| Date of Publication |
Category |
Title |
Author |
Source |
| 2023-12 |
研討會論文
|
Stress analysis of offshore wind turbine jacket substructures under environmental loads in the sea area adjacent to Taiwan |
Wahyu Putra Aji, Ian Hu |
|
| 2023-11 |
研討會論文
|
多晶片封裝熱網路模型之領域知識輔助高效率萃取方法 |
郭餘之，楊天祥，胡逸群 |
|
| 2023-11 |
研討會論文
|
機器學習演算法在電子封裝產品熱特性預測中的應用與評估 |
林瑋澤，胡逸群 |
|
| 2023-11 |
研討會論文
|
覆晶封裝模製底部填充製程中氣體包封形成之研究 |
洪子鈞，胡逸群 |
|
| 2023-09 |
研討會論文
|
The Influence of the Stamping Parameters on the Warpage of Leadframe |
Heng-Sheng Lin, Wen-Hsiung Hsieh, Ian Hu, Deng-Shun Zhang |
|
| 2022-12 |
研討會論文
|
隨機森林演算法於電子封裝熱特性分析之研究 |
胡逸群, 洪子鈞 |
|
| 2022-11 |
研討會論文
|
Encapsulating Void Risk Assessment of System in Package using Mold Flow Simulation with Random Forest |
Ian Hu, Chun-Che Wang, Jia-Hao Chang, Wei-Zhong Zeng, Keng-Chia Chen, Yen-Po Wu |
|
| 2022-11 |
研討會論文
|
基於最佳化方法與數值模擬之電子封裝熱網路模型萃取研究 |
郭餘之, 楊天祥, 胡逸群 |
|
| 2022-11 |
研討會論文
|
考慮有效熟化收縮對電子封裝翹曲之影響 |
胡逸群, 黃乙容 |
|
| 2021-11 |
期刊論文
|
Epoxy Molding Compound Filler Clogging Simulation during Integrated Circuit Encapsulation Process |
Bo-Heng Chen, Sheng-Jye Hwang, Yu-Yang Chang, Yu-Shuo Yang, Huei-Huang Lee, Bing-Yuan Huang, Ian Hu, Dao-Long Chen, David Tarng, CP Hung |
IEEE Transactions on Components, Packaging and Manufacturing Technology
|
| 2021-04 |
研討會論文
|
Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G Application |
Hung-Hsien Huang, Wei-Hong Lai, Ian Hu, JimDL Chen, David Tarng, CP Hung |
|
| 2020-10 |
研討會論文
|
Compression molding mechanism and parameter evaluation of SiP |
YiXuan Lin, Ian Hu, Dao-Long Chen, David Tarng, CP Hung |
|
| 2020-10 |
研討會論文
|
Design for void free transfer molding SiP |
Bing-Yuan Huang, Ian Hu, Dao-Long Chen, David Tarng, CP Hung |
|
| 2020-10 |
研討會論文
|
System thermal analysis of RF SiP module in smartphone |
Cheng-Yu Tsai, HE Chen, Ian Hu, Dao-Long Chen, David Tarng, CP Hung |
|
| 2020-10 |
研討會論文
|
The application of reverse engineering method on compact thermal model extraction |
Lev Tseng, Penny Yang, Clay Hsiao, Ian Hu, HC Liu |
|
| 2020-07 |
研討會論文
|
Development of ultra-thin thermal ground plane with high performance electroplated wick |
Ian Hu, Hung-Hsien Huang, Po-Cheng Huang, Jui-Cheng Yu, Chien-Neng Liao, Meng-Kai Shih, David Tarng, CP Hung |
|
| 2020-06 |
研討會論文
|
A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last |
Wei-Hong Lai, Penny Yang, Ian Hu, Tse-Wei Liao, KarenYU Chen, David Tarng, CP Hung |
|
| 2019-12 |
研討會論文
|
High power large size HFCBGA thermal characterization |
Ian Hu, Jung-Che Tsai, Frank Cheng, Shiu-Fan Yen, Meng-Kai Shih, David Tarng, Benjamin Pai, CP Hung |
|
| 2019-08 |
研討會論文
|
Transient thermal resistance analysis for IC packages |
Hsin-En Chen, Penny Yang, Ian Hu, Meng-Kai Shih, David Tarng, CP Hung |
|
| 2019-05 |
研討會論文
|
Material and structure design optimization for panel-level fan-out packaging |
Dao-Long Chen, Ian Hu, KarenYU Chen, Meng-Kai Shih, David Tarng, Dinos Huang, JY On |
|
| 2018-10 |
研討會論文
|
Thin core substrate large size FCBGA stress and thermal challenges and characterization |
PoHsien Sung, Ian Hu, Penny Yang, Avis Feng, Shouyi Chinm MengKai Shih, David Tarng, Marwan Wang, CP Hung |
|
| 2018-06 |
研討會論文
|
Substrate shrinkage effect on warpage evaluation for high bandwidth package on package |
Ming-Han Wang, Ian Hu, Charles Tsai, Amigo Shao, Meng-Kai Shih, David Tarng, CP Hung |
|
| 2018-05 |
研討會論文
|
Comparative study on mechanical and thermal performance of eWLB, M-series and fan-out chip last |
Meng-Kai Shih, Ryan Chen, PeterBS Chen, Ian Hu, Tang-Yuan Chen, Xin-Lu Tang, Chih-Pin Hung |
|
| 2018-03 |
研討會論文
|
Panel chip last fan-out warpage analysis and design strategy |
Ian Hu, Pohsien Sung, CJ Chuang, Meng-Kai Shih, David Tarng, Dinos Huang, JY On, CP Hung |
|
| 2017-12 |
研討會論文
|
Strip warpage assessment of dual side molding SiP module |
Ming-Han Wang, Ian Hu, RichardYC Chen, Chan-Lin Yeh, Meng-Kai Shih, David Tarng |
|
| 2017-11 |
研討會論文
|
New / Old JEDEC board level drop reliability test standards evaluation: Measurement and simulation study |
Ryan Chen, Ming-Han Wang, Sarah Lee, Janae Ho, Ian Hu, Sean Shih |
|
| 2017-10 |
研討會論文
|
Board level reliability of molded flip chip package with different lead count |
Chalres Tsai, Ian Hu, Pohsien Sung, Ying-Chih Lee, Ming-Han Wang, Meng-Kai Shih, David Tarng |
|
| 2017-10 |
研討會論文
|
The control of interfacial gap induced by warpage on PoP device |
Shaw Yen, Ming-Han Wang, Ian Hu, Meng-Kai Shih, David Tarng |
|
| 2017-08 |
研討會論文
|
Investigation of design and material optimization on high bandwidth package on package |
Ian Hu, Wei-Hong Lai, and Ming-Han Wang |
|
| 2017-05 |
研討會論文
|
Fan-out chip on substrate device interconnection reliability analysis |
Y.C. Lee, W.H. Lai, Ian Hu, M.K. Shih, C.L. Kao, David Tarng, C.P. Hung |
|
| 2017-05 |
研討會論文
|
High thermal performance package with anisotropic thermal conductive material |
Ian Hu, Jia-Rung Ho, Jin-Feng Yang, Meng-Kai Shih, David Tarng, Chih-Pin Hung |
|
| 2017-05 |
研討會論文
|
Warpage characterization of glass interposer package development |
Meng-Kai Shih, Charles Hsu, Yungshun Chang, KarenYU Chen, Ian Hu, Teck Lee, David Tarng, CP Hung |
|
| 2016-10 |
研討會論文
|
Deformation prediction of 2.5D IC package |
Ian Hu, M.H. Wang, Karen Chen, Y.C. Lee, M.K. Shih |
|
| 2016-10 |
研討會論文
|
Novel design for high thermal performance and SMT process yield QFP |
Ian Hu, PC Liu |
|
| 2016-08 |
研討會論文
|
Dynamic stiffness analysis of repetitive control and applied to advanced warpage metrology analyzer |
Wu-Sung Yao, Ian Hu, Golden Kao, Mengkai Shih, Karen Chen |
|
| 2015-10 |
研討會論文
|
Mechanics modeling of eMUF FC BGA molding process for bump deformation control |
Ian Hu |
|
| 2015-10 |
研討會論文
|
Performance and reliability of TIM in high power HFCBGA |
Ian Hu, MengKai Shih, Golden Kao |
|
| 2011-03 |
期刊論文
|
Synergetic effects of wafer rigidity and retaining-ring parameters on contact stress uniformity in chemical mechanical planarization |
Ian Hu, Tian-Shiang Yang, Kuo-Shen Chen |
The International Journal of Advanced Manufacturing Technology
|
| 2010-08 |
期刊論文
|
Effects of Wafer Carrier Design on Contact Stress Uniformity in CMP |
Ian Hu, Tian-Shiang Yang, Kuo-Shen Chen
|
Advanced Materials Research
|
| 2009-10 |
期刊論文
|
Effects of retaining ring on contact stress uniformity in chemical mechanical planarization |
Tian-Shiang Yang, Ian Hu, Kuo-Shen Chen, Chia-Liang Liu, Yao-Chen Wang |
Journal of the Chinese Society of Mechanical Engineers
|
| 2009-06 |
期刊論文
|
Asymptotic analysis of a two-step input-shaping scheme for suppressing motion-induced residual vibration of nonlinear mechanical systems |
Tian-Shiang Yang, Hsien-Tang Kao, Ian Hu |
Journal of Engineering Mathematics
|
| 2008-11 |
研討會論文
|
Optimization of wafer-back pressure profile in chemical mechanical planarization |
T.-S. Yang, Y.-C. Wang, Ian Hu |
|
| 2006-08 |
期刊論文
|
Suppression of motion-induced residual longitudinal vibration of an elastic rod by input shaping |
Tian-Shiang Yang, Kuo-Shen Chen, C.-C. Lee & Ian Hu |
Journal of Engineering Mathematics
|
Chief educational attainment