku, and C. E. Ho |
|
| 2019-02 |
期刊論文
|
Interfacial Reaction and Mechanical Reliability between Sn-3Ag-0.5Cu Alloy and Ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu Metallization Pad |
Y. S. Wu, P. T. Lee, W. Z. Hsieh, T. T. Kuo, and C. E. Ho |
Surface and Coatings Technology
|
| 2019-02 |
技術報告
|
深入剖析軟鎳的工作原理及其焊接特性 |
周韋伶, 謝宛蓁, 李承宇, 楊舒評, 彭鎮山, 何政恩 |
|
| 2019-01 |
期刊論文
|
Reaction of Au/Pd/Cu and Au/Pd/Au/Cu Multilayers with Sn-Ag-Cu Alloy |
Y. H. Huang, W. Z. Hsieh, P. T. Lee, Y. S. Wu, T. T. Kuo, and C. E. Ho |
Surface and Coatings Technology
|
| 2018-11 |
研討會論文
|
Characterization of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 Using Synchrotron White X-ray Laue Diffraction |
P. T Lee, W. Z. Hsieh, C. Y. Lee, C. S. Ku, C. R. Kao, and C. E. Ho |
|
| 2018-11 |
研討會論文
|
Flexible Ni(P) Microstructure and Its Working Mechanism |
W. L. Chou, W. Z. Hsieh, C. Y. Lee, C. S. Peng, T. T. Kuo, and C. E. Ho |
|
| 2018-11 |
研討會論文
|
Synchrotron X-ray Nanodiffraction Study of Tin Whisker Growth |
W. Z. Hsieh, P. T Lee, W. L. Chou, C. S. Ku, and C. E. Ho |
|
| 2018-10 |
研討會論文
|
Toward A Better Understanding of Working Mechanism of Flexible Ni(P) |
W. L. Chou, W. Z. Hsieh, C. Y. Lee, C. S. Peng, T. T. Kuo, and C. E. Ho |
|
| 2018-09 |
期刊論文
|
TEM Characterization of Cu Self-annealing and Direct Proof of Pinhole Formation Mechanism in a Cu Film |
C. E. Ho, C. C. Chen, C. H. Yang, P. T. Lee, W. Z. Hsieh, and Y. S. Wu |
Surface and Coatings Technology
|
| 2018-03 |
期刊論文
|
High-temperature Stability of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes |
C. E. Ho, W. Z. Hsieh, P. T. Lee, Y. H. Huang, and T. T. Kuo |
Applied Surface Science
|
| 2017-06 |
期刊論文
|
High-speed Cu Electrodeposition and Its Solderability |
P. T. Lee, Y. S. Wu, P. C. Lin, C. C. Chen, W. Z. Hsieh, and C. E. Ho |
Surface and Coatings Technology
|
| 2016-12 |
技術報告
|
由焊接角度剖析各式銅表面處理技術的可靠度-鈀膜厚度對Sn-3.5Ag焊接及銲點老化之影響 |
楊政憲, 呂名凱, 謝宛蓁, 施威言, 郭蔡同, 何政恩 |
|
| 2016-11 |
研討會論文
|
Interdiffusion of Au/Pd/Cu and Au/Pd(P)/Cu Couples at 180 °C |
謝宛蓁, 李珮慈, 郭蔡同, 何政恩 |
|
| 2016-10 |
研討會論文
|
Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage |
C. E. Ho, W. Z. Hsieh, P. T. Lee, and T. T. Kuo |
|
| 2016-09 |
期刊論文
|
Real-time Study of Electromigration in Sn Blech Structure |
C. E. Ho, W. Z. Hsieh, C. H. Yang, and P. T. Lee |
Applied Surface Science
|
| 2016-08 |
期刊論文
|
Comparative Study between Au/Pd/Cu and Au/Pd(P)/Cu Films in Soldering Applications |
P. T. Lee, W. Z. Hsieh, T. C. Yeh, H. K. Wang, and C. E. Ho |
Surface and Coatings Technology
|
| 2016-08 |
期刊論文
|
Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films |
W. Z. Hsieh, M. A. Rahman, T. H. Yang, T. T. Kuo, and C. E. Ho |
Surface and Coatings Technology
|
| 2015-11 |
研討會論文
|
銅濃度效應對Sn-3Ag-xCu/Ni 銲點之機械可靠度的影響 |
呂名凱、李珮慈、謝宛蓁、何政恩 |
|
| 2015-11 |
研討會論文
|
不同磷含量之鈀薄膜對銲接可靠度的影響 |
李珮慈、謝宛蓁、呂名凱、何政恩 |
|
| 2015-10 |
研討會論文
|
Electromigration in Tin Blech Structure |
W. Z. Hsieh, P. T. Lee, and C. E. Ho |
|
| 2015-01 |
期刊論文
|
Depletion and Phase Transformation of a Submicron Ni(P) Film in the Early Stage of Soldering Reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu |
C. E. Ho, W. Z. Hsieh, and T. H. Yang |
Electronic Materials Letters
|
| 2015-01 |
期刊論文
|
Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition |
C. E. Ho, W. Z. Hsieh, C. H. Yang, T. C. Yeh, and T. T. Kuo |
Journal of Electronic Materials
|
| 2015-01 |
技術報告
|
由焊接角度剖析各式銅表面處理技術的可靠度-Au/Pd(P)/Cu (直接鈀金) (II) |
葉庭均, 謝宛蓁, 郭蔡同, 洪暉程, 何政恩 |
|
| 2014-12 |
期刊論文
|
Theoretical and Experimental Determination of Cu Diffusivity in Eutectic Sn-Ag System at 235–280 °C |
C. E. Ho, W. Z. Hsieh, C. S. Liu, and C. H. Yang |
Thin Solid Films
|
| 2014-11 |
期刊論文
|
Electron Backscatter Diffraction Analysis on the Microstructures of Electrolytic Cu Deposition in the Through Hole Filling Process: Butterfly Deposition Mode |
C. E. Ho, W. Z. Hsieh, C. C. Chen, and M. K. Lu |
Surface and Coatings Technology
|
| 2014-11 |
期刊論文
|
Pronounced Effects of Ni(P) Thickness on the Interfacial Reaction and High Impact Resistance of the Solder/Au/Pd(P)/Ni(P)/Cu Reactive System |
C. E. Ho, C. W. Fan, and W. Z. Hsieh |
Surface and Coatings Technology
|
| 2014-10 |
研討會論文
|
Correlation between Ni(P) Depletion and IMCs Formation in Microelectronic Solder Joints with A Submicron Ni(P) Surface Finish |
W. Z. Hsieh, T. H. Yang, W. H. Wu, Y. W. Lee, and C. E. Ho |
|
| 2014-10 |
研討會論文
|
Unusual Cu Depletion in Line-bump Solder Joints under Current Stressing |
C. E. Ho, C. H. Yang, W. Z. Hsieh, and B. Z. Chen |
|
| 2014-04 |
技術報告
|
由焊接角度剖析各式銅表面處理技術的可靠度--Au/Pd/Ni(P)及Au/Pd(P)/Ni(P)(ENEPIG) |
謝宛蓁, 林彥辰, 吳昱輝, 何政恩 |
|
| 2014-03 |
期刊論文
|
利用EBSD分析通孔填充之各階段的電鍍銅微結構：蝴蝶沉積模式 |
陳昶志, 呂名凱, 謝宛蓁, 許令煌, 何政恩 |
鑛冶(Mining & Metallurgy)
|
主要學歷