研究人才詳細資料
主要學歷
| 出版年月 | 著作類別 | 著作名稱 | 作者 | 收錄出處 |
|---|---|---|---|---|
| 2023-06 | 期刊論文 | Enhancing Sustainability in Belize’s Ecotourism Sector: A Fuzzy Delphi and Fuzzy DEMATEL Investigation of Key Indicators. | Ruano M, Huang C. Y., Nguyen P. H., Nguyen L. AT., Le H. Q., Tran L. C. | Mathematics |
| 2023-05 | 期刊論文 | Neutrosophic Autocratic Multi-Attribute Decision-Making Strategies for Building Material Supplier Selection | Nafei, A., Huang, C. Y., Chen, S. C., Huo, K. Z., Lin, Y. C., & Nasseri, H. | Buildings |
| 2023-04 | 期刊論文 | An optimized model for neutrosophic multi-choice goal programming | Nafei, A., Huang, C. Y., Azimi, S. M., & Javadpour, A. | Miskolc Mathematical Notes |
| 2023-04 | 期刊論文 | Bitcoin volatility forecasting: An artificial differential equation neural network. | Azizi, S. P., Huang, C. Y., Chen, T. A., Chen, S. C., & Nafei, A. | AIMS Mathematics |
| 2023-03 | 期刊論文 | A Novel Approach to Service Design within the Tourism Industry: Creating a Travel Package with AHP-TRIZ Integration | Ruano, M.; Huang, C.-Y. | Systems |
| 2023-01 | 期刊論文 | A Novel CSAHP Approach to Assess the Priority of Maintenance Work Outsourced by a Metro Company | Peng, S. N., Huang, C. Y., & Liu, H. D. | Processes |
| 2022-12 | 期刊論文 | An Optimized Method for Solving Membership-based eutrosophic Linear Programming Problems | Nafei, A., Huang, C. Y., Azizi, S. P., & Chen, S. C. | Studies in Informatics and Control |
| 2022-08 | 期刊論文 | 5G Digital Twin: A Study of Enabling Technologies | Ramirez, R., Huang, C. Y., & Liang, S. H. | Applied Sciences |
| 2022-04 | 期刊論文 | A Lean Manufacturing Progress Model and Implementation for SMEs in the Metal Products Industry | Huang, C. Y., Lee, D., Chen, S. C., & Tang, W | Processes |
| 2022-02 | 期刊論文 | Applying Deep Learning to Construct a Defect Detection System for Ceramic Substrates | Huang, C. Y., Lin, I. C., & Liu, Y. L. | Applied Sciences |
| 2022-01 | 期刊論文 | Applying Taguchi Method to Optimize Vacuum Printing Encapsulation Process | Huang, C. Y., Shen, L. C., Chan, C. J. & Wang, C. H. | IEEE Transactions on components, packaging and manufacturing technology |
| 2021-11 | 期刊論文 | Evaluating the Sustainable Operating Performance of Electronics Industry Groups: Taiwanese Firms in Mainland China | Chen, S. C, Lee, D. S, Huang, C. Y. | Sustainability |
| 2021-09 | 期刊論文 | Design criteria for pad and stencil with high pick-and-Place yield | Huang, C. Y., Greene, C., Chan, C. C., & Wang, P. S | Soldering & Surface Mount Technology |
| 2021-09 | 期刊論文 | Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network | Chen, C. H, Huang, C. Y, Huang, Y. C | Microelectronics International |
| 2021-07 | 期刊論文 | A Practice of BLE RSSI Measurement for Indoor Positioning | Ramirez, R, Huang, C. Y, Liao, C. A, Lin, P. T, Lin, H. W, Liang, S.H | Sensors |
| 2021-07 | 期刊論文 | Parameter Optimization of Pretin Printing Process of Wireless Communication Module | Huang, C. Y, Shen, L. C, Greene, C, Yang, C. C | IEEE Transactions on Components |
| 2021-04 | 期刊論文 | A machine learning-based framework for exchange rate analysis and prediction | Huang, C. Y, Ruano, M, Herrera, M. T. E, Rodas, R. N. P. | International Journal of Production Research |
| 2020-09 | 期刊論文 | Application of multi-quality parameter design in the optimization of underfilling process | Huang, C. Y, Shen, L. C. | Soldering & Surface Mount Technology |
| 2020-01 | 期刊論文 | Failed Component Image Acquisition Quality Optimization For Machine Vision System | Huang, C. Y, Wang, P.J. | Journal of Current Trends in Signal Processing |
| 2019-06 | 期刊論文 | Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process | Huang, CY and Ying, KC | Journal of Intelligent Manufacturing |
| 2019-03 | 期刊論文 | A digital image processing model for characteristics capture and analysis of irregular electronic components | Huang, C.Y, Wu J.Y, and Huang, E | The International Journal of Advanced Manufacturing Technology |
| 2018-03 | 期刊論文 | Decreasing the System Testing Makespan in a Computer Manufacturing Company | Lin, SW, Huang, CY, Ying, KC and, Chen DL | IEEE Access |
| 2018-02 | 期刊論文 | Applying Multivariate Analysis to Analyze and Improve Component Rejection by Pick and Place Machines | Huang, CY | International Journal of Advanced Manufacturing Technology |
| 2018-01 | 期刊論文 | Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process | Huang, CY and Ying, KC | Journal of Intelligent Manufacturing |
| 2017-11 | 期刊論文 | Applying Strain Gauges to Measuring Thermal Warpage of Printed Circuit Boards | Huang, CY and, Ying, KC | Measurement |
| 2017-08 | 期刊論文 | Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components | Huang, CY | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 2017-05 | 期刊論文 | Improve Electromagnetic Interference of Electronic Products with Taguchi Parametric Design | Chen, CH and Huang, CY | Measurement |
| 2017-05 | 研討會論文 | Application of TRIZ Theory to Solving Problems in Product Research and Development - Case Study of Probe Card Tester | Huang CY, Jan TJ, Yang CC, Wu CC | |
| 2017-01 | 期刊論文 | Improve Electromagnetic Compatibility of Electronic Products with Multivariate Parametric Design—a Case with Panel PC | Huang, CY and Chen, CH | Microelectronics International |
| 2016-12 | 研討會論文 | Encapsulation Process Study and Yield Model for Smart Phone Manufacturing | Li SH, Huang CY, Wu GD | |
| 2016-10 | 期刊論文 | Dynamic Parametric Design and Feasibility Assessment for a High Resistance Measuring System | Huang, CY and, Ying, KC | Measurement |
| 2016-04 | 研討會論文 | Integration of Kano Model and QFD for Service Quality Improvement | Huang CY and Chiara C | |
| 2016-02 | 期刊論文 | A grey-ANN approach for optimizing the QFN component assembly process for smart phone application | Huang, CY, Chen, CH and Lin, YH | Soldering & Surface Mount Technology |
| 2015-06 | 期刊論文 | The synergy of QFD and TRIZ for solving EMC problems in electrical products-A case study for the Notebook PC | Chen, CH, Huang, CY | Journal of Industrial and Production Engineering |
| 2015-05 | 研討會論文 | Lifetime Assessment of Cloud Service Products Based on RMA Data – Taking KVM Switch as an Example | Huang CY, Ku C.T | |
| 2015-03 | 期刊論文 | Developing a rework process for underfilled electronics components via integration of TRIZ and cluster analysis | Huang CY, Lin YH and Tsai PF | IEEE Transactions on Components Packaging and Manufacturing Technology |
| 2015-02 | 期刊論文 | An innovative bamboo film inspired by workout and TRIZ | Chang MT, Huang, CY | Journal of Industrial and Production Engineering |
| 2015-02 | 期刊論文 | Applying TRIZ Methodology to Develop the Probe Card Tester in Semiconductor Manufacturing | Huang, CY, Jan, TJ and Wu, CC |
國際系統性創新期刊 Int. J. Systematic Innovation |
| 2015-02 | 期刊論文 | Innovative parametric design for environmentally conscious adhesive dispensing process | Huang, CY | Journal of Intelligent Manufacturing |
| 2015-01 | 研討會論文 | 整合TRIZ發明原則與演化趨勢於產品研發之問題解決-以電子防潮櫃為例 | 周依穎, 黃乾怡 | |
| 2015-01 | 研討會論文 | 運用TRIZ於電子元件重工製程研發 | 廖品柔, 黃乾怡 | |
| 2014-11 | 研討會論文 | An Integrated Approach of Kano Model, Importance-Performance Analysis and TRIZ Inventive Principles for Improving the Education Quality | Damdinsuren, T, Huang, CY, Salamanca, E and Aguilera, O | |
| 2014-11 | 研討會論文 | Systematic Innovations for Optimization of Distribution Center Operations – Example of Russian Post | Prannik, A, Huang, CY., Gonzalez, J | |
| 2014-11 | 研討會論文 | Systematic Innovations for Optimization of Distribution Center Operations – Example of Russian Post. | Prannik, A, Huang, CY and Gonzalez, J | |
| 2014-10 | 期刊論文 | A study on introducing supplier process capacity database into tolerance design. | Mu-Tsai Chang and Chien-Yi Huang | Journal of Industrial and Production Engineering |
| 2014-09 | 期刊論文 | Systematic Innovation for the Retention and Development of Human Talent | Huang, CY, and Abrego, R | Int. J. Systematic Innovation |
| 2014-08 | 期刊論文 | Parametric design of the adhesive dispensing process with multiple quality characteristics | Huang, CY, Palacios, C, Hong, ZS, Chen, CH | Journal of Quality |
| 2014-07 | 期刊論文 | Process optimization of SnCuNi soldering material using artificial parametric design | Huang, CY and Huang Huang, HH | Journal of Intelligent Manufacturing |
| 2013-12 | 期刊論文 | DOM Products: Activation Energy Estimation and Reliability Assessment”, Applied Mechanics and Materials | Huang, CY, Lin, YH and Huang, E | Applied Mechanics and Materials |
| 2013-10 | 研討會論文 | DOM Products: Activation Energy Estimation and Reliability Assessment | Huang, CY, Lin, YH and Huang, E | |
| 2013-09 | 期刊論文 | Package-on-package assembly yield assessment in the ODM/EMS environment using Monte Carlo simulation | Huang, CY | IEEE Transactions on Components, Packaging and Manufacturing Technolog |
| 2013-07 | 研討會論文 | The parametric design of adhesive dispensing process with multiple quality characteristics | Palacios C, Gradiz, O and Huang, CY | |
| 2013-06 | 專書 | Materials Science | Huang, CY, Ku, CL, Hsieh, HC, Li, MS, Lee, CH, Chang, CI, | InTech - Open Access |
| 2013-06 | 研討會論文 | Systematic innovation for the retention and development of human talent | Abrego, R and Huang, CY | |
| 2013-03 | 期刊論文 | Minimizing makespan in distributed permutation flowshops using a modified iterated greedy algorithm | Lin, SW, Ying, KC, Huang, CY | International Journal of Production Research |
| 2013-01 | 研討會論文 | Applying TRIZ methodology to innovate the current bicycle parking system | 魏維德，麥立妲，黃乾怡 | |
| 2012-11 | 期刊論文 | Applying CHAID algorithm to investigate critical attributes of void formation in QFN assembly | Huang, CY, Lin, YH | Soldering & Surface Mount Technology |
| 2012-11 | 期刊論文 | Intelligent Parametric Design for a Robust LED Encapsulation Process | Huang, CY | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 2012-10 | 研討會論文 | Re-designing a green vehicle using nanotech based on TRIZ/AD methodology | Pierre-Paul, F, Lin, YH, Huang, CY | |
| 2012-09 | 期刊論文 | A breakthrough product R&D model by using the integration of four-phase QFDs and TRIZ | Yeh, CH, Huang, CY, Wu, F. C. | International Journal of Modelling, Identification and Control |
| 2012-08 | 期刊論文 | Minimizing total flow time in permutation flowshop environment | Lin, SW, Huang, CY, Lu CC and Ying, KC | International Journal of Innovative Computing, Information and Control |
| 2012-08 | 期刊論文 | Reliability assessment of RFID reader through prognostics and health management | Huang, CY | Microelectronics Reliability |
| 2012-07 | 研討會論文 | Innovative design process for intelligent patient bed by using synergy of TRIZ and QFDs methods | Hu, CM, Yeh, CH, Huang, Jay CY | |
| 2012-07 | 研討會論文 | Rework process development for an encapsulated device through the TRIZ approach | Hsieh, HC, Ku, CL, Liao, PJ, Huang, CY | |
| 2012-06 | 期刊論文 | Innovative Design Process for Intelligent Patient Bed by Using Synergy TRIZ and QFDs | Hu, CM, Yeh, CH, Huang, Jay CY | Advanced Materials Research |
| 2012-05 | 研討會論文 | 環保點膠製程研發與創新參數設計 | 彭晟輔，黃滙華，黃乾怡 | |
| 2012-04 | 期刊論文 | Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis | Huang, CY, Huang, HH, and Ying, KC | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 2012-03 | 研討會論文 | An innovative design for high performance control valve by using the synergy of QFD and TRIZ methods | Hu, CM, Yeh, CH, Huang, Jay CY | |
| 2012-02 | 期刊論文 | An innovative design for high performance control valve by using the synergy of QFD and TRIZ methods | Hu, CM, Yeh, CH, Huang, Jay CY | Advanced Materials Research |
| 2012-01 | 研討會論文 | 應用TRIZ方法改善點膠製程中剩餘膠量之檢測及警訊 | 王致達，林岳勳，黃乾怡 | |
| 2011-11 | 期刊論文 | Minimizing total flow time in permutation flowshop environment | Lin, SW, Huang, CY, Lu CC and Ying, KC | International Journal of Innovative Computing, Information and Control |
| 2011-11 | 研討會論文 | RFID讀取器於高溫試驗與正常使用條件下之可靠度分析 | 劉澄昇，陳佩君，劉台華，陳凱瀛，黃乾怡，許盟昌 | |
| 2011-11 | 研討會論文 | The Characterization and Simulation of Reflow Temperature Profile | Tseng, JH, Ku, CL, and Huang, CY | |
| 2011-10 | 研討會論文 | 塑膠封裝材料之黏度模型建立及製程參數設計 | 廖國棟，林岳勳，黃乾怡 | |
| 2011-09 | 期刊論文 | The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction | Huang, CY, Lin, YH, Ying, KC, Ku, CL | Soldering & Surface Mount Technology |
| 2011-07 | 期刊論文 | Comparison of results from empirical ALT test to CAE simulation for wireless clients | Huang, CY, Huang, HH | Microelectronics International |
| 2011-07 | 專書 | Wide Spectra of Quality Control | Huang, CY, Li, MS | InTech - Open Access, Austria |
| 2011-06 | 期刊論文 | Integration of Four-phase QFD and TRIZ in Product R&D – A Notebook Case Study | Yeh, CH, Huang, Jay CY, Yu, CK | Research in Engineering Design |
| 2011-06 | 研討會論文 | A Breakthrough Product R&D Process by Using Four-phase QFDs and TRIZ Integration | Yeh, CH, Wu, FC, and Huang, CY, | |
| 2011-03 | 研討會論文 | Using the Monte Carlo Simulation to predict the Assembly Yield | Chahin, C, Hsu, MC, Lin, YH, and Huang, CY, | |
| 2010-12 | 研討會論文 | 以蒙地卡羅模擬評估型 I 設限預測模型並評估保固風險-以DOM產品為例 | 賴禹廷，許盟昌，林岳勳，黃乾怡 | |
| 2010-10 | 期刊論文 | Reducing Solder Paste Inspection in Surface Mount Assembly through Mahalanobis-Taguchi Analysis | Huang, CY | IEEE Transactions on Electronics Packaging Manufacturing |
| 2010-10 | 研討會論文 | Failure Analysis of ENIG Surface Finish Pad | Yang, J, Huang, CY, Huang, M, Ku, JL, Hsieh, A, Li, KC | |
| 2010-10 | 研討會論文 | Reliability Assessment of the PoP Lead Free Solder Joint through Temperature Cycling Test | Yang, J, Huang, CY, Li, KC, Ku, JL, Lee, A | |
| 2010-10 | 研討會論文 | Stencil Evaluation of Ultra Fine Pitch Solder Paste Printing Process | Yang, J, Huang, CY, Li, Lee, V, Tsai, J, Ku, JL, Li, KC, Hsieh, A, Cheng, YC | |
| 2010-07 | 研討會論文 | 錫銅鎳環保銲料電子組裝製程分析 | 黃匯華，李公正，吳至明，黃乾怡 | |
| 2010-05 | 期刊論文 | A Wavelet-Based Approach in Detecting Visual Defects on Semiconductor Wafer Dies | Yeh, CH, Wu, FC, Ji, WL, Huang, CY | IEEE Transactions on Semiconductor Manufacturing |
| 2009-11 | 研討會論文 | 應用智慧型參數設計法於錫膏印刷製程參數優化 | 呂祐全，黃乾怡，黃匯華 | |
| 2009-10 | 研討會論文 | The Evaluation of Assembly Process for Package on Package Components | Huang CY, Li KC, Ku JL, Lee Andrew | |
| 2009-08 | 期刊論文 | Chemical Characterzation Of Failures And Process Materials For Microelectronics Assembly | Huang, CY, Li , MS, Ku, CL, Hsieh, HC, | Microelectronics International |
| 2009-07 | 研討會論文 | Reliability Assessment for Printed Circuit Board In Lead-Free Process | Huang CY, Ku CL, Hsieh HC, Chien TM, Huang HH | |
| 2009-06 | 期刊論文 | 應用資料包絡分析法(DEA)於六標準差專案之績效評估 | 黃乾怡，蔡明峰，黃匯華 | 技術學刊 |
| 2009-04 | 期刊論文 | Sequencing Single-machine Tardiness Problems with Sequence Dependent Setup Times Using an Iterated Greedy heuristic | Kuo-Ching Ying, Shih-Wei Lin, Chien-Yi Huang | Expert Systems With Applications |
| 2008-10 | 研討會論文 | Investigate the Performance of SnCuNi Alloy for Wave Soldering | K. C. Li, Jay C.Y. Huang, J. L. Ku, and Synger Lee | |
| 2008-03 | 研討會論文 | 運用同步工程改善新產品專案開發作業流程以Battery Pack 為例 | 林威旭，黃乾怡 | |
| 2007-11 | 期刊論文 | 無鉛製程電路板材料之發展與應用 | 黃乾怡，簡子旻 | 電子月刊 |
| 2007-04 | 研討會論文 | The Study of Mini-wave Soldering Process in Lead Free Assembly | Harvey Chang, Jay (CY) Huang, JL Ku, Ander Hsieh, Andrew Lee | |
| 2006-11 | 研討會論文 | 0603被動元件推力試驗之再現性與再生性分析 | 呂祐全，簡子旻，黃乾怡 | |
| 2006-11 | 研討會論文 | DOM產品可靠度試驗 | 衛志鋼，黃乾怡 | |
| 2006-11 | 研討會論文 | 運用同步工程改善新產品專案開發作業流程以Battery Pack為例 | 林威旭，黃乾怡 | |
| 2006-11 | 研討會論文 | 運用實驗設計方法改善石英振盪器封裝製程之噴濺現象 | 黃意駒，黃乾怡 | |
| 2006-09 | 期刊論文 | 無鉛環保銲料鋼板印刷製程參數優化 | 黃乾怡,應國卿,蔡欣倫 | 技術學刊 |
| 2006-09 | 期刊論文 | 田口方法應用於無鉛迴銲製程參數優化 | 黃乾怡，林宜鋒，紀勝財，蘇彥衍 | 科學與工程技術期刊 |
| 2006-06 | 研討會論文 | The Optimization of Reflow Soldering Process for Lead Free Materials | Huang, CY, Liu, MH, Su, YY | |
| 2005-12 | 研討會論文 | Assembly Line Balancing of PCB Dual In-Line Packaging Line | Huang, CY, Lee, LY, Su, YY, Liu, MH | |
| 2004-12 | 研討會論文 | Study of Process Capability for The Stencil Printing in PCB Assembly | Huang, CY, Lin, CT, &Tsai, HL | |
| 2004-12 | 研討會論文 | The Use of SLP and Paired Exchange Methods for Facility Layout in The Notebook Computer Production Plant | Huang, CY, Yang, DJ | |
| 2004-11 | 研討會論文 | 底填封膠製程參數優化研究 | 黃乾怡，陳重任 | |
| 2004-11 | 研討會論文 | 運用美國商規Bellcore評估電子產品可靠度－以數位相機為例 | 黃乾怡，李耕州 | |
| 2004-07 | 期刊論文 | IC元件X、Y平面及Z方向置放良率分析 | 黃乾怡 | 中國工業工程學會學刊 |
| 2004-05 | 研討會論文 | 運用SLP與成對交換法於筆記型電腦生產設施佈置 | 楊敦傑，黃乾怡 | |
| 2004- | 期刊論文 | The Reliability Assessment of Flip Chip Component | 黃乾怡 | Microelectronics International |
| 2003-12 | 研討會論文 | 運用模糊理論建構電子產品之FMEA評點系統 | 黃乾怡，何鎮宙 | |
| 2003-11 | 研討會論文 | 筆記型電腦試產流程規劃暨量產分析 | 黃乾怡，黃匯華 | |
| 2003-11 | 研討會論文 | 鋼板印刷製程能力分析 | 黃乾怡，許棟樑，林俊德，蔡欣倫 | |
| 2002-12 | 研討會論文 | The Reliability Test Plan for The Disk on Module | Huang, CY, Hwang, S-H, & Liu, T-C | |
| 2002-11 | 期刊論文 | 以實驗設計改善筆記型電腦PCB設計與組裝 | 黃乾怡 | 中國工業工程學會學刊 |
| 2002-11 | 研討會論文 | DOM產品可靠度試驗計劃之研究 | 黃乾怡，黃蘇豪，劉大昌 | |
| 2002-11 | 研討會論文 | 利用Relex軟體預估電子產品可靠度－以DOM為例 | 黃乾怡，陳重任，李耕洲，劉大昌 | |
| 2002-10 | 研討會論文 | CF卡生產流程瓶頸分析 | 黃乾怡，楊敦傑 | |
| 2002-06 | 研討會論文 | PCB手擺件之工作指派研究 | 黃乾怡，李藍怡 | |
| 2002-06 | 研討會論文 | 無鉛銲料特性評估與製程分析 | 黃乾怡，黃匯華，George Westby | |
| 2002- | 期刊論文 | The Investigation of The Capillary Flow of Underfill Materials | 黃乾怡 | Microelectronics International |
| 2001-12 | 研討會論文 | SMT製程研發策略與方法 | 黃乾怡，林俊仁 | |
| 2001-12 | 研討會論文 | 晶粒尺寸封裝元件拉力試驗與破壞模式分析 | 黃乾怡，林四中 | |
| 2001-12 | 研討會論文 | 運用剖面X-ray技術於銲點品質檢測之可行性分析 | 林俊仁，許棟樑，黃乾怡 | |
| 2001-11 | 研討會論文 | The Study of Failure Mechanism and Chip Warpage for DCA Components | Huang, CY, Lin, J.R, Srihari, K, | |
| 2001-06 | 研討會論文 | 混載PCB組裝製程插件良率分析與參數設計 | 林俊仁，黃乾怡 | |
| 2001-05 | 研討會論文 | 置換電子構裝製程之成本因子分析與評估 | 林俊仁，黃乾怡 | |
| 2000-12 | 研討會論文 | Simulation Modeling for the Accuracy of Placement for Electronic Devices | Huang, CY., Srihari, K., & Pohan Lee | |
| 2000-08 | 研討會論文 | The Study of Defects in the Flip Chip Encapsulation Process | Huang, CY., Srihari, K., & Borgesen, P. | |
| 2000--- | 期刊論文 | Optimization of The Substrate Preheat Temperature for the Encapsulation of Flip Chip Devices | 黃乾怡 | The International Journal of Advanced Manufacturing Technology |
| 1999-11 | 研討會論文 | The Optimization of Underfill Dispensing Process in Flip Chip Assembly | Huang, CY., Srihari, K., & Borgesen, P. | |
| 1999-06 | 研討會論文 | 品管手法運用於先進電子組裝技術 | 黃乾怡，許晉國，張聰耀 | |
| 1998-12 | 研討會論文 | An Experimental Approach to Optimize Substrate Preheat Temperature in Flip Chip Assembly | Huang, CY., Srihari, K., & Borgesen, P. | |
| 1998-12 | 研討會論文 | 覆晶元件封裝製程中基板預熱溫度之優化實驗 | 黃乾怡，高正翰 | |
| 1998-04 | 研討會論文 | The Competing Technology – Flip Chip Assembly | Huang, CY | |
| 1996-09 | 研討會論文 | Integration of Flip Chip Assembly With Surface Mount Technology | McLenaghan, A.J., & Huang, CY | |
| 1996-04 | 研討會論文 | Challenges in Flip Chip Assembly | Huang, CY, Srihari, K., Westby, G.R., & Borgesen, P. | |
| 1996-02 | 研討會論文 | The Wetting Balance in the Solderability Evaluation of Surface Mount Components | Huang, CY, Srihari, K., McLenaghan, A.J., & Westby, G.R. |