| 出版年月 |
著作類別 |
著作名稱 |
作者 |
收錄出處 |
| 2022-09 |
期刊論文
|
Moisture dependent degradation rate of silicone in LED optical housing material–ab-initio modelling |
Shabir Abdul, and Cher Ming Tan |
IEEE Transactions on Device and Materials Reliability
|
| 2022-09 |
專書
|
Reliability and Failure Analysis of High-Power LED Packaging |
Tan Cher Ming, Singh Preetpal |
|
| 2022-07 |
期刊論文
|
Atomic drift-less electromigration model for submicron copper interconnects |
Adhikari, Aparna, Arijit Roy, and Cher Ming Tan |
https://ymerdigital.com/
|
| 2022-05 |
期刊論文
|
Strong Correlation between the Dynamic Chemical State and Product Profile of Carbon Dioxide Electroreduction |
Jiali Wang, Hsiao-Chien Chen*, Hui-Ying Tan, Cher Ming Tan, Yanping Zhu, and Hao Ming Chen* |
ACS Applied Materials & Interfaces
|
| 2022-04 |
期刊論文
|
Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices |
Tan, Cher-Ming |
Applied Sciences
|
| 2022-03 |
期刊論文
|
Statistical distribution of Lithium-ion batteries useful life and its application for battery pack reliability |
Shuen-Lin Jeng, Cher Ming Tan, Ping-Chia Chen |
Journal of Energy Storage
|
| 2022-01 |
期刊論文
|
Root Cause Analysis of a Printed Circuit Board (PCB) Failure in a Public Transport Communication System |
Tan, C. M., Chen, H. H., Wu, J. P., Sangwan, V., Tsai, K. Y., & Huang, W. C |
Applied Sciences
|
| 2021-12 |
期刊論文
|
Degradation dynamics of quantum dots in white LED applications. |
Chen, H. C., Shabir, A., Tan, C. M., Singh, P., & Lin, J. H |
Scientific reports
|
| 2021-10 |
期刊論文
|
Electronic Reliability Analysis Under Radiation Environment |
Cher Ming Tan, Vimal Kant Pandey, Yueh Chiang, and Tsung Ping Lee |
Sensors and materials
|
| 2021-10 |
專書
|
Graphene and VLSI Interconnects |
Tan, Cher Ming, Udit Narula, Vivek Sangwan |
Jenny Stanford
|
| 2021-09 |
期刊論文
|
Effect of resistor tolerance on the performance of resistor network—An application of the statistical design of experiment |
Pandey, Vimal Kant, and Cher Ming Tan |
International Journal of Circuit Theory and Applications
|
| 2021-08 |
期刊論文
|
Impact of visible light and humidity on the stability of high-power light emitting diode packaging material. |
Shabir, Abdul, and Cher Ming Tan |
Journal of Applied Physics
|
| 2021-06 |
期刊論文
|
Application of Gallium Nitride Technology in Particle Therapy Imaging |
V. K. Pandey, C. M. Tan |
IEEE Transactions on Nuclear Science
|
| 2021-06 |
期刊論文
|
Effect of 150 MeV protons on carbon nanotubes for fabrication of a radiation detector |
Pandey, Vimal Kant, Cher Ming Tan, Sunjin Kim, Preetpal Singh, Vivek Sangwan, Jin-Woo Han, and M. Meyyappan |
Nanotechnology
|
| 2021-06 |
期刊論文
|
GaN‐Based Readout Circuit System for Reliable Prompt Gamma Imaging in Proton Therapy |
Pandey, Vimal Kant, Cher Ming Tan, and Sangwan, Vivek |
Applied Sciences
|
| 2021-02 |
期刊論文
|
Statistical Method and Non-Destructive Analytical Tools in the Failure Analysis of LED Array |
Preetpal Singh, Cher Ming Tan |
ECS Journal of Solid State Science and Technology
|
| 2021-01 |
期刊論文
|
Lineal Energy of Proton in Silicon by a Microdosimetry Simulation |
Yueh Chiang; Cher Ming Tan; Chuan-Jong Tung; Chung-Chi Lee; Tsi-Chian Chao |
Applied Sciences
|
| 2021-01 |
期刊論文
|
Root Cause Analysis of a Printed Circuit Board (PCB) Failure in a Public Transport Communication System |
Tan, C. M., Chen, H. H., Wu, J. P., Sangwan, V., Tsai, K. Y., & Huang, W. C |
Applied Sciences
|
| 2021-01 |
研討會論文
|
2021 International Conference on Sustainable Energy and Future Electric Transportation (SEFET) |
Loganathan MK, Cher Ming Tan, I-Yun Lisa Hsieh, Sahnin Sultana, Kumaraswamidhas L. A. and Rai R.N |
|
| 2020-11 |
期刊論文
|
Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage |
Sze Li Harry Lim, Duong Pham, Hyunseok park, Preetpal Singh, Cher Ming Tan and Nagarajan Raghavan |
Microelectronics Reliability
|
| 2020-09 |
期刊論文
|
Accurate Real Time On-Line Estimation of State-of-Health and Remaining Useful Life of Li ion Batteries. |
Tan, C.M.; Singh, P.; Chen, C. |
Applied Sciences 2020
|
| 2020-08 |
期刊論文
|
Analytical modeling electrical conduction in resistive-switching memory through current-limiting-friendly combination frameworks |
Qishen Wang; Karthekeyan Periasamy; Yi Fu2, Ya-Ting Chan2; Cher Ming Tan; Natasa Bajalovic; Jer-Chyi Wang; Desmond K. Loke |
AIP Advances
|
| 2020-08 |
期刊論文
|
In-situ Characterization of the Defect Density in Reduced Graphene Oxide under Electrical Stress Using Fluorescence Microscopy |
Zequn Zeng, Preetpal Singh, Sharon Lim Xiaodai, Cher Ming Tan and Chorng Haur Sow |
International Journal of Nanotechnology
|
| 2020-08 |
期刊論文
|
Multi-Criteria Decision Making (MCDM) for the selection of Li-Ion batteries used in Electric Vehicles (EVs) |
M.K.Loganathan, Bikash Mishra, Cher MingTan, TrondKongsvik, R.N.Rai |
Materials Today: Proceedings
|
| 2020-05 |
期刊論文
|
Investigate the Equivalence of Neutrons and Protons in Single Event Effects Testing: A Geant4 Study. |
Chiang, Y.; Tan, C.M.; Chao, T.-C.; Lee, C.-C.; Tung, C.-J. |
Appl. Sci. 2020
|
| 2020-04 |
期刊論文
|
Optimization of a T-Shaped MIMO Antenna for Reduction of EMI. |
Kapoor, D.; Sangwan, V.; Tan, C.M.; Paliwal, V.; Tanwar, N. |
Applied Sciences 2020
|
| 2020-01 |
期刊論文
|
Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits |
Dipesh Kapoor, Cher Ming Tan, and Vivek Sangwan |
Applied Sciences 10
|
| 2019-12 |
研討會論文
|
Review and selection of advanced battery technologies for post 2020 era electric vehicles |
M. K. Loganathan, C. M. Tan, B. Mishra, T. A. M. Msagati, and L. W. Snyman |
|
| 2019-11 |
期刊論文
|
Electromagnetic Induced Failure in GaN-HEMT High Frequency Power Amplifier |
Vivek Sangwan, Cher Ming Tan, Dipesh Kapoor, Hsien-Chin Chiu |
IEEE Transaction on Industrial Electronics
|
| 2019-11 |
期刊論文
|
Moisture Resistance Evaluation on Single Electronic Package Moulding Compound |
C. M. Tan, U. Narula, G. L. Seow, V. Sangwan, C. H. Chen, S. P. Lin, J. Y. Chen |
Journal of Materials Chemistry C
|
| 2019-09 |
研討會論文
|
Multi-Criteria Decision Making (MCDM) for the selection of Li-Ion batteries used in Electric Vehicles (EVs) |
M. K. Loganathan, B. Mishra, and C. M. Tan |
|
| 2019-07 |
期刊論文
|
Semi-Empirical capacity fading model for SoH estimation of Li-Ion Batteries |
Preetpal Singh, Che Chen, Cher Ming Tan, Shyh-Chin Huang |
Applied Sciences
|
| 2019-06 |
期刊論文
|
Investigation of the impact of Drive current and phosphor thickness on the reliability of High Power White LED lamp |
Preetpal Singh, Cher Ming Tan, Wenyu Zhao, Hao-Chung Kuo |
IEEE Transactions on Device and Materials Reliability
|
| 2019-05 |
期刊論文
|
Pulse Oximeter for Low SpO2 Level Detection Using Discrete Time Signal Processing Algorithm |
Sumit Pandey, Cher Ming Tan, Hsiao-Wen Chen, Yao En Xie, Jung Hua Tung, Yu-Chuan Kau, Chia-Chih Liao |
Journal of Medical Devices
|
| 2019-04 |
期刊論文
|
High Frequency Electromagnetic Simulation and Optimization for GaN-HEMT Power Amplifier IC |
Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan, Chia Han Lin, and Hsien Chin Chiu |
IEEE Transactions on Electromagnetic Compatibility
|
| 2019-04 |
研討會論文
|
Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits |
Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan |
|
| 2019-03 |
研討會論文
|
Investigate the equivalence of neutrons and protons
in Single Event Effects testing – A Geant4 study |
Yueh Chiang, Cher Ming Tan*, Tsi-Chian Chao, Chung-Chi Lee, and Chuan-Jong Tung |
|
| 2019-02 |
期刊論文
|
Optimal Maintenance Strategy on Medical Instruments used for Haemodialysis Process |
Cher Ming Tan, Udit Narula, Lu An Lai, Sumit Pandey, Jung Hua Tung, Chung Yi Li |
Eksploatacja i Niezawodnosc-Maintenance and Reliability
|
| 2019- |
期刊論文
|
Electromagnetic Hotspots Identification in Integrated Circuits |
Dipesh Kapoor, Vivek Sangwan, Cher Ming Tan |
Progress in Electromagnetics Research (PIER) Letters
|
| 2018-12 |
研討會論文
|
Process safety and performance improvement in oil refineries through active redundancy and risk assessment method- A case study |
M. K. Loganathan, Sunil Rai, S. S. Neog, C. M. Tan |
|
| 2018-11 |
研討會論文
|
Degradation Mechanisms for CdSe Quantum dot down converted LEDs |
Preetpal Singh, Cher Ming Tan, Hao-Chung Kuo |
|
| 2018-10 |
期刊論文
|
Time evolution of packaged LED lamp degradation in outdoor applications |
Preetpal Singh, Cher Ming Tan |
Optical Materials
|
| 2018-10 |
研討會論文
|
Graphene as a Reducing Agent for Electroless Plating of Metal |
Udit Narula, Cher Ming Tan, Eng Soon Tok |
|
| 2018-09 |
期刊論文
|
Optimization of sandblasting process of complex 3D surface polishing using variable viscoelastic diamond particles abrasive |
J. H. Tung, C. S. Chen, W. Y. Zhao, C. M. Tan |
Machining Science and Technology
|
| 2018-08 |
研討會論文
|
Reliability Ranking of Nodes: A Case of Revolution." Progress in Electromagnetics Research Symposium (PIERS) |
P. Ranjan, H. Pandey, M. R. Tripathy, C. M. Tan, and S. Pushp |
|
| 2018-07 |
期刊論文
|
Moisture resistance coating for high power white leds using diamond like carbon |
P. Singh, C. M. Tan, C. W. Liu, C. R. Lin, J. H. Tung |
Archives of Physics Research
|
| 2018-07 |
期刊論文
|
Qualitative Analysis of Growth Parameters for Low Temperature Graphene Synthesis using Design-of-Experiments |
Udit Narula, Cher Ming Tan* |
Frontiers in Materials
|
| 2018-06 |
研討會論文
|
Implementation of Predictive Maintenance Strategy on Hemodialysis Machines |
Cher Ming Tan, Udit Narula, Jung Hua Tung, Lu An Lai, Sumit Pandey, Chung Yi Li |
|
| 2018-05 |
期刊論文
|
High Frequency Electromagnetic Simulation and Optimization for GaN-HEMT Power Amplifier IC |
Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan, Chia Han Lin, and Hsien Chin Chiu |
IEEE Transactions on Electromagnetic Compatibility
|
| 2018-05 |
期刊論文
|
Metal on Graphenated-Metal for VLSI Interconnects |
Udit Narula, Cher Ming Tan*, Eng Soon Tok |
Advanced Materials Interfaces
|
| 2018-05 |
研討會論文
|
Electromagnetic Emissions from GaN Power IC at Varying Distance and Frequency |
Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan |
|
| 2018-05 |
研討會論文
|
Optimization of sandblasting process of complex 3D surface polishing using variable viscoelastic diamond particles abrasive |
J. H. Tung, C. S. Chen, W. Y. Zhao and C. M. Tan |
|
| 2018-05 |
研討會論文
|
Photo- modification and photo- oxidation effect on CdSe Quantum dot down converted LED’s lifetime. |
Preetpal Singh, Cher Ming Tan and Hao-Chung Kuo |
|
| 2018-04 |
研討會論文
|
A Miniaturized T-Shaped MIMO Antenna for X-Band and Ku-Band Applications With Enhanced Radiation Efficiency |
Nirdosh, Cher Ming Tan, Malay Ranjan Tripathy |
|
| 2018-03 |
期刊論文
|
RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation |
Ying-Chang Li, Yuan-Hsiao Chang, Preetpal Singh, Liann-Be Chang *,Der-Hwa Yeh, Ting-Yu Chao, Si-Yun Jian, Yu-Chi Li, Cher-Ming Tan, Chao-sung Lai, Lee Chow, Shang-Ping Ying |
Materials
|
| 2018-01 |
期刊論文
|
Physical Limitations of Phosphor layer thickness and concentration for White LEDs |
Cher Ming Tan, Preetpal Singh, Wenyu Zhao, Hao-Chung Kuo |
Scientific Reports
|
| 2017-12 |
期刊論文
|
Hierarchical degradation processes in lithium-ion batteries during ageing |
Feng Leng, Zhongbao Wei, Cher Ming Tan, Rachid Yazami |
Electrochimica Acta
|
| 2017-12 |
期刊論文
|
Uncover the degradation science of silicone under the combined temperature and humidity conditions |
Preetpal Singh and Cher Ming Tan |
IEEE Access
|
| 2017-10 |
研討會論文
|
Changing Degradation Mechanisms in Silicon Integrated Circuits(Keynote) |
Cher Ming Tan |
|
| 2017-10 |
研討會論文
|
Necessity of Quantitative Reliability Evaluation(Invited) |
Cher Ming Tan |
|
| 2017-09 |
研討會論文
|
Reliability of Solder Interconnect(Keynote) |
Cher Ming Tan |
|
| 2017-08 |
研討會論文
|
Limitations of Phosphor layer thickness and Drive Current for White LEDs (Invited) |
Cher Ming Tan, Preetpal Singh, Wenyu Zhao and Hao-Chung Kuo |
|
| 2017-08 |
研討會論文
|
Practicality and Importance of Advanced Reliability Technology to Industry (Invited) |
Cher Ming Tan |
|
| 2017-08 |
研討會論文
|
Reliability in IoT Era(Keynote) |
Cher Ming Tan |
|
| 2017-07 |
研討會論文
|
Finite element analysis for the understanding of physics of failure in Microelectronics (Invited) |
Cher Ming Tan |
|
| 2017-07 |
技術報告
|
Applications of finite element modeling in Reliability Studies (Tutorial) |
Cher Ming Tan |
|
| 2017-05 |
研討會論文
|
Non destructive examination of Li Ion Battery (Invited) |
C. M. Tan |
|
| 2017-04 |
研討會論文
|
Applications of Finite Element Modeling in Reliability Studies(Keynote) |
Cher Ming Tan |
|
| 2017-03 |
期刊論文
|
Growth Mechanism for Low Temperature PVD Graphene Synthesis on Copper Using Amorphous Carbon |
Udit Narula, Cher Ming Tan, Chao Sung Lai |
Scientific Reports
|
| 2017-03 |
專書論文
|
Component-Level Reliability: Physical Models and Testing Regulations |
C. M. Tan |
Handbook of Advanced Lighting Technology
|
| 2017-02 |
期刊論文
|
Engineering a PVD based graphene synthesis method |
U. Narula, C. M. Tan |
IEEE Transactions on Nanotechnology
|
| 2017-02 |
研討會論文
|
Applications of Finite Element Modelling in Reliability (Invited) |
Cher Ming Tan |
|
| 2017-02 |
研討會論文
|
Challenges in Reliability Screening for High Power Diodes |
Udit Narula, Cher Ming Tan |
|
| 2017-02 |
研討會論文
|
Predictive Statistical Maintenance and Repair Strategy of Dialysis Machine |
Jung-Hua Tung and Cher Ming Tan |
|
| 2017-02 |
研討會論文
|
Thermal-humidity degradation mechanisms of silicone in LED Packaging under different environmental conditions |
Preetpal Singh and Cher Ming Tan |
|
| 2017-01 |
專書
|
Theory and Practice of Quality and Reliability Engineering in Asia Industry |
C. M. Tan and T. N. Goh |
|
| 2017-01 |
專書論文
|
Overview of Reliability engineering |
C.M. Tan |
Theory and practice of quality and reliability engineering in Asia industry
|
| 2017-01 |
專書論文
|
Quality decision for overcharged Li-Ion battery from reliability and safety perspective |
F Leng, CM Tan, R Yazami, K Maher, R Wang |
Theory and practice of quality and reliability engineering in Asia industry
|
| 2017-01 |
專書論文
|
The Correlation Between Device Aging and System Degradation |
S Lan, CM Tan |
Theory and practice of quality and reliability engineering in Asia industry
|
| 2017-01 |
研討會論文
|
Reliability Paradox for Worldwide Automotive Electronics |
Cher Ming Tan, Udit Narula, Dipesh Kapoor |
|
| 2016-11 |
研討會論文
|
Degradation Physics of High Power LEDs in Outdoor Applications |
Cher Ming Tan |
|
| 2016-11 |
研討會論文
|
Degradation Physics of High Power LEDs in Outdoor Applications (Invited) |
Cher Ming Tan |
|
| 2016-11 |
研討會論文
|
ULSI Interconnection electromigration and its EMI performance |
Cher Ming Tan |
|
| 2016-11 |
研討會論文
|
ULSI Interconnection electromigration and its EMI performance (Invited) |
Cher Ming Tan |
|
| 2016-11 |
技術報告
|
Statistical Analysis of Reliability Test Data (Tutorial) |
Cher Ming Tan |
|
| 2016-10 |
研討會論文
|
Effect of ULSI Interconnect layout on its electromagnetic emission (Invited) |
Cher Ming Tan |
|
| 2016-10 |
研討會論文
|
Engineering a PVD Based Graphene Synthesis Method |
Udit Narula, Cher Ming Tan |
|
| 2016-10 |
研討會論文
|
Investigation of LED lumen recovery after the sharp initial lumen degradation using ANSYS finite element modeling and C-SAM |
Preetpal Singh, Cher Ming Tan |
|
| 2016-08 |
研討會論文
|
Effect of ULSI Interconnect layout on its Electromagnetic Emission |
Cher Ming Tan, Dipesh Kapoor and Vivek Sagawan |
|
| 2016-07 |
期刊論文
|
Determining the Parameters of Importance of a Graphene Synthesis Process Using Design-of-Experiments Method |
Udit Narula and Cher Ming Tan |
Applied Sciences
|
| 2016-07 |
技術報告
|
Introduction to Reliability (Tutorial) |
Cher Ming Tan |
|
| 2016-06 |
期刊論文
|
Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules |
Preetpal Singh , Der-Hwa Yeh , Cher-Ming Tan , Chao-Sung Lai , Chih-Teng Hou , Ting-Yu Chao and Liann-Be Chang |
Applied Sciences
|
| 2016-05 |
研討會論文
|
Determination of Key Factors for Low Temperature Graphene Synthesis using Design of Experiments Approach (Invited) |
Udit Narula, Chao Sung Lai, Cher Ming Tan |
|
| 2016-05 |
研討會論文
|
Graphene as a buffer layer for high quality GaN deposition on substrates in electronics |
Preetpal Singh, Chao Sung Lai, Cher Ming Tan |
|
| 2016-05 |
研討會論文
|
Simulation of EMI at Design Level for Integrated Circuits |
Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan |
|
| 2016-04 |
期刊論文
|
Degradation Physics of High Power LEDs in Outdoor Environment and the Role of Phosphor in the degradation process |
Preetpal Singh, Cher Ming Tan |
Scientific Report
|
| 2016-03 |
研討會論文
|
Design of Experiments for Determination of Key Factors for Graphene Synthesis on Copper Using Amorphous Carbon - a statistical approach |
Udit Narula, Cher Ming Tan, Chao Sung Lai |
|
| 2016-03 |
研討會論文
|
Reliability Paradox of Automotive Electronics(Keynote) |
Cher Ming Tan, Udit Narula, Dipesh Kapoor |
|
| 2016-03 |
技術報告
|
Statistical Analysis of Reliability Test Data |
Cher Ming Tan |
|
| 2016-02 |
期刊論文
|
Copper induced synthesis of graphene using amorphous carbon |
Udit Narula, Cher Ming Tan, Chao Sung Lai |
Microelectronics Reliability
|
| 2016-02 |
期刊論文
|
Early degradation of high power packaged LEDs under humid conditions
and its recovery — Myth of reliability rejuvenation |
Preetpal Singh, Cher Ming Tan, Liann-Be Chang |
Microelectronics Reliability
|
| 2016-01 |
期刊論文
|
A review on the humidity reliability of high power white light LEDs |
Preetpal Singh, Cher Ming Tan |
Microelectronics Reliability
|
| 2016-01 |
期刊論文
|
Non-destructive degradation study of copper wire bond for its
temperature cycling reliability evaluation |
Marvin Chan, Cher Ming Tan⁎, Kheng Chooi Lee, Chuan Seng Tan |
Microelectronics Reliability
|
| 2015-11 |
期刊論文
|
A review on the humidity Reliability of High Power White light LEDs |
Preetpal Singh, Cher Ming Tan |
Microelectronics Reliability
|
| 2015-10 |
期刊論文
|
Effect of Temperature on the Aging rate of Li Ion Battery Operating above Room Temperature |
Feng Leng, Cher Ming Tan, Michael Pecht |
Scientific Report
|
| 2015-08 |
研討會論文
|
Internal probing into the degradation processes in Lithium-ion batteries under cyclic aging |
Cher Ming Tan, Leng Feng |
|
| 2015-08 |
研討會論文
|
Internal probing into the degradation processes in Lithiumion batteries under cyclic aging(Invited) |
Cher Ming Tan and Feng Leng |
|
| 2015-08 |
研討會論文
|
Li Ion Battery Pack Reliability Assurance |
Cher Ming Tan, Leng Feng |
|
| 2015-08 |
研討會論文
|
Li Ion Battery Pack Reliability Assurance(Keynote) |
Cher Ming Tan |
|
| 2015-06 |
期刊論文
|
Application of particle filter technique for lifetime determination from degradation study on a LED Driver |
S. Lan, C.M. Tan |
IEEE Transactions on Device and Materials Reliability
|
| 2015-06 |
研討會論文
|
Dependence of test conditions on humidity reliability results for high power LEDs |
Preetpal Singh, Cher Ming Tan |
|
| 2015-06 |
研討會論文
|
Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability Evaluation |
J. M. Chan, C. M. Tan, K. C. Lee, W. Kanert, C. S. Tan |
|
| 2015-06 |
研討會論文
|
Thermally Stressed Copper Induced Synthesis of Graphene using Amorphous Carbon |
Udit Narula, C. S. Lai, C. M. Tan |
|
| 2015-02 |
期刊論文
|
A reliability-based design concept for lithium-ion battery pack in electric vehicles |
Zhitao Liu, Cher Ming Tan, Feng Leng |
Reliability Engineering and system safety
|
| 2014-11 |
研討會論文
|
A methodology for studying the effect of overcharge on the safety of lithium-ion batteries (invited talk) |
Feng Leng and Cher Ming Tan |
|
| 2014-11 |
研討會論文
|
Copper Catalyzed Crystallization of Amorphous Carbon into Graphene |
Udit Narula, C. S. Lai, C. M. Tan |
|
| 2014-11 |
研討會論文
|
Exploring the Humidity Effect on the Reliability of High Power LEDs |
Cher Ming Tan and Preetpal Singh |
|
| 2014-11 |
研討會論文
|
Exploring the Humidity Effect on the Reliability of High Power LEDs(Invited) |
Cher Ming Tan and Preetpal Singh |
|
| 2014-10 |
研討會論文
|
Revisit resistance monitoring techniques for measuring TSV/Solder resistance During Electromigration test |
Cher Ming Tan and Udit Narula |
|
| 2014-09 |
期刊論文
|
Degradation Model of a Linear-Mode LED Driver and its Application in Lifetime Prediction |
Song Lan, Cher Ming Tan |
IEEE Transactions on Device and Materials Reliability
|
| 2014-07 |
研討會論文
|
Electromigration simulation at circuit levels |
Cher Ming Tan |
|
| 2014-06 |
期刊論文
|
Methodology of reliability enhancement for high power LED driver |
Song Lan, Cher Ming Tan, Kevin Wu |
Microelectronics Reliability
|
| 2014-06 |
期刊論文
|
Modeling and analysis of gate-all-around silicon nanowire FET |
Xiangchen Chen and Cher Ming Tan |
Microelectronics Reliability
|
| 2014-06 |
期刊論文
|
Time Evolution Degradation Physics in High Power White LEDs Under High Temperature-Humidity Conditions |
C.M. Tan and P. Singh |
IEEE Transactions On Devices and Materials Reliability
|
| 2014-06 |
研討會論文
|
Extrapolation of lifetime of high power LEDs under temperature-humidity conditions |
Cher Ming Tan and Preetpal Singh |
|
| 2014-04 |
期刊論文
|
A practical framework of electrical based online state-of-charge estimation of lithium ion batteries |
Feng Leng, Cher Ming Tan, Rachid Yazami and Minh Duc Le |
Journal of Power Sources
|
| 2014-03 |
期刊論文
|
Degradation Model of a Linear Mode LED Driver and its application in Lifetime Prediction |
Song Lan and Cher Ming Tan |
IEEE Transactions on Device and Materials Reliability
|
| 2014-02 |
期刊論文
|
Maintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for high yield etching process |
M.D. Le, C.M. Tan, M. Luo, I.C.H. Leng |
IEEE Trans. On Semiconductor Manufacturing
|
| 2014- |
期刊論文
|
A reliability based design concept for Lithium-ion battery pack in electric vehicle |
Zhitao Liu, Cher Ming Tan, Feng Leng |
Reliability Engineering & System safety
|
| 2014- |
期刊論文
|
Ab initio simulation of electronic and mechanical properties of aluminium for fatigue early feature investigation |
Shuai Zhang, Cher Ming Tan, Shuguang Cheng, Tianqi Deng, Feifei He and Haibin Su |
International Journal of Nanotechnology
|
| 2014- |
期刊論文
|
Damage Threshold Determination and Non-destructive Identification of Possible Failure Sites in PIN Limiter |
Cher Ming Tan and Wenzhi Yu |
Microelectronics Reliability
|
| 2014- |
期刊論文
|
Degradation mechanisms in gate-all-around silicon Nanowire field effect transistor under electrostatic discharge stress – a modeling approach |
Cher Ming Tan and Xiangchen Chen |
Nano-convergence
|
| 2014- |
研討會論文
|
A methodology for studying the effect of overcharge on the safety of lithium-ion batteries(Invited) |
Feng Leng and Cher Ming Tan |
|
| 2014- |
研討會論文
|
Extending electromigration modeling from test structures to Integrated circuit layout level |
Cher Ming Tan |
|
| 2014- |
研討會論文
|
Extending electromigration modeling from test structures to Integrated circuit layout level(Invited) |
Cher Ming Tan |
|
| 2014- |
研討會論文
|
Product Reliability Assurance – The manifestation of the Core Values of Chinese Culture |
Cher Ming Tan |
|
| 2014- |
研討會論文
|
Product Reliability Assurance – The manifestation of the Core Values of Chinese Culture(Invited) |
Cher Ming Tan |
|
| 2014- |
研討會論文
|
Reliability Lifetime Extrapolation of high power LEDs under humidity test – A revisit(Invited) |
Cher Ming Tan and Preetpal Singh |
|
| 2014- |
研討會論文
|
Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test(Invited) |
Cher Ming Tan and Udit Narula |
|
| 2014- |
研討會論文
|
The effect of temperature on the electrochemistry in Lithium-ion batteries |
Feng Leng, Cher Ming Tan, Michael Pecht, JiYe Zhang |
|
| 2013- |
期刊論文
|
Effects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for high power light-emitting diode in switching applications |
Cher Ming Tan, Sihan Chen, Jacky Kong |
IEEE Transactions On Nanotechnology
|
| 2013- |
期刊論文
|
Electromigration Modeling at Circuit Layout Level |
C. M. Tan and F. He |
SpringerBrief on Reliability
|
| 2013- |
期刊論文
|
Optimal maintenance strategy of deteriorating system under imperfect maintenance & inspection using mixed inspection scheduling |
M. D. Le and C. M. Tan |
Reliability Engineering & System Safety
|
| 2013- |
期刊論文
|
Rapid ULSI Interconnect Reliability Analysis Using Neural Networks |
Yizhen Tian, Feifei He, Qi-Jun Zhang, Cher Ming Tan, Jianguo Ma |
IEEE Transactions On Devices and Materials Reliability
|
| 2013- |
期刊論文
|
Systematic root cause analysis for GaP green light LED degradation |
C. M. Tan and C. S. Lai. |
IEEE Transactions On Devices and Materials Reliability
|
| 2013- |
專書
|
Electromigration Modeling at Circuit Layout Level |
C. M. Tan and F. He |
SpringerBrief on Reliability
|
| 2013- |
研討會論文
|
ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device |
Cher Ming Tan and Xiangchen Chen |
|
| 2013- |
研討會論文
|
ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device(Invited) |
Cher Ming Tan and Xiangchen Chen |
|
| 2013- |
研討會論文
|
Effects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for ultra high power light-emitting diode |
S. H. Chen, C. M. Tan, E. Tan, and J. Kong |
|
| 2013- |
研討會論文
|
Investigation of work function and surface energy of aluminum - an AB-Initio study |
S. Cheng, C. M. Tan, T. Deng, F. He, S Zhang, and H. Su |
|
| 2013- |
研討會論文
|
Model the Physics of Micro-crack formation in Alumimum under high temperature cycling(Invited) |
Cher Ming Tan, Shuai Zhang, Feifei He, Xi Zhu and Haibin Su |
|
| 2013- |
研討會論文
|
Modeling and Analysis of Gate-All-Around Silicon Nanowire FET |
Xiangchen Chen and Cher Ming Tan |
|
| 2013- |
研討會論文
|
Monte Carlo simulation of fatigue crack initiation at elevated temperature |
F. He and C. M. Tan |
|
| 2013- |
研討會論文
|
Real Time Monitoring and Characterizing of Li-ion Batteries Aging |
Feng Leng, Cher Ming Tan, Raghavendra Arunachala, Andreas Jossen |
|
| 2013- |
研討會論文
|
Reliability Evaluation and Improvement for High Power LED Driver |
Lan Song and Cher Ming Tan |
|
| 2012-12 |
期刊論文
|
Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief |
K. Ghosh, J. Zhang, L. Zhang, Y. Dong, H. Li, C. M. Tan, G. Xia, and C. S. Tan |
Physics Express
|
| 2012-11 |
期刊論文
|
3D simulation-based research on the effect of interconnect structures on circuit reliability |
F. He and C. M. Tan. |
World Journal of Modelling and Simulation
|
| 2012-11 |
研討會論文
|
3D electromigration modeling at circuit level (Invited) |
C. M. Tan and F. He |
|
| 2012-11 |
研討會論文
|
Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited) |
C. M. Tan and C. Fu |
|
| 2012-11 |
技術報告
|
Physics of electromigration in today ULSI interconnections (Tutorial) |
C. M. Tan |
|
| 2012-10 |
期刊論文
|
Comparison of electromigration simulation in test structure and actual circuit |
F. He and C. M. Tan |
Applied Mathematical Modelling
|
| 2012-09 |
期刊論文
|
Degradation behavior of high power light emitting diode under high frequency switching |
S. H. Chen, C. M. Tan, G. H. Tan, and F. He |
Microelectronics Reliability
|
| 2012-09 |
期刊論文
|
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints |
Y.D.Han, H.Y. Jing, S.M.I. Nai, L.Y. Xu, C.M. Tan, J.Wei |
Journal of Electronic Materials
|
| 2012-09 |
期刊論文
|
Reliability study of LED driver - a case study of black box testing |
S. Lan, C. M. Tan, and K. Wu. |
Microelectronics Reliability
|
| 2012-09 |
研討會論文
|
Recent Development of Reliability and Maintenance (Invited) |
C. M. Tan |
|
| 2012-08 |
期刊論文
|
Effect of IC layout on the reliability of CMOS amplifiers |
F. He and C. M. Tan |
Microelectronics Reliability
|
| 2012-08 |
期刊論文
|
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test |
S. H. Chen, C. M. Tan, and E. Chen |
Microelectronics Reliability
|
| 2012-08 |
期刊論文
|
Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling |
Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei |
Intermetallics
|
| 2012-07 |
研討會論文
|
Study of humidity reliability of solid state lighting (Invited) |
C. M. Tan |
|
| 2012-05 |
期刊論文
|
Applications of Finite element Methods for Reliability Study of ULSI Interconnections |
C. M. Tan, W. Li, and Z. Gan |
Microelectronics Reliability
|
| 2012-05 |
研討會論文
|
Estimation of SoC/SoH of cell and RUL of battery pack for EV Application (Invited) |
C. M. Tan, M. D. Le, and F. Leng |
|
| 2012-05 |
研討會論文
|
SoC and SoH Estimation of battery cell and modules for electric vehicles (Keynote) |
C. M. Tan, M. D. Le, and F. Leng |
|
| 2012-03 |
期刊論文
|
Rapid light output degradation of GaN based packaged LED in the early stage of humidity test |
C. M. Tan, S. H. Chen, and E. Chen |
IEEE Transactions On Devices and Materials Reliability
|
| 2012-02 |
期刊論文
|
Electromigration reliability of interconnections in RF low noise amplifier circuit |
F. He and C. M. Tan. |
Microelectronics Reliability
|
| 2012- |
期刊論文
|
Applications of multi-walled carbon nanotube in electronic packaging |
C. M. Tan, C. Baudot, Y. D. Han, and H. Jing |
Nanoscale Research Letters
|
| 2012- |
期刊論文
|
Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes |
Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan |
Journal of Materials Science: Materials in Electronics
|
| 2012- |
期刊論文
|
Interfacial reaction and shear strength of Ni coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling |
Y.D Han, H.Y Jing, S.M.L Nai, L.Y. Xu, C.M Tan and J. Wei |
Intermetallics
|
| 2012- |
研討會論文
|
3D electromigration modeling at circuit level |
C. M. Tan and F. He |
|
| 2012- |
研討會論文
|
Degradation behaviour of high power light emitting diode under high frequency switching |
S. H. Chen, C. M. Tan, and G. H. Tan |
|
| 2012- |
研討會論文
|
Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes |
C. M. Tan and C. Fu |
|
| 2012- |
研討會論文
|
Estimation of SoC/SoH of cell and RUL of battery pack for EV Application |
C. M. Tan, M. D. Le, and F. Leng |
|
| 2012- |
研討會論文
|
Physics of electromigration in today ULSI interconnections |
C. M. Tan. |
|
| 2012- |
研討會論文
|
Recent Development of Reliability and Maintenance |
C. M. Tan |
|
| 2012- |
研討會論文
|
Reliability study of LED driver - a case study of black box testing |
S. Lan, C. M. Tan, and K. Wu |
|
| 2012- |
研討會論文
|
SoC and SoH Estimation of battery cell and modules for electric vehicles |
C. M. Tan, M. D. Le, and F. Leng |
|
| 2012- |
研討會論文
|
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay |
K. Ghosh, J. Zhang, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan |
|
| 2012- |
研討會論文
|
Study of humidity reliability of solid state lighting |
C. M. Tan. |
|
| 2012- |
研討會論文
|
TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current |
J. Zhang, K. Ghosh, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan |
|
| 2011-10 |
期刊論文
|
Comparison of SOI and PSOI LDMOS using electrical-thermal-stress coupled field modeling |
C. M. Tan and G. Huang |
IEEE Transactions on Electron Devices
|
| 2011-07 |
期刊論文
|
Effect of hydrophilicity of carbon nanotube arrays on the release rate and activity of recombinant human bone morphogenetic protein-2 |
J. H. Zhao, C. M. Tan, K. T. Beng, and S. A. F. Peel |
Nanotechnology
|
| 2011-07 |
研討會論文
|
Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited) |
C. M. Tan, Z. Gan, and W. Li |
|
| 2011-06 |
研討會論文
|
Applications of multi-walled carbon nanotube (Invited) |
C. M. Tan, C. Baudot, Y. D. Han, and H. Jing |
|
| 2011-05 |
期刊論文
|
Maintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for high yield etching process |
M.D. Le and C.M. Tan |
IEEE Trans. On Semiconductor Manufacturing
|
| 2011- |
期刊論文
|
Covalent functionalization of carbon nanotubes and their use in dielectric epoxy composites to improve heat dissipation |
C. Baudot and C. M. Tan |
Carbon
|
| 2011- |
期刊論文
|
Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes |
Y. D. Han, S. M. L. Nai, H. Y. Jing, L. Y. Xu, C. M. Tan, and J. Wei |
Journal of Materials Science-Materials in Electronics
|
| 2011- |
期刊論文
|
Electrical-thermal-stress coupled-field effect in SOI and partial SOI lateral power diode |
G. Huang and C. M. Tan |
IEEE Transactions on Power Electronics
|
| 2011- |
專書
|
Applications of finite element methods for reliability studies on ULSI Interconnections |
C. M. Tan, W. Li, Z. Gan, and Y. Hou |
Springer Verlag
|
| 2011- |
研討會論文
|
Applications of Finite element Methods for Reliability Study of ULSI Interconnections |
C. M. Tan, Z. Gan, and W. Li |
|
| 2011- |
研討會論文
|
Applications of multi-walled carbon nanotube |
C. M. Tan, C. Baudot, Y. D. Han, and H. Jing |
|
| 2011- |
研討會論文
|
Automated wafer defect map generation for process yield improvement |
C. M. Tan and K. T. Lau |
|
| 2011- |
研討會論文
|
Black’s equation for today’s ULSI interconnect electromigration |
W. Li and C. M. Tan. |
|
| 2011- |
研討會論文
|
Black’s equation for today’s ULSI interconnect electromigration (Invited) |
W. Li and C. M. Tan |
|
| 2011- |
研討會論文
|
Contamination Assessment of Inductive Couple Plasma Etching Chamber under Mixture of Recipes using Statistical Method |
C. M. Tan and M. D. Le. |
|
| 2011- |
研討會論文
|
Ensuring Accuracy in Optical and Electrical Measurement of Ultra-Bright LEDs during Reliability Test, |
S. H. Chen, C. M. Tan, and E. Chen |
|
| 2011- |
研討會論文
|
On-chip RF energy harvesting circuit for image sensor |
J. Zhang, X. Y. Zhang, Z. L. Chen, K. Y. See, C. M. Tan, and S. S. Chen. |
|
| 2011- |
研討會論文
|
Performance evaluation of covalently functionalized carbon nano-tube polymer heat sink for ultra high power LED |
S. H. Chen, C. M. Tan, M. H. Tan, and B. K. Chen |
|
| 2010-11 |
期刊論文
|
Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy |
S. Li, A. K. Ng, J. W. Rong, C. M. Tan, Y, Yang, and Y Chen |
Nanoscale,
|
| 2010-11 |
期刊論文
|
FTIR spectroscopy as a tool for nano-material characterization |
C. Baudot, C. M. Tan, and J. C. Kong |
Infrared Physics & Technology
|
| 2010-10 |
期刊論文
|
Microstructure and mechanical properties of CrN films fabricated by high power pulsed magnetron discharge plasma immersion ion implantation and deposition |
Z. Wu, X. Tian, Z. Wang, C. Gong, S. Yang, C. M. Tan, and P. K. Chu |
Applied Surface Science
|
| 2010-06 |
專書
|
Electromigration in ULSI Interconnections |
C. M. Tan |
World Scientific
|
| 2010-02 |
期刊論文
|
Interface fracture toughness assessment of solder joints using double cantilever beam test |
S. Z. Y. Loo, P. C. Lee, Z. X. Lim, N. Yantara, T. Y. Tee, C. M. Tan, and Z. Chen |
International Journal of Modern Physics B
|
| 2010- |
期刊論文
|
Addressing the challenges in solder resistance measurement for electromigration test |
Y. C. Tan, C. M. Tan, and T. C. Ng |
Microelectronics Reliability
|
| 2010- |
期刊論文
|
Circuit level interconnect reliability study using 3D circuit model |
F. He and C. M. Tan |
Microelectronics Reliability
|
| 2010- |
期刊論文
|
Electromigration performance of through silicon via (TSV) - A modeling approach |
Y. C. Tan, C. M. Tan, X. W. Zhang, T. C. Chai, and D. Q. Yu |
Microelectronics Reliability
|
| 2010- |
期刊論文
|
Hot carrier reliability of power SOI EDNMOS |
J. Liao, C. M. Tan and G. Spierings |
IEEE Transactions on Power Electronics
|
| 2010- |
期刊論文
|
Indentation size effect on the creep behavior of a SnAgCu solder |
Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei |
International Journal of Modern Physics B
|
| 2010- |
期刊論文
|
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model, |
F. He and C. M. Tan. |
Microelectronics Reliability
|
| 2010- |
期刊論文
|
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder |
Han, Y.D.; Jing, H.Y.; Nai, S.M.L.; Xu, L.Y.; Tan, C.M.; Wei, J. |
Journal of Electronic Materials
|
| 2010- |
期刊論文
|
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects |
C. M. Fu, C. M. Tan, S. H. Wu, and H. B. Yao |
Microelectronics Reliability
|
| 2010- |
專書論文
|
Changing Reliability Physics of Interconnect from Micro- to Nanotechnology |
Tan Cher Ming and Hou Yuejin |
Ceramic Integration and Joining Technologies: From Macro to Nanoscale
|
| 2010- |
研討會論文
|
A possible reality on battery-less low-power portable electronics |
C. M. Tan, K. Y. See, J. W. Zhang, M. J. Xu, C. C. Boon, K. S. Yeo, and M. A. Do |
|
| 2010- |
研討會論文
|
Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes |
S. M. L Nai, Y. D. Han, H. Y. Jing, L. Y. Xu, C. M. Tan, and J. Wei |
|
| 2010- |
研討會論文
|
Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder |
Y. D. Han, L. Y. Xu, H. Y. Jing, C. M. Tan, S. M. L Nai, and J. Wei |
|
| 2010- |
研討會論文
|
Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency |
C. M. Tan and N. Raghavan |
|
| 2010- |
研討會論文
|
Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes |
Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei |
|
| 2010- |
研討會論文
|
New Driving Forces in ULSI Electromigration and its implication to IC Designers(Invited) |
Cher Ming Tan |
|
| 2010- |
研討會論文
|
Protein immobilization on nanostructured surfaces with different wettability |
Han, Z.J.; Shakerzadeh, M.; Tay, B.K.; Tan, C.M. |
|
| 2010- |
研討會論文
|
Study of humidity reliability of high power LEDS |
C. M. Tan, B. K. Chen, and M. Xiong |
|
| 2010- |
研討會論文
|
Study of humidity reliability of high power LEDS (Invited) |
C. M. Tan, B. K. Chen, and M. Xiong |
|
| 2010- |
研討會論文
|
Wireless energy harvesting using serially connected voltage doublers |
J. W. Zhang, L. B. Wang, K. Y. See, C. M. Tan, C. C. Boon, K. S. Yeo, and M. A. Do |
|
| 2009- |
期刊論文
|
A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints |
Y.D. Han, H.Y. Jing, S.M.L .Nai, C.M. Tan, J. Wei, L.Y Xu, S.R. Zhang |
Journal of Physics D: Applied Physics
|
| 2009- |
期刊論文
|
Analysis of humidity effects on the degradation of high-power white LEDs |
C. M. Tan, B. K. E. Chen, G. Xu, and Y. Liu |
Microelectronics Reliability
|
| 2009- |
期刊論文
|
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI) |
J. Liao, C. M. Tan and G. Spierings |
Microelectronics Reliability
|
| 2009- |
期刊論文
|
Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials |
Y. Hou and C. M. Tan |
Semiconductor Science and Technology
|
| 2009- |
期刊論文
|
Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects |
W. Li, C. M. Tan, and N. Raghavan |
Journal of Applied Physics
|
| 2009- |
期刊論文
|
Electromigration in width transition copper interconnect |
A. Roy, Y. Hou, and C. M. Tan. |
Microelectronics Reliability
|
| 2009- |
期刊論文
|
Electrowetting control of cassie-to-wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites |
Z. Han, B. Tay, C. M. Tan, M. Shakerzadeh, and K. Ostrikov. |
ACS Nano
|
| 2009- |
期刊論文
|
Local bond average for the size and temperature dependence of elastic and vibronic properties of nanostructures |
M. Gu, C. Q. Sun, C. M. Tan, and S. Wang |
International Journal of Nanotechnology
|
| 2009- |
期刊論文
|
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes |
Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei |
International Journal of Nanoscience
|
| 2009- |
期刊論文
|
Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems |
C. M. Tan and N. Raghavan |
Reliability Engineering & System Safety
|
| 2009- |
期刊論文
|
Review of electromigration modeling of IC Interconnects |
J. G. Ma, M. Yao, and C. M. Tan. |
Journal of the University of Electronic Science and Technology of China
|
| 2009- |
期刊論文
|
Solubility, dispersion and bonding of functionalised carbon nanotubes in epoxy resins |
C. Baudot and C. M. Tan. |
International Journal of Nanotechnology
|
| 2009- |
專書論文
|
Reliability Assessment of Integrated Circuits and its Misconception |
C. M. Tan |
Integrated Circuits, Photodiodes and Organic Field Effect Transistors
|
| 2009- |
研討會論文
|
3D circuit model for 3D IC reliability study |
C. M. Tan and F. He |
|
| 2009- |
研討會論文
|
3D circuit model for 3D IC reliability study (Invited) |
C. M. Tan and F. He |
|
| 2009- |
研討會論文
|
Application of FTIR for the study of functional molecules grafting on carbon nanotubes |
C. Baudot, C. M. Tan, J. Kong, F. Buonocore, and A. Di-Mateo. |
|
| 2009- |
研討會論文
|
Comparative study of non-standard power diodes |
C. M. Tan, L. Sun, N. Raghavan, C. Hsu, and C. Wang |
|
| 2009- |
研討會論文
|
Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth |
Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. TAN, and J. Wei |
|
| 2009- |
研討會論文
|
Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes |
S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, and J. Wei |
|
| 2009- |
研討會論文
|
Extending the useful life of solar cell through Nano TiO2 film coating,” presented at Advanced Materials for Nanotechnology |
C. M. Tan |
|
| 2009- |
研討會論文
|
Going green for discrete power diode manufacturing |
C. M. Tan, L. Sun, and C. Wang |
|
| 2009- |
研討會論文
|
Indentation size effect on the creep behavior of a Sn-Ag-Cu solder |
Y. D. Han, H. Y. Jing, S. M. L. Nai, Y. C. Liu, C. M. Tan, J. Wei, and L.Y. Xu |
|
| 2009- |
研討會論文
|
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes |
Y. D. Han, H. Y. Jing, S. M. L. Nai, Y. C. Liu, C. M. Tan, J. Wei, and L. Y. Xu. |
|
| 2009- |
研討會論文
|
Product Excellence in Global Competitive Market(Invited) |
C.M. Tan |
|
| 2009- |
研討會論文
|
Requirement for accurate interconnect temperature measurement for Electromigration test |
Y. Hou and C. M. Tan |
|
| 2009- |
研討會論文
|
Solid State Lighting Reliability(Invited) |
C.M. Tan |
|
| 2009- |
研討會論文
|
TSV Reliability(Invited) |
C.M. Tan |
|
| 2009- |
研討會論文
|
The influence of Nano TiO2 film thickness on its photo-catalytic and hydrophilic properties |
C. M. Tan, E. Q. Kuan, and R. Cai |
|
| 2009- |
研討會論文
|
Transient electrical thermal analysis of ESD process using 3-D finite element method |
Y. Hou and C.M. Tan |
|
| 2009- |
研討會論文
|
Using nanoparticles and carbon nanotubes to enhance the properties of a lead free solder |
S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, and J. Wei. |
|
| 2008-06 |
研討會論文
|
A holistic numerical modeling for interconnect electromigration (Invited) |
C. M. Tan and W. Li |
|
| 2008- |
期刊論文
|
A bimodal 3-parameter lognormal mixture distribution for electromigration failures |
C. M. Tan and N. Raghavan |
Thin Solid Films
|
| 2008- |
期刊論文
|
A framework to Practical Predictive Maintenance Modeling for Multi-State Systems |
C. M. Tan and N. Raghavan |
Reliability Engineering & System Safety
|
| 2008- |
期刊論文
|
Stress-induced voiding study in integrated circuit interconnects |
Y. Hou and C. M. Tan |
Semiconductor Science and Technology
|
| 2008- |
期刊論文
|
Very high current density package level electromigration test for copper interconnects |
A. Roy and C. M. Tan |
Journal of Applied Physics
|
| 2008- |
專書
|
Simulated Annealing |
C. M. Tan |
IN-TECH Publishing
|
| 2008- |
專書論文
|
Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing |
C. M. Tan and N. Raghavan |
Simulated Annealing
|
| 2008- |
研討會論文
|
A holistic numerical modeling for interconnect electromigration |
C. M. Tan and W. Li |
|
| 2008- |
研討會論文
|
A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress |
Y. D. Han, C. M. Tan and W. Jun |
|
| 2008- |
研討會論文
|
Finite element modeling for Interconnect Reliability Study(Invited) |
C.M. Tan |
|
| 2008- |
研討會論文
|
Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system |
C. M. Tan and Y. Liu. |
|
| 2008- |
研討會論文
|
Fracture Toughness Assessment of a solder joint using double cantilever beam specimens |
P. Cheng, A. Lee, Z. X. Lim, N. Yantara, S. Z. Y. Loo, T. Y. Tee, C. M. Tan and Z. Chen |
|
| 2008- |
研討會論文
|
Humidity effect on the degradation of packaged ultra-bright white LEDs |
C. M. Tan, B. K. Chen, R. Tew |
|
| 2008- |
研討會論文
|
Methodologies for size, and temperature dependent change of materials properties |
M. Gu, C. Q. Sun, C. M. Tan, and S. Wang |
|
| 2008- |
研討會論文
|
Nano-tailoring of carbon nanotube as nano-fillers for composite materials applications |
C. Baudot, C. M. Tan, and C. Wang |
|
| 2008- |
研討會論文
|
Size effect in Cu nano-interconnects and its implication on electromigration |
Y. Hou and C. M. Tan. |
|
| 2008- |
研討會論文
|
Statistical modeling of via redundancy effects on interconnect reliability |
N. Raghavan and C. M. Tan |
|
| 2008- |
研討會論文
|
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature |
Y. Hou and C. M. Tan |
|
| 2008- |
研討會論文
|
Use of high altitude balloon platforms for small satellite testing |
I. V. McLoughlin, A. M. Prakash, S. Shukla, S. H. Tan, K. Arichandran, C. M. Tan, V. S. Sawant, and R. K. Manchanda. |
|
| 2008- |
技術報告
|
Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system (Tutorial) |
C. M. Tan and Y. Liu |
|
| 2007- |
期刊論文
|
Aligned carbon nanotubes for through-wafer interconnects |
T. Xu, Z. Wang, J. Miao, X. Chen, and C. M. Tan |
Applied Physics Letters
|
| 2007- |
期刊論文
|
An approach to statistical analysis of gate oxide breakdown mechanisms |
C. M. Tan and N. Raghavan |
Microelectronics Reliability
|
| 2007- |
期刊論文
|
Application of Gamma Distribution in Electromigration for Submicron Interconnects |
C. M. Tan, N. Raghavan, and A. Roy |
Journal of Applied Physics
|
| 2007- |
期刊論文
|
Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling |
W. Li, C. M. Tan, and Y. Hou |
Journal of Applied Physics
|
| 2007- |
期刊論文
|
Electromigration in ULSI Interconnects |
C. M. Tan and A. Roy |
Materials Science and Engineering R-Reports
|
| 2007- |
期刊論文
|
Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab |
W. Li and C. M. Tan |
Microelectronics Reliability
|
| 2007- |
期刊論文
|
Finite element modeling of capacitive coupling voltage contrast |
C. M. Tan, S. Yanuar, and T. C. Chai |
Microelectronics Reliability
|
| 2007- |
期刊論文
|
Lifetime modeling for stress-induced voiding in integrated circuit interconnections |
C. M. Tan and Y. Hou |
Applied Physics Letters
|
| 2007- |
期刊論文
|
Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure |
A. Roy and C. M. Tan |
Thin Solid Films
|
| 2007- |
期刊論文
|
Reverse breakdown voltage measurement for power P+NN+ rectifier |
C. M. Tan and G. Huang |
Journal of Electronic Testing-Theory and Applications
|
| 2007- |
期刊論文
|
Revisit to the finite element modeling of electromigration for narrow interconnects |
C. M. Tan and Y. Hou |
Journal of Applied Physics
|
| 2007- |
期刊論文
|
Room temperature observation of point defect on gold surface using thermovoltage mapping |
A. Roy, C. M. Tan, S. OShea, H. Kedar, and W. Hofbauer |
Microelectronics Reliability
|
| 2007- |
期刊論文
|
Root cause analysis based maintenance policy |
C. M. Tan and N. Raghavan |
International Journal of Quality and Reliability Management
|
| 2007- |
期刊論文
|
Size, temperature and bond nature dependence of elasticity and its derivatives on extensibility, debye temperature, and heat capacity of nanostructures |
M. X. Gu, C. Q. Sun, Z. Chen, T. C. A. Yeung, S. Li, C. M. Tan, and V. Nosik |
Physical Review B
|
| 2007- |
期刊論文
|
Unveiling the electromigration physics of ULSI interconnects through statistics |
C. M. Tan and N. Raghavan |
Semiconductor Science and Technology
|
| 2007- |
研討會論文
|
An approach to statistical analysis of gate oxide breakdown mechanisms |
C. M. Tan and N. Raghavan |
|
| 2007- |
研討會論文
|
Blech effect in Cu interconnects with oxide and low-k dielectrics |
Y. Hou and C. M. Tan |
|
| 2007- |
研討會論文
|
Electromigration in ULSI Interconnection |
C. M. Tan |
|
| 2007- |
研討會論文
|
Electromigration in ULSI Interconnection (Keynote) |
C. M. Tan |
|
| 2007- |
研討會論文
|
Enhanced finite element modelling of Cu electromigration using ANSYS and Matlab |
W. Li and C. M. Tan |
|
| 2007- |
研討會論文
|
Finite element modeling of capacitive coupling voltage contrast |
C. M. Tan, S. Yanuar, and T. C. Chai |
|
| 2007- |
研討會論文
|
Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data |
C. M. Tan and F. He |
|
| 2007- |
研討會論文
|
Room temperature observation of point defect on gold surface using thermovoltage mapping |
A. Roy, C. M. Tan, S. OShea, and W. Hofbauer |
|
| 2007- |
研討會論文
|
Statistical analysis of multi-censored electromigration data using the EM algorithm |
N. Raghavan and C. M. Tan |
|
| 2007- |
研討會論文
|
The physical limit and manufacturability of power diode with carrier lifetime control |
C. M. Tan, L. Sun, N. Raghavan, G. Huang, C. Hsu, and C. Wang |
|
| 2006- |
期刊論文
|
Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification |
M. X. Gu, T. C. A. Yeung, V. Nosik, and C. M. Tan |
Journal of Applied Physics
|
| 2006- |
期刊論文
|
Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding |
C. M. Tan, W. Yu, and W. Jun |
Applied Physics Letters
|
| 2006- |
期刊論文
|
Development of highly accelerated electromigration test |
C. M. Tan, W. Li, K. T. Tan, and F. Low |
Microelectronics Reliability
|
| 2006- |
期刊論文
|
Device level electrical-thermal-stress coupled-field modeling |
G. Huang and C. M. Tan |
Microelectronics Reliability
|
| 2006- |
期刊論文
|
Electromigration in damascene copper interconnects of line width down to 100 nm |
A. Roy, R. Kumar, C. M. Tan, T. Wong, and C. H. Tung |
Semiconductor Science and Technology
|
| 2006- |
期刊論文
|
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect |
A. Roy and C. M. Tan |
Microelectronics Reliability
|
| 2006- |
期刊論文
|
Feasibility study of the application of voltage contrast to printed circuit board |
C. M. Tan, Z. Gan, and T.C. Chai |
Microelectronics Reliability
|
| 2006- |
期刊論文
|
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects |
C. M. Tan and A. Roy |
Thin Solid Films
|
| 2006- |
期刊論文
|
Low temperature sol-gel intermediate layer wafer bonding |
C. M. Tan, S. Deng, J. Wei, W. B. Yu, S. M. L. Nai, and H. Xie |
Thin Solid Films
|
| 2006- |
研討會論文
|
A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry |
C. M. Tan and N. Raghavan |
|
| 2006- |
研討會論文
|
A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs,” |
N. Raghavan, N. Hwang, and C. M. Tan. |
|
| 2006- |
研討會論文
|
A cost model for the predictive maintenance policy of a multi-state system |
C. M. Tan and N. Raghavan |
|
| 2006- |
研討會論文
|
Development of highly accelerated electromigration test |
C. M. Tan, W. Li, K. T. Tan, and F. Low. |
|
| 2006- |
研討會論文
|
Device level electrical-thermal-stress coupled-field modeling |
G. Huang and C. M. Tan |
|
| 2006- |
研討會論文
|
Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling |
W. Li and C. M. Tan |
|
| 2006- |
研討會論文
|
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect |
A. Roy and C. M. Tan |
|
| 2006- |
研討會論文
|
Mapping of solder mask covered interconnects on high density printed circuit board |
C. M. Tan, Y. X. Tay, C. W. Goh, and T. C. Chai |
|
| 2006- |
研討會論文
|
ULSI Interconnect Reliability(Invited) |
C.M. Tan |
|
| 2005-12 |
研討會論文
|
Maintenance policy for predictive maintenance (Invited) |
C. M. Tan |
|
| 2005- |
期刊論文
|
Current crowding effect on copper dual damascene via bottom failure for ULSI applications |
C. M. Tan, A. Roy, A. V. Vairagar, A. Krishnamoorthy, and S. G. Mhaisalkar |
IEEE Transactions on Device and Materials Reliability
|
| 2005- |
期刊論文
|
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications |
C. M. Tan, Z. Gan, W. F. Ho, S. Chen, and R. Liu |
Microelectronics Reliability
|
| 2005- |
期刊論文
|
Effect of medium vacuum on low temperature wafer bonding |
W. B. Yu, C. M. Tan, J. Wei, S. S. Deng, and G. Huang |
Journal of Micromechanics and Microengineering
|
| 2005- |
期刊論文
|
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects |
C. M. Tan, A. Roy, K. T. Tan, D. Sim, K. Ye, and F. Low |
Microelectronics Reliability
|
| 2005- |
期刊論文
|
Humidity study of a-Si PV cell |
C. M. Tan, B. K. Chen, and K. P. Toh |
Microelectronics Reliability
|
| 2005- |
期刊論文
|
Investigation of weight-on-wheel switch failure in F-16 aircraft |
C. M. Tan, K. M. Ang, L. H. Tay, and Y. M. Tan |
Engineering Failure Analysis
|
| 2005- |
期刊論文
|
Mathematical model for low-temperature wafer bonding under medium vacuum and its application |
W. B. Yu, J. Wei, and C. M. Tan. |
IEEE Transactions on Advanced Packaging
|
| 2005- |
期刊論文
|
Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc |
Z. Gan, G. Yu, Z. Zhao, C. M. Tan, and B. K. Tay |
Journal of the American Ceramic Society
|
| 2005- |
期刊論文
|
Mechanism of sol-gel intermediate layer low temperature wafer bonding |
C. M. Tan, S. Deng, J. Wei, and W. B. Yu. |
Journal of Physics D-Applied Physics
|
| 2005- |
期刊論文
|
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist |
C. M. Tan, K. P. Lim, T. C. Chai, and J. Lim |
Microelectronics Reliability
|
| 2005- |
期刊論文
|
Reliability screening through electrical testing for press-fit alternator power diode in automotive application |
C. M. Tan, J. Chiu, R. Liu, and G. Zhang |
Microelectronics Reliability
|
| 2005- |
期刊論文
|
Study of carbon in thermal oxide formed on 4H-SiC by XPS |
P. Zhao, E. Rusli, J. H. Xia, C. M. Tan, Y. Liu, C. C. Tin, S. F. Yoon, W. G. Zhu, and J. Ahn |
Silicon Carbide and Related Materials 2004, Material Science Forum
|
| 2005- |
期刊論文
|
Temperature dependence of the field emission of multiwalled carbon nanotubes |
C. M. Tan, J. J. Jia, and W. Yu |
Applied Physics Letters
|
| 2005- |
期刊論文
|
“Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures |
A. Roy, C. M. Tan, R. Kumar, and X. T. Chen |
Microelectronics Reliability
|
| 2005- |
研討會論文
|
Device temperature and stress distributions in power diode - a finite element method |
G. Huang and C. M. Tan |
|
| 2005- |
研討會論文
|
Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film |
C. M. Tan, J. Jia, L. K. Ang, K. T. Ng, and Y. C. Foo |
|
| 2005- |
研討會論文
|
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures |
A. Roy, C. M. Tan, R. Kumar, and X. T. Chen |
|
| 2005- |
研討會論文
|
Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects |
C. M. Tan, A. Roy, K. T. Tan, D. S. K. Ye, and F. Low |
|
| 2005- |
研討會論文
|
Examine the impact of maintenance policy for predictive maintenance |
N. Raghavan and C. M. Tan |
|
| 2005- |
研討會論文
|
Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure |
A. Roy and C. M. Tan |
|
| 2005- |
研討會論文
|
Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board |
K. P. Lim, J. Lim, C. M. Tan, and T. C. Chai |
|
| 2005- |
研討會論文
|
Is electron wind force the sole driving force in electromingration of ULSI interconnection? |
C. M. Tan |
|
| 2005- |
研討會論文
|
Is electron wind force the sole driving force in electromingration of ULSI interconnection? (Invited) |
C. M. Tan |
|
| 2005- |
研討會論文
|
Maintenance policy for predictive maintenance |
C. M. Tan |
|
| 2005- |
研討會論文
|
Making wafer bonding viable for mass production |
C. M. Tan, W. B. Yu, and J. Wei |
|
| 2005- |
研討會論文
|
New analysis technique for time to failure data in copper electromigration |
C. M. Tan, V. A. Anand, G. Zhang, A. Krishnamoorthy, and S. Mhaisalkar |
|
| 2005- |
研討會論文
|
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist |
C. M. Tan, T. C. Chai, J. Lim, and K. P. Lim |
|
| 2005- |
研討會論文
|
Predictive maintenance and its impact to business decision |
C. M. Tan |
|
| 2005- |
研討會論文
|
Predictive maintenance and its impact to business decision (Invited) |
C. M. Tan |
|
| 2005- |
研討會論文
|
Reliability screening through electrical testing for press-fit alternator power diode in automotive application |
C. M. Tan, J. Chiu, R. Liu, and G. Zhang |
|
| 2005- |
研討會論文
|
Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature |
Wei, J.; Deng, S.S.; Tan, C.M. |
|
| 2005- |
研討會論文
|
Stress migration reliability of wide Cu interconnects with Gouging Vias |
Y. K. Lim, A. Roy, K. L. Pey, C. M. Tan, C. S. Seet, T. J. Lee, and D. Vigar |
|
| 2004-09 |
期刊論文
|
Study of interactions between α-Ta films and SiO2 under rapid thermal annealing |
Yuan, Z.L.; Zhang, D.H.; Li, C.Y.; Prasad, K.; Tan, C.M. |
Thin Solid Films
|
| 2004-09 |
期刊論文
|
Thermal stability of Cu/α-Ta/SiO2/Si structures |
Yuan, Z.L.; Zhang, D.H.; Li, C.Y.; Prasad, K.; Tan, C.M. |
Thin Solid Films
|
| 2004-06 |
研討會論文
|
Determining maintenance strategy from root cause analysis and reliability data analysis (Invited) |
C. M. Tan, B. K. Khoo, and J, Png |
|
| 2004-05 |
研討會論文
|
Reliabiilty Analysis and Application with MATLAB (Invited) |
C. M. Tan |
|
| 2004-01 |
研討會論文
|
Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis(FMEA) (Invited) |
C. M. Tan |
|
| 2004-01 |
研討會論文
|
Methodology for Build-in Reliability(Invited) |
Cher Ming Tan |
|
| 2004- |
期刊論文
|
Barrier layer effects on reliabilities of copper metallization |
Z. W. Yang, D. H. Zhang, C. Y. Li, C. M. Tan, and K. Prasad |
Thin Solid Films
|
| 2004- |
期刊論文
|
Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects |
C. M. Tan, G. Zhang, and Z. Gan |
IEEE Transactions on Device and Materials Reliability
|
| 2004- |
期刊論文
|
Identifying key parameters for risk based inspections (RBI) |
C. M. Tan |
Hydrocarbon Asia
|
| 2004- |
期刊論文
|
Influence of applied load on vacuum wafer bonding at low temperature |
W. B. Yu, C. M. Tan, J. Wei, S. S. Deng, and S. M. L. Nai |
Sensors and Actuators A-Physical
|
| 2004- |
期刊論文
|
Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc |
Z. Gan, Y. Zhang, G. Yu, C. M. Tan, S. P. Lau, and B. K. Tay |
Journal of Applied Physics
|
| 2004- |
期刊論文
|
Overcoming intrinsic weakness of ULSI metallization electromigration performances |
C. M. Tan and G. Zhang |
Thin Solid Films
|
| 2004- |
期刊論文
|
Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc |
Z. H. Gan, G. Q. Yu, B. K. Tay, C. M. Tan, Z. W. Zhao, and Y. Q. Fu |
Journal of Physics D-Applied Physics
|
| 2004- |
期刊論文
|
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology |
G. Zhang, C. M. Tan, K. T. Tan, K. Y. Sim, and W. Y. Zhang |
Microelectronics Reliability
|
| 2004- |
期刊論文
|
Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing |
Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, and C. M. Tan |
Thin Solid Films
|
| 2004- |
期刊論文
|
Thermal Stability of Cu/a-Ta/SiO2/Si structures |
Z. L. Yuan, D. H. Zhang, C. Y. Li, J. Sudijono, and C. M. Tan |
Thin Solid Films
|
| 2004- |
期刊論文
|
Thermally induced stress in partial SOI structure during high temperature processing |
Z. Gan and C. M. Tan |
Microelectronic Engineering
|
| 2004- |
研討會論文
|
Application of FMEA for build-in reliability and maintenance |
C. M. Tan, B. K. Khoo |
|
| 2004- |
研討會論文
|
Application of FMEA for build-in reliability and maintenance (Invited) |
C. M. Tan, B. K. Khoo |
|
| 2004- |
研討會論文
|
Building empirical model through simulation a case study |
C. M. Tan and Z. Gan |
|
| 2004- |
研討會論文
|
Current crowding effect on submicron copper dual damascene via bottom failure |
A. Roy and C. M. Tan |
|
| 2004- |
研討會論文
|
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications |
C. M. Tan, Z. Gan, W. F. Ho, S. Chen, and R. Liu |
|
| 2004- |
研討會論文
|
Determining maintenance strategy from root cause analysis and reliability data analysis |
C. M. Tan, B. K. Khoo, and J, Png |
|
| 2004- |
研討會論文
|
Effect of current crowding on copper dual damascene via bottom failure for ULSI applications |
A. Roy, C. M. Tan, V. V. Anand, K. Ahila, G. Zhang, and M. G. Subodh |
|
| 2004- |
研討會論文
|
Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing |
G. Huang, C. M. Tan, Z. Gan, G. Zhang, W. Yu, and W. Jun |
|
| 2004- |
研討會論文
|
Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing |
Guangyu Huang; Cher Ming Tan; Zhenghao Gan; Wei Jun; Guan Zhang; Weibo Yu |
|
| 2004- |
研討會論文
|
Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) |
C. M. Tan. |
|
| 2004- |
研討會論文
|
Industry-university R&D collaboration: expectation and reality |
C. M. Tan, Y. H. Sng, and H. K. Tang |
|
| 2004- |
研討會論文
|
Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer |
J. Wei, S. S. Deng, C. M. Tan, and C. K. Wong. |
|
| 2004- |
研討會論文
|
Low temperature wafer bonding in medium vacuum |
W. B. Yu, J. Wei, C. M. Tan, and S. S. Deng |
|
| 2004- |
研討會論文
|
Low temperature wafer bonding process using sol-gel intermediate layer |
S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, and H. Xie. |
|
| 2004- |
研討會論文
|
New useful information from simple forward I-V measurement of a power diode |
C. M. Tan, Z. Gan, W. F. Ho, R. Liu, and S. Chen |
|
| 2004- |
研討會論文
|
Reliabiilty Analysis and Application with MATLAB |
C. M. Tan |
|
| 2004- |
研討會論文
|
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology |
G. Zhang, C. M. Tan, K. T. Tan, K. Y. Sim, and W. Y. Zhang. |
|
| 2004- |
研討會論文
|
Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer |
S. S. Deng, J. Wei, C. M. Tan, and W. B. Yu |
|
| 2003- |
期刊論文
|
A new method for deposition of cubic Ta diffusion barrier for Cu metallization |
Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, L. J. Tang, and C. M. Tan |
Thin Solid Films
|
| 2003- |
期刊論文
|
Failure mechanisms of aluminum bond pad peeling during thermosonic bonding |
C. M. Tan and Z. Gan |
IEEE Transactions on Device and Materials Reliability
|
| 2003- |
期刊論文
|
Low temperature silicon wafer bonding by sol-gel processing, |
S. S. Deng, J. Wei, C. M. Tan, S. M. L. Nai, W. B. Yu, and H. Xie |
International Journal of Computational Engineering Science
|
| 2003- |
期刊論文
|
Methodology for customers focus build-in reliability |
C. M. Tan |
International Journal of Quality and Reliability Management
|
| 2003- |
期刊論文
|
Non-destructive void size determination in copper metallization under passivation |
Z. Gan, C. M. Tan, and G. Zhang |
IEEE Transactions on Device and Materials Reliability
|
| 2003- |
期刊論文
|
Temperature and stress distribution in the SOI structure during fabrication |
C. M. Tan, Z. Gan, and X. Gao |
IEEE Transactions on Semiconductor Manufacturing
|
| 2003- |
研討會論文
|
A novel technique to re-construct three dimensional void in passivated metal interconnects |
C. M. Tan, Z. Gan, K. Prasad, and D. H. Zhang |
|
| 2003- |
研討會論文
|
Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects |
G. Zhang, C. M. Tan, Z. Gan, K. Prasad, and D. H. Zhang. |
|
| 2003- |
研討會論文
|
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test |
C. M. Tan, A. C. M. Lim, C. T. Y. Tai, G. Zhang, H. S. Park, and S. M. Ong |
|
| 2003- |
研討會論文
|
Effectiveness of delta VF test to detect solder integrity in power diode |
C. M. Tan and Z. Gan |
|
| 2003- |
研討會論文
|
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects |
H. S. Park, J. K. Low, C. M. Tan, and A. See |
|
| 2003- |
研討會論文
|
Growth of carbon nanotubes using ZrFe catalyst layer and their field emission properties |
L. Huang, S. P. Lau, C. M. Tan, Z. Sun, and B. K. Tay |
|
| 2003- |
研討會論文
|
Improving the reverse blocking capability of carrier stored trench-gate bipolar transistor |
C. M. Tan, Y. F. Wong, P. H. Teoh, G. Huang |
|
| 2003- |
研討會論文
|
Influence of applied load on wafer bonding in vacuum |
W. Yu, J. Wei, C. M. Tan, S. Deng, and S. M. L. Nai |
|
| 2003- |
研討會論文
|
Influence of plasma treatment and cleaning on vacuum wafer bonding |
W. Yu, C. M. Tan, J. Wei, S. Deng, and S. M. L. Nai. |
|
| 2003- |
研討會論文
|
Influence of super-thin oxide layer on device fabricated on partial SOI substrate |
W. Yu, C. M. Tan, and G. Zhang |
|
| 2003- |
研討會論文
|
Investigation of the physical processes during electromigration of ULSI interconnection |
C. M. Tan and G. Zhang |
|
| 2003- |
研討會論文
|
Investigation of the physical processes during electromigration of ULSI interconnection (Invited) |
C. M. Tan and G. Zhang |
|
| 2003- |
研討會論文
|
Low temperature Wafer bonding(Invited) |
C. M. Tan |
|
| 2003- |
研討會論文
|
Low temperature silicon wafer bonding by sol-gel processing |
S. S. Deng, J. Wei, C. M. Tan, S. M. L. Nai, H. Xie, and W. B. Yu |
|
| 2003- |
研討會論文
|
Overcoming intrinsic weakness of ULSI metallization on electromigration performances |
C. M. Tan and G. Zhang |
|
| 2003- |
研討會論文
|
Reliability Data Analysis(Invited) |
C. M. Tan |
|
| 2003- |
研討會論文
|
Silicon-to-silicon wafer bonding efficiency by sol-gel process |
S. S. Deng, C. M. Tan, J. Wei, S. M. L. Nai, and W. B. Yu |
|
| 2003- |
研討會論文
|
Study of interaction between a-Ta films and SiO2 under rapid thermal annealing |
Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, L. J. Tang, C. M. Tan, R. Kumar, and P.D. Foo |
|
| 2002- |
期刊論文
|
Application of wigner-ville distribution in electromigration noise analysis |
C. M. Tan and S. Y. Lim |
IEEE Transactions on Device and Materials Reliability
|
| 2002- |
期刊論文
|
Metastability in tritiated amorphous silicon |
S. Zukotynski, F. Gaspari, N. Kherani, T. Kosteski, K. Law, W. T. Shmayda, C. M. Tan |
Journal of Non-Crystalline solids
|
| 2002- |
研討會論文
|
Characterization of a-Ta diffusion barrier for copper metallization |
Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, C. M. Tan, R. Kumar, and P. D. Foo |
|
| 2002- |
研討會論文
|
Cubic Ta diffusion barrier layers for Cu metallization |
Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, C. M. Tan, Y. J. Yuan, P. W. Lu, R. Kumar, and P. D. Foo |
|
| 2002- |
研討會論文
|
Diffusion studies of Cu in Si and low-k dielectric materials |
K. Prasad, X. L. Yuan, C. M. Tan, D. H. Zhang, C. Y. Li, S. R. Wang, S. Y. J. Yuan, J. L. Xie, D. Gui, and P. D. Foo |
|
| 2002- |
研討會論文
|
Improvement of Ta diffusion barrier by NH3 plasma pre-treatment |
Z. L. Yuan, C. Y. Lia, D. H. Zhang, K. Prasad, C. M. Tan, Y. J. Yuan, P. W. Lu, R. Kumar, and P. D. Foo |
|
| 2002- |
研討會論文
|
Novel rapid nondestructive technique for locating tiny voids in metallization line |
Z. Gan, C. M. Tan, K. Prasad, D. H. Zhang, and G. Zhang |
|
| 2002- |
研討會論文
|
QFD implementation in a discrete semiconductor industry |
T. K. Neo and C. M. Tan |
|
| 2002- |
研討會論文
|
Reliability Data Analysis(Keynote) |
Cher Ming Tan |
|
| 2001- |
期刊論文
|
A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT) |
C. M. Tan and K. N. C. Yeo |
Journal of Electronic Testing-Theory and Applications
|
| 2001- |
研討會論文
|
Analysis of electromigration test data |
C. M. Tan, W. L. See, and J. K. C. Tey |
|
| 2001- |
研討會論文
|
Backside copper contamination issues in CMOS integrated circuits |
K. Prasad, D. H. Zhang, C. M. Tan |
|
| 2001- |
研討會論文
|
Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures |
S. W. Loh, D. H. Zhang, C. Y. Li, R. Liu, A. T. S. Wee, K. Prasad, C. M. Tan, Y. K. Lee, P. D. Foo, and J. Xie |
|
| 2001- |
研討會論文
|
Metastability in tritiated amorphous silicon |
S. Zukotynski, F. Gaspari, N. Kherani, T. Kosteski, K. Law, W. T. Shmayda, and C. M. Tan |
|
| 2001- |
研討會論文
|
Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis, |
S. Y. Lim, C. M. Tan, K. Prasad, and D. H. Zhang |
|
| 2000- |
研討會論文
|
A new quality control parameter in wafer fabrication for wire bonding integrity |
C. M. Tan and G. Zhang |
|
| 2000- |
研討會論文
|
Integrating device modeling in QFD implementation for power electronics applications |
T. K. Neo and C. M. Tan |
|
| 2000- |
研討會論文
|
Reliability data analysis software development |
G. Zhang and C. M. Tan |
|
| 2000- |
研討會論文
|
Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT) |
C. M. Tan and K. N. C. Yeo. |
|
| 2000- |
研討會論文
|
Selection of failure time within test time interval for group reliability data analysis |
G. Zhang and C. M. Tan |
|
| 1999- |
期刊論文
|
Effect of BOE etching time on wire bonding quality |
C. M. Tan |
IEEE Transactions on Components and Packaging Technologies
|
| 1999- |
期刊論文
|
Using power diode models for circuit simulations - a comprehensive review |
C. M. Tan and K. J. Tseng |
IEEE Transactions on Industrial Electronics
|
| 1999- |
研討會論文
|
Thermal stress distribution in the SOI structure |
X. F. Gao, C. M. Tan, and W. L. Goh |
|
| 1998- |
期刊論文
|
Failure analysis of bond pad metal peeling using FIB and AFM |
C. M. Tan, E. Er, Y. Hua, and V. Chai |
IEEE Transactions on Components and Packaging Technologies
|
| 1995- |
研討會論文
|
Computerization of quality control in electronics components industry |
C. M. Tan. |
|
| 1992- |
期刊論文
|
Electronic properties of n-i-n-i doping superlattices |
C. M. Tan, J. M. Xu, and S. Zukotynski |
Journal of Applied Physics
|
| 1991- |
期刊論文
|
Assessment of the performance potential of a quantum resonant tunneling structure under current density constraint |
C. M. Tan and J. Xu |
International Journal of Electronics
|
| 1990- |
期刊論文
|
Effect of Current Density on the Electrochemical Dissolution of Germanium and Zinc Selenide |
C. M. Tan, S. Zukotynski, and H. Mar |
Journal of the Electrochemical Society
|
| 1990- |
期刊論文
|
Study of resonant tunneling structures: a hybrid incremental airy function plane wave approach |
C. M. Tan, J. Xu, and S. Zukotynski |
Journal of Applied Physics
|
| 1989- |
期刊論文
|
Single Wafer Miniature Hall-Effect Keyboard |
C. M. Tan and S. Zukotynski. |
IEEE Transactions on Industrial Electronics
|
