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| 出版年月 | 著作類別 | 著作名稱 | 作者 | 收錄出處 |
|---|---|---|---|---|
| 2019-12 | 期刊論文 | Large-Area Laying of Soft Textile Power Generators for the Realization of Body Heat Harvesting Clothing | Yao-Shing Chen and Ben-Je Lwo | Coatings |
| 2019-10 | 研討會論文 | Warpage Simulation on a Typical Fan-out Panel Level Package (FOPLP) Process with Glass Carrier | Wei-Chen Lo, Ben-Je Lwo, Hsien Chung, Tom Ni and Shirley Lu | |
| 2019-05 | 期刊論文 | Extracting Radio Frequency Properties of a Typical Through Silicon Via Structure with a Self-Developed De-Embedding Technique | Kun-Fu Tseng, Tzu-Yen Huang, Ben-Je Lwo, and Tom Ni | IEEE Transactions on Component, Packaging, and Manufacturing Technology |
| 2017-11 | 研討會論文 | Radio Frequency Properties for a Typical Through Silicon Via Structure | Kun-Fu Tseng, Tzu-Yen Huang, Tom Ni, Shirley Lu and Ben-Je Lwo | |
| 2017-10 | 研討會論文 | A Seebeck Coefficient Extraction Methodology for Thin Film Thermoelectric Devices with Different Substrates | Yao-Shing Chen and Ben-Je Lwo | |
| 2017-01 | 期刊論文 | Contact Resistance of Micro Bumps in a Typical Through Silicon Via Structure | Ben-Je Lwo, Chia-Liang Teng, Kun-Fu Tseng, Tom Ni, and Shirley Lu | IEEE Transactions on Component, Packaging, and Manufacturing Technology |
| 2016-10 | 研討會論文 | Performance Analyses on an Advanced High-power Diode Packaging Structures | Yong-Cheng Lu, Kuo-Hsin Huang, Ben-Je Lwo, Jeff Kao, Robert Lee, Harrison Chung and Tzu-Yen Huang | |
| 2016-09 | 研討會論文 | Contact Resistance of the Micro Bumps in a Typical TSV Structure | Ben-Je Lwo, Chia-Liang Teng, Tom Ni, and Shirley Lu | |
| 2016-06 | 期刊論文 | A Study on Electrical Reliability Criterion on TSV Packaging | Ben-Je Lwo, Kuo-Hao Tseng and Kun-Fu Tseng | Journal of Electronic Packaging, Transaction of the ASME |
| 2016-05 | 期刊論文 | Electrical Characterization and Reliability Test on TSV Structure for 3D Stack Packaging | Hsien Chung, Chung-Yen Ni, and Ben-Je Lwo |
中正嶺學報 Journal of Chung-Cheng Institute of Technology |
| 2016-04 | 研討會論文 | Thermal Humidity Reliability Criterions for a Typical TSV Device | Ben-Je Lwo, Kun-Fu Tseng, Chia-Liang Teng, Zi-Yan Huang and Kuo-Hao Tseng | |
| 2016-02 | 期刊論文 | Environmental Factors Affecting TSV Reliability | Ben-Je Lwo and Frank M.-S. Lin | IEEE Transactions on Component, Packaging, and Manufacturing Technology |
| 2015-10 | 研討會論文 | Measuring Seebeck Coefficient on Thin Film Thermoelectric Materials without Metallization Treatment | Yao-Shing Chen, Shih-Jue Lin, and Ben-Je Lwo | |
| 2014-11 | 期刊論文 | Development on Micrometer Scales Piezoresistive Sensors | Chia-Fa Chu, Kun-Fu Tseng, and Ben-Je Lwo |
中正嶺學報 Journal of Chung-Cheng Institute of Technology |
| 2014-10 | 研討會論文 | Mechanical Property Analyses on Power Diodes in a Typical 5W Adapter | Zhong-Yi Wu, Pei-Hsuan Wu, Annie Hu, Jeff. Kao, Robert Lee, Richard Chen, Harrison Chung, and Ben-Je Lwo | |
| 2014-05 | 研討會論文 | TSV Reliability Model under Various Stress Tests | Ben-Je Lwo, Frank, M.-S. Lin and Kuo-Hsin Huang | |
| 2013-10 | 研討會論文 | A Study on Size Reductions on Piezoresistive Sensors | Chia-Fa Chu, Ben-Je Lwo, Kun-Fu Tseng, and Hao-Chun Tang | |
| 2013-10 | 研討會論文 | Modeling of Through-Silicon-Via (TSV) RF Characterization in 3D Integration | Kun-Fu Tseng, Kun-Lin Wu, Jun-Han Liou, and Ben-Je Lwo | |
| 2013-10 | 研討會論文 | Thermal and Thermo-Mechanical Simulations on High Power Diode Packaging for a Typical Power Adapter | Pei-Hsuan Wu, Zhong-Yi Wu, Hao-Chun Tang, Annie Hu, Jeff. Kao, Robert Lee, Richard Chen, Harrison Chung, and Ben-Je Lwo | |
| 2013-07 | 期刊論文 | In-Situ Stress and Reliability Monitoring on Plastic Packaging Through Piezoresistive Stress Sensor | Yu-Yao Chang, Hsien Chung, Ben-Je Lwo, and Kun-Fu Tseng | IEEE Transactions on Component, Packaging, and Manufacturing Technology |
| 2013-04 | 研討會論文 | Reliability of a Typical TSV Structure with Thermal Bias | Ben-Je Lwo, Kuo-Hao Tseng, and Kun-Fu Tseng | |
| 2012-12 | 期刊論文 | A Complete Resistance Extraction Methodology and Circuit Modelsfor Typical TSV Structures | Hsien Chung, Che-Min Tu, Ben-Je Lwo, and Chih-Yuan Lee | International Journal of Electronics |
| 2012-12 | 期刊論文 | Parameter Calibrations on MOSFET Stress Sensors | Ren-Tzung Tan, Hsien Chung, Ben-Je Lwo, Chun-Pai Tang, and Kun-Fu Tseng | Journal of Electronic Packaging, Transaction of the ASME |
| 2012-10 | 研討會論文 | Thermal Simulation on Typical High Power Diode Packaging | Zhong-Yi Wu, Pei-Hsuan Wu, Tim Chiou, Richard Chen, Robert Lee, and Ben-Je Lwo | |
| 2012-05 | 期刊論文 | 皮秒超音波技術應用於鑲嵌式薄膜諧振器元件設計及改良 | 李大青、蒲念文、羅本喆、高進興、李鍾嵐 | 中正嶺學報 |
| 2012-05 | 研討會論文 | Reliability Analyses on a TSV Structure for CMOS Image Sensor | Ben-Je Lwo and Chung-Yen Ni | |
| 2011-12 | 研討會論文 | Electrical Models for a Typical TSV Design | Che-Min Tu, Kuo-Hao Tseng, Hsien Chung, Ben-Je Lwo, Chih-Yuan Lee, Ching-Yu Ni and Kun-Fu Tseng, | |
| 2010-10 | 研討會論文 | In-Situ Reliability Monitoring on PBGA Packaging Through Piezoresistive Sensor | Yu-Yao Chang, Hsien Chung, Ben-Je Lwo, Ren-Tzung Tan, and Kun-Fu Tseng | |
| 2010-10 | 研討會論文 | On the Study of Temperature Coefficient Extractions on MOSFET Sensors for Electronic Packaging | Chung-Yen Ni, Hsien Chung, Ren-Tzung Tan, Chun-Pai Tang, Kun-Fu Tseng, and Ben-Je Lwo | |
| 2010-06 | 研討會論文 | The Advanced Pattern Designs with Electrical Test Methodologies on Through Silicon Via for CMOS Image Sensor | Hsien Chung, et al., and Ben-Je Lwo | |
| 2009-09 | 期刊論文 | In-Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors | Ben-Je Lwo, Jeng-Shian Su, and Hsien Chung | Journal of Electronic Packaging, Transaction of the ASME |
| 2009-05 | 期刊論文 | 以溫控式校正系統評估MOSFET應力計特性 | 楊明奕、鍾賢、羅本喆、趙永清、曾昆福 | 中正嶺學報 |
| 2009-04 | 研討會論文 | A Reliability Test on PBGA Packaging Through Piezoresistive Stress Sensor, | Chih-Hung Liu, Hsien Chung, Der-Wei Yang, Kun-Fu Tseng, and Ben-Je Lwo | |
| 2007-08 | 期刊論文 | A Multifunctional Test Chip for Microelectronic Packaging and It’s Application on RF Property Measurements | Kun-Fu Tseng, Yi-Hsun Hsion, and Ben-Je Lwo | International Journal of Electronics |
| 2007-08 | 期刊論文 | Measurement of Moisture-Induced Packaging Stress with Piezoresistive Sensors | Ben-Je Lwo, and Chin-Shiang Li | IEEE Transactions on Advanced Packaging |
| 2006-12 | 期刊論文 | 皮秒超音波技術對奈米薄膜之聲速研究 | 李大青、蒲念文、羅本喆、高進興 | 中正嶺學報 |
| 2006-10 | 期刊論文 | The Effects of Nitrogen Partial Pressure on the Properties of the TaNx Films Deposited by Reactive Magnetron Sputtering | Ta-Ching Li, Ben-Je Lwo, Nen-Wen Pu, Shih-Piao Yu, and Chin-Hsing Kao | Surface and Coatings Technology |
| 2006-03 | 期刊論文 | TThe Effects of Oxygen Partial Pressure on the Acoustic Velocity in Zirconia Films Studied by Picosecond Ultrasonics | Ta-Ching Li, Nen-Wen Pu, Ben-Je Lwo, and Chin-Hsing Kao | Thin Solid Films |
| 2005-11 | 期刊論文 | Double-Transducer Structure for Picosecond Ultrasound Generation | Ta-Ching Li, Nen-Wen Pu, Ben-Je Lwo, Chin-Hsing Kao, and En-Yea Pan | Applied Physics Letter |
| 2003-06 | 期刊論文 | Calibrate Piezoresistive Stress Sensors Through the Assembled Structure | 羅本喆,吳勝郁 | Journal of Electronic Packaging, Transaction of the ASME |
| 2002-06 | 期刊論文 | In-Plane Packaging Stress Measurements Through Piezoresistive Sensors | 羅本喆,陳東昇, 高進興, 林玉翎 | Journal of Electronic Packaging, Transaction of the ASME |
| 2002-05 | 期刊論文 | 高轉速引信保險帶備位時間模擬分析 | 羅本喆,江立廷 | 中正嶺學報 |
| 2002-03 | 期刊論文 | On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging | 羅本*,高進興,陳東昇,陳耀星 | Journal of Electronic Packaging, Transaction of the ASME |