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研究人才詳細資料


出版年月 著作類別 著作名稱 作者 收錄出處
2024-02 期刊論文 Additive-free electroless deposition on graphene/copper foil: Photo-induced and defect-assisted approach for environmentally friendly plating Chen H.-C.; Shabir A.; Tu K.-H.; Tan C.M.; Chiu W.-H.; Fan R.-C.; Baruah N.A. Journal of Environmental Chemical Engineering
2024-02 期刊論文 Realizing SnF2-TMAB passivated lead-free formamidinum perovskite solar cells with doctor-bladed carbon electrode Debesh Devadutta Mishra, Pranati Kumari Rath, Natarajan Thirugnanam, Tao Shen, Zihe Chen, Zexian Zhang, Xinghang Liu, Jinhua Li, Xianbao Wang, Cher Ming Tan Progress in Photovoltaics
2023-12 期刊論文 Degradation Physics of Silicone Under UV-A Irradiation Shabir A.; Tan C.M.; Singh P. IEEE Transactions on Device and Materials Reliability
2023-08 期刊論文 Compositionally engineered vacancy-ordered double-perovskite nanocrystals for photovoltaic application. Anurag Dehingia, Abdul Shabir, Cher Ming Tan, Himadri Priya Gogoi, Ujjal Das f, Asim Roy Journal of Alloys and Compounds.
2023-06 期刊論文 Investigation of the reliability of nano-nickel/niobium oxide-based multilayer thin films deposited on polymer substrates for flexible electronic applications Rahul Sahay, Yen-Cheng Tu, Izzat Aziz, Arief S. Budiman, Cher Ming Tan, Pooi See Lee, Olivier Thomas, Nagarajan Raghavan Materials Advances
2023-04 期刊論文 Alkali Metal Ion-Mediated Augmented Carrier Extraction in Iodobismuth Ternary Perovskite-Based Photovoltaic Device Anurag Dehingia, Abdul Shabir, Ujjal Das, Karabi Kanchan Borgohain, Snigdha Patra, Pranab Kumar Sarkar, Cher Ming Tan, Asim Roy ACS Applied Electronic Materials
2023-01 期刊論文 Development of Cu-based ternary nanocrystalline chalcogenides using mechanical alloying and their characterization Debesh Devadutta Mishra, Cherming Tan, Qishu Xu, Huihui Zhang & Guolong Tan Journal of Materials Research
2022-10 專書 Degradation Analysis of Silicone as Encapsulation and Molding Material in High Power LEDs Shabir, Abdul, and Cher Ming Tan
2022-09 期刊論文 Moisture dependent degradation rate of silicone in LED optical housing material–ab-initio modelling Shabir Abdul, and Cher Ming Tan IEEE Transactions on Device and Materials Reliability
2022-09 專書 Reliability and Failure Analysis of High-Power LED Packaging Tan Cher Ming, Singh Preetpal
2022-07 期刊論文 Atomic drift-less electromigration model for submicron copper interconnects Adhikari, Aparna, Arijit Roy, and Cher Ming Tan https://ymerdigital.com/
2022-05 期刊論文 Strong Correlation between the Dynamic Chemical State and Product Profile of Carbon Dioxide Electroreduction Jiali Wang, Hsiao-Chien Chen*, Hui-Ying Tan, Cher Ming Tan, Yanping Zhu, and Hao Ming Chen* ACS Applied Materials & Interfaces
2022-04 期刊論文 Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices Tan, Cher-Ming Applied Sciences
2022-03 期刊論文 Statistical distribution of Lithium-ion batteries useful life and its application for battery pack reliability Shuen-Lin Jeng, Cher Ming Tan, Ping-Chia Chen Journal of Energy Storage
2022-01 期刊論文 Root Cause Analysis of a Printed Circuit Board (PCB) Failure in a Public Transport Communication System Tan, C. M., Chen, H. H., Wu, J. P., Sangwan, V., Tsai, K. Y., & Huang, W. C Applied Sciences
2021-12 期刊論文 Degradation dynamics of quantum dots in white LED applications. Chen, H. C., Shabir, A., Tan, C. M., Singh, P., & Lin, J. H Scientific reports
2021-10 期刊論文 Electronic Reliability Analysis Under Radiation Environment Cher Ming Tan, Vimal Kant Pandey, Yueh Chiang, and Tsung Ping Lee Sensors and materials
2021-10 專書 Graphene and VLSI Interconnects Tan, Cher Ming, Udit Narula, Vivek Sangwan Jenny Stanford
2021-09 期刊論文 Effect of resistor tolerance on the performance of resistor network—An application of the statistical design of experiment Pandey, Vimal Kant, and Cher Ming Tan International Journal of Circuit Theory and Applications
2021-08 期刊論文 Impact of visible light and humidity on the stability of high-power light emitting diode packaging material. Shabir, Abdul, and Cher Ming Tan Journal of Applied Physics
2021-06 期刊論文 Application of Gallium Nitride Technology in Particle Therapy Imaging V. K. Pandey, C. M. Tan IEEE Transactions on Nuclear Science
2021-06 期刊論文 Effect of 150 MeV protons on carbon nanotubes for fabrication of a radiation detector Pandey, Vimal Kant, Cher Ming Tan, Sunjin Kim, Preetpal Singh, Vivek Sangwan, Jin-Woo Han, and M. Meyyappan Nanotechnology
2021-06 期刊論文 GaN‐Based Readout Circuit System for Reliable Prompt Gamma Imaging in Proton Therapy Pandey, Vimal Kant, Cher Ming Tan, and Sangwan, Vivek Applied Sciences
2021-02 期刊論文 Statistical Method and Non-Destructive Analytical Tools in the Failure Analysis of LED Array Preetpal Singh, Cher Ming Tan ECS Journal of Solid State Science and Technology
2021-01 期刊論文 Lineal Energy of Proton in Silicon by a Microdosimetry Simulation Yueh Chiang; Cher Ming Tan; Chuan-Jong Tung; Chung-Chi Lee; Tsi-Chian Chao Applied Sciences
2021-01 期刊論文 Root Cause Analysis of a Printed Circuit Board (PCB) Failure in a Public Transport Communication System Tan, C. M., Chen, H. H., Wu, J. P., Sangwan, V., Tsai, K. Y., & Huang, W. C Applied Sciences
2021-01 研討會論文 2021 International Conference on Sustainable Energy and Future Electric Transportation (SEFET) Loganathan MK, Cher Ming Tan, I-Yun Lisa Hsieh, Sahnin Sultana, Kumaraswamidhas L. A. and Rai R.N
2020-12 研討會論文 Design of GaN based comparator circuit for radiation detectors Pandey, Vimal Kant, Cher Ming Tan, and Sandeep Sharma
2020-11 期刊論文 Assessing Multi-Output Gaussian Process Regression for Modeling of Non-Monotonic Degradation Trends of Light Emitting Diodes in Storage Sze Li Harry Lim, Duong Pham, Hyunseok park, Preetpal Singh, Cher Ming Tan and Nagarajan Raghavan Microelectronics Reliability
2020-09 期刊論文 Accurate Real Time On-Line Estimation of State-of-Health and Remaining Useful Life of Li ion Batteries. Tan, C.M.; Singh, P.; Chen, C. Applied Sciences 2020
2020-08 期刊論文 Analytical modeling electrical conduction in resistive-switching memory through current-limiting-friendly combination frameworks Qishen Wang; Karthekeyan Periasamy; Yi Fu2, Ya-Ting Chan2; Cher Ming Tan; Natasa Bajalovic; Jer-Chyi Wang; Desmond K. Loke AIP Advances
2020-08 期刊論文 In-situ Characterization of the Defect Density in Reduced Graphene Oxide under Electrical Stress Using Fluorescence Microscopy Zequn Zeng, Preetpal Singh, Sharon Lim Xiaodai, Cher Ming Tan and Chorng Haur Sow International Journal of Nanotechnology
2020-08 期刊論文 Multi-Criteria Decision Making (MCDM) for the selection of Li-Ion batteries used in Electric Vehicles (EVs) M.K.Loganathan, Bikash Mishra, Cher MingTan, TrondKongsvik, R.N.Rai Materials Today: Proceedings
2020-05 期刊論文 Investigate the Equivalence of Neutrons and Protons in Single Event Effects Testing: A Geant4 Study. Chiang, Y.; Tan, C.M.; Chao, T.-C.; Lee, C.-C.; Tung, C.-J. Appl. Sci. 2020
2020-04 期刊論文 Optimization of a T-Shaped MIMO Antenna for Reduction of EMI. Kapoor, D.; Sangwan, V.; Tan, C.M.; Paliwal, V.; Tanwar, N. Applied Sciences 2020
2020-01 期刊論文 Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits Dipesh Kapoor, Cher Ming Tan, and Vivek Sangwan Applied Sciences 10
2019-12 研討會論文 Review and selection of advanced battery technologies for post 2020 era electric vehicles M. K. Loganathan, C. M. Tan, B. Mishra, T. A. M. Msagati, and L. W. Snyman
2019-11 期刊論文 Electromagnetic Induced Failure in GaN-HEMT High Frequency Power Amplifier Vivek Sangwan, Cher Ming Tan, Dipesh Kapoor, Hsien-Chin Chiu IEEE Transaction on Industrial Electronics
2019-11 期刊論文 Moisture Resistance Evaluation on Single Electronic Package Moulding Compound C. M. Tan, U. Narula, G. L. Seow, V. Sangwan, C. H. Chen, S. P. Lin, J. Y. Chen Journal of Materials Chemistry C
2019-09 研討會論文 Multi-Criteria Decision Making (MCDM) for the selection of Li-Ion batteries used in Electric Vehicles (EVs) M. K. Loganathan, B. Mishra, and C. M. Tan
2019-07 期刊論文 Semi-Empirical capacity fading model for SoH estimation of Li-Ion Batteries Preetpal Singh, Che Chen, Cher Ming Tan, Shyh-Chin Huang Applied Sciences
2019-06 期刊論文 Investigation of the impact of Drive current and phosphor thickness on the reliability of High Power White LED lamp Preetpal Singh, Cher Ming Tan, Wenyu Zhao, Hao-Chung Kuo IEEE Transactions on Device and Materials Reliability
2019-05 期刊論文 Pulse Oximeter for Low SpO2 Level Detection Using Discrete Time Signal Processing Algorithm Sumit Pandey, Cher Ming Tan, Hsiao-Wen Chen, Yao En Xie, Jung Hua Tung, Yu-Chuan Kau, Chia-Chih Liao Journal of Medical Devices
2019-04 期刊論文 High Frequency Electromagnetic Simulation and Optimization for GaN-HEMT Power Amplifier IC Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan, Chia Han Lin, and Hsien Chin Chiu IEEE Transactions on Electromagnetic Compatibility
2019-04 研討會論文 Additional IC Layout Rule from the Perspective of Electromagnetic Emissions for High Frequency Integrated Circuits Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan
2019-03 研討會論文 Investigate the equivalence of neutrons and protons in Single Event Effects testing – A Geant4 study Yueh Chiang, Cher Ming Tan*, Tsi-Chian Chao, Chung-Chi Lee, and Chuan-Jong Tung
2019-02 期刊論文 Optimal Maintenance Strategy on Medical Instruments used for Haemodialysis Process Cher Ming Tan, Udit Narula, Lu An Lai, Sumit Pandey, Jung Hua Tung, Chung Yi Li Eksploatacja i Niezawodnosc-Maintenance and Reliability
2019- 期刊論文 Electromagnetic Hotspots Identification in Integrated Circuits Dipesh Kapoor, Vivek Sangwan, Cher Ming Tan Progress in Electromagnetics Research (PIER) Letters
2018-12 研討會論文 Process safety and performance improvement in oil refineries through active redundancy and risk assessment method- A case study M. K. Loganathan, Sunil Rai, S. S. Neog, C. M. Tan
2018-11 研討會論文 Degradation Mechanisms for CdSe Quantum dot down converted LEDs Preetpal Singh, Cher Ming Tan, Hao-Chung Kuo
2018-10 期刊論文 Time evolution of packaged LED lamp degradation in outdoor applications Preetpal Singh, Cher Ming Tan Optical Materials
2018-10 研討會論文 Graphene as a Reducing Agent for Electroless Plating of Metal Udit Narula, Cher Ming Tan, Eng Soon Tok
2018-09 期刊論文 Optimization of sandblasting process of complex 3D surface polishing using variable viscoelastic diamond particles abrasive J. H. Tung, C. S. Chen, W. Y. Zhao, C. M. Tan Machining Science and Technology
2018-08 研討會論文 Reliability Ranking of Nodes: A Case of Revolution." Progress in Electromagnetics Research Symposium (PIERS) P. Ranjan, H. Pandey, M. R. Tripathy, C. M. Tan, and S. Pushp
2018-07 期刊論文 Moisture resistance coating for high power white leds using diamond like carbon P. Singh, C. M. Tan, C. W. Liu, C. R. Lin, J. H. Tung Archives of Physics Research
2018-07 期刊論文 Qualitative Analysis of Growth Parameters for Low Temperature Graphene Synthesis using Design-of-Experiments Udit Narula, Cher Ming Tan* Frontiers in Materials
2018-06 研討會論文 Implementation of Predictive Maintenance Strategy on Hemodialysis Machines Cher Ming Tan, Udit Narula, Jung Hua Tung, Lu An Lai, Sumit Pandey, Chung Yi Li
2018-05 期刊論文 High Frequency Electromagnetic Simulation and Optimization for GaN-HEMT Power Amplifier IC Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan, Chia Han Lin, and Hsien Chin Chiu IEEE Transactions on Electromagnetic Compatibility
2018-05 期刊論文 Metal on Graphenated-Metal for VLSI Interconnects Udit Narula, Cher Ming Tan*, Eng Soon Tok Advanced Materials Interfaces
2018-05 研討會論文 Electromagnetic Emissions from GaN Power IC at Varying Distance and Frequency Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan
2018-05 研討會論文 Optimization of sandblasting process of complex 3D surface polishing using variable viscoelastic diamond particles abrasive J. H. Tung, C. S. Chen, W. Y. Zhao and C. M. Tan
2018-05 研討會論文 Photo- modification and photo- oxidation effect on CdSe Quantum dot down converted LED’s lifetime. Preetpal Singh, Cher Ming Tan and Hao-Chung Kuo
2018-04 研討會論文 A Miniaturized T-Shaped MIMO Antenna for X-Band and Ku-Band Applications With Enhanced Radiation Efficiency Nirdosh, Cher Ming Tan, Malay Ranjan Tripathy
2018-03 期刊論文 RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation Ying-Chang Li, Yuan-Hsiao Chang, Preetpal Singh, Liann-Be Chang *,Der-Hwa Yeh, Ting-Yu Chao, Si-Yun Jian, Yu-Chi Li, Cher-Ming Tan, Chao-sung Lai, Lee Chow, Shang-Ping Ying Materials
2018-01 期刊論文 Physical Limitations of Phosphor layer thickness and concentration for White LEDs Cher Ming Tan, Preetpal Singh, Wenyu Zhao, Hao-Chung Kuo Scientific Reports
2017-12 期刊論文 Hierarchical degradation processes in lithium-ion batteries during ageing Feng Leng, Zhongbao Wei, Cher Ming Tan, Rachid Yazami Electrochimica Acta
2017-12 期刊論文 Uncover the degradation science of silicone under the combined temperature and humidity conditions Preetpal Singh and Cher Ming Tan IEEE Access
2017-10 研討會論文 Changing Degradation Mechanisms in Silicon Integrated Circuits(Keynote) Cher Ming Tan
2017-10 研討會論文 Necessity of Quantitative Reliability Evaluation(Invited) Cher Ming Tan
2017-09 研討會論文 Reliability of Solder Interconnect(Keynote) Cher Ming Tan
2017-08 研討會論文 Limitations of Phosphor layer thickness and Drive Current for White LEDs (Invited) Cher Ming Tan, Preetpal Singh, Wenyu Zhao and Hao-Chung Kuo
2017-08 研討會論文 Practicality and Importance of Advanced Reliability Technology to Industry (Invited) Cher Ming Tan
2017-08 研討會論文 Reliability in IoT Era(Keynote) Cher Ming Tan
2017-07 研討會論文 Finite element analysis for the understanding of physics of failure in Microelectronics (Invited) Cher Ming Tan
2017-07 技術報告 Applications of finite element modeling in Reliability Studies (Tutorial) Cher Ming Tan
2017-05 研討會論文 Non destructive examination of Li Ion Battery (Invited) C. M. Tan
2017-04 研討會論文 Applications of Finite Element Modeling in Reliability Studies(Keynote) Cher Ming Tan
2017-03 期刊論文 Growth Mechanism for Low Temperature PVD Graphene Synthesis on Copper Using Amorphous Carbon Udit Narula, Cher Ming Tan, Chao Sung Lai Scientific Reports
2017-03 專書論文 Component-Level Reliability: Physical Models and Testing Regulations C. M. Tan Handbook of Advanced Lighting Technology
2017-02 期刊論文 Engineering a PVD based graphene synthesis method U. Narula, C. M. Tan IEEE Transactions on Nanotechnology
2017-02 研討會論文 Applications of Finite Element Modelling in Reliability (Invited) Cher Ming Tan
2017-02 研討會論文 Challenges in Reliability Screening for High Power Diodes Udit Narula, Cher Ming Tan
2017-02 研討會論文 Predictive Statistical Maintenance and Repair Strategy of Dialysis Machine Jung-Hua Tung and Cher Ming Tan
2017-02 研討會論文 Thermal-humidity degradation mechanisms of silicone in LED Packaging under different environmental conditions Preetpal Singh and Cher Ming Tan
2017-01 專書 Theory and Practice of Quality and Reliability Engineering in Asia Industry C. M. Tan and T. N. Goh
2017-01 專書論文 Overview of Reliability engineering C.M. Tan Theory and practice of quality and reliability engineering in Asia industry
2017-01 專書論文 Quality decision for overcharged Li-Ion battery from reliability and safety perspective F Leng, CM Tan, R Yazami, K Maher, R Wang Theory and practice of quality and reliability engineering in Asia industry
2017-01 專書論文 The Correlation Between Device Aging and System Degradation S Lan, CM Tan Theory and practice of quality and reliability engineering in Asia industry
2017-01 研討會論文 Reliability Paradox for Worldwide Automotive Electronics Cher Ming Tan, Udit Narula, Dipesh Kapoor
2016-11 研討會論文 Degradation Physics of High Power LEDs in Outdoor Applications Cher Ming Tan
2016-11 研討會論文 Degradation Physics of High Power LEDs in Outdoor Applications (Invited) Cher Ming Tan
2016-11 研討會論文 ULSI Interconnection electromigration and its EMI performance Cher Ming Tan
2016-11 研討會論文 ULSI Interconnection electromigration and its EMI performance (Invited) Cher Ming Tan
2016-11 技術報告 Statistical Analysis of Reliability Test Data (Tutorial) Cher Ming Tan
2016-10 研討會論文 Effect of ULSI Interconnect layout on its electromagnetic emission (Invited) Cher Ming Tan
2016-10 研討會論文 Engineering a PVD Based Graphene Synthesis Method Udit Narula, Cher Ming Tan
2016-10 研討會論文 Investigation of LED lumen recovery after the sharp initial lumen degradation using ANSYS finite element modeling and C-SAM Preetpal Singh, Cher Ming Tan
2016-08 研討會論文 Effect of ULSI Interconnect layout on its Electromagnetic Emission Cher Ming Tan, Dipesh Kapoor and Vivek Sagawan
2016-07 期刊論文 Determining the Parameters of Importance of a Graphene Synthesis Process Using Design-of-Experiments Method Udit Narula and Cher Ming Tan Applied Sciences
2016-07 技術報告 Introduction to Reliability (Tutorial) Cher Ming Tan
2016-06 期刊論文 Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules Preetpal Singh , Der-Hwa Yeh , Cher-Ming Tan , Chao-Sung Lai , Chih-Teng Hou , Ting-Yu Chao and Liann-Be Chang Applied Sciences
2016-05 研討會論文 Determination of Key Factors for Low Temperature Graphene Synthesis using Design of Experiments Approach (Invited) Udit Narula, Chao Sung Lai, Cher Ming Tan
2016-05 研討會論文 Graphene as a buffer layer for high quality GaN deposition on substrates in electronics Preetpal Singh, Chao Sung Lai, Cher Ming Tan
2016-05 研討會論文 Simulation of EMI at Design Level for Integrated Circuits Vivek Sangwan, Dipesh Kapoor, Cher Ming Tan
2016-04 期刊論文 Degradation Physics of High Power LEDs in Outdoor Environment and the Role of Phosphor in the degradation process Preetpal Singh, Cher Ming Tan Scientific Report
2016-03 研討會論文 Design of Experiments for Determination of Key Factors for Graphene Synthesis on Copper Using Amorphous Carbon - a statistical approach Udit Narula, Cher Ming Tan, Chao Sung Lai
2016-03 研討會論文 Reliability Paradox of Automotive Electronics(Keynote) Cher Ming Tan, Udit Narula, Dipesh Kapoor
2016-03 技術報告 Statistical Analysis of Reliability Test Data Cher Ming Tan
2016-02 期刊論文 Copper induced synthesis of graphene using amorphous carbon Udit Narula, Cher Ming Tan, Chao Sung Lai Microelectronics Reliability
2016-02 期刊論文 Early degradation of high power packaged LEDs under humid conditions and its recovery — Myth of reliability rejuvenation Preetpal Singh, Cher Ming Tan, Liann-Be Chang Microelectronics Reliability
2016-01 期刊論文 A review on the humidity reliability of high power white light LEDs Preetpal Singh, Cher Ming Tan Microelectronics Reliability
2016-01 期刊論文 Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation Marvin Chan, Cher Ming Tan⁎, Kheng Chooi Lee, Chuan Seng Tan Microelectronics Reliability
2015-11 期刊論文 A review on the humidity Reliability of High Power White light LEDs Preetpal Singh, Cher Ming Tan Microelectronics Reliability
2015-10 期刊論文 Effect of Temperature on the Aging rate of Li Ion Battery Operating above Room Temperature Feng Leng, Cher Ming Tan, Michael Pecht Scientific Report
2015-08 研討會論文 Internal probing into the degradation processes in Lithium-ion batteries under cyclic aging Cher Ming Tan, Leng Feng
2015-08 研討會論文 Internal probing into the degradation processes in Lithiumion batteries under cyclic aging(Invited) Cher Ming Tan and Feng Leng
2015-08 研討會論文 Li Ion Battery Pack Reliability Assurance Cher Ming Tan, Leng Feng
2015-08 研討會論文 Li Ion Battery Pack Reliability Assurance(Keynote) Cher Ming Tan
2015-06 期刊論文 Application of particle filter technique for lifetime determination from degradation study on a LED Driver S. Lan, C.M. Tan IEEE Transactions on Device and Materials Reliability
2015-06 研討會論文 Dependence of test conditions on humidity reliability results for high power LEDs Preetpal Singh, Cher Ming Tan
2015-06 研討會論文 Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability Evaluation J. M. Chan, C. M. Tan, K. C. Lee, W. Kanert, C. S. Tan
2015-06 研討會論文 Thermally Stressed Copper Induced Synthesis of Graphene using Amorphous Carbon Udit Narula, C. S. Lai, C. M. Tan
2015-02 期刊論文 A reliability-based design concept for lithium-ion battery pack in electric vehicles Zhitao Liu, Cher Ming Tan, Feng Leng Reliability Engineering and system safety
2014-11 研討會論文 A methodology for studying the effect of overcharge on the safety of lithium-ion batteries (invited talk) Feng Leng and Cher Ming Tan
2014-11 研討會論文 Copper Catalyzed Crystallization of Amorphous Carbon into Graphene Udit Narula, C. S. Lai, C. M. Tan
2014-11 研討會論文 Exploring the Humidity Effect on the Reliability of High Power LEDs Cher Ming Tan and Preetpal Singh
2014-11 研討會論文 Exploring the Humidity Effect on the Reliability of High Power LEDs(Invited) Cher Ming Tan and Preetpal Singh
2014-10 研討會論文 Revisit resistance monitoring techniques for measuring TSV/Solder resistance During Electromigration test Cher Ming Tan and Udit Narula
2014-09 期刊論文 Degradation Model of a Linear-Mode LED Driver and its Application in Lifetime Prediction Song Lan, Cher Ming Tan IEEE Transactions on Device and Materials Reliability
2014-07 研討會論文 Electromigration simulation at circuit levels Cher Ming Tan
2014-06 期刊論文 Methodology of reliability enhancement for high power LED driver Song Lan, Cher Ming Tan, Kevin Wu Microelectronics Reliability
2014-06 期刊論文 Modeling and analysis of gate-all-around silicon nanowire FET Xiangchen Chen and Cher Ming Tan Microelectronics Reliability
2014-06 期刊論文 Time Evolution Degradation Physics in High Power White LEDs Under High Temperature-Humidity Conditions C.M. Tan and P. Singh IEEE Transactions On Devices and Materials Reliability
2014-06 研討會論文 Extrapolation of lifetime of high power LEDs under temperature-humidity conditions Cher Ming Tan and Preetpal Singh
2014-04 期刊論文 A practical framework of electrical based online state-of-charge estimation of lithium ion batteries Feng Leng, Cher Ming Tan, Rachid Yazami and Minh Duc Le Journal of Power Sources
2014-03 期刊論文 Degradation Model of a Linear Mode LED Driver and its application in Lifetime Prediction Song Lan and Cher Ming Tan IEEE Transactions on Device and Materials Reliability
2014-02 期刊論文 Maintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for high yield etching process M.D. Le, C.M. Tan, M. Luo, I.C.H. Leng IEEE Trans. On Semiconductor Manufacturing
2014- 期刊論文 A reliability based design concept for Lithium-ion battery pack in electric vehicle Zhitao Liu, Cher Ming Tan, Feng Leng Reliability Engineering & System safety
2014- 期刊論文 Ab initio simulation of electronic and mechanical properties of aluminium for fatigue early feature investigation Shuai Zhang, Cher Ming Tan, Shuguang Cheng, Tianqi Deng, Feifei He and Haibin Su International Journal of Nanotechnology
2014- 期刊論文 Damage Threshold Determination and Non-destructive Identification of Possible Failure Sites in PIN Limiter Cher Ming Tan and Wenzhi Yu Microelectronics Reliability
2014- 期刊論文 Degradation mechanisms in gate-all-around silicon Nanowire field effect transistor under electrostatic discharge stress – a modeling approach Cher Ming Tan and Xiangchen Chen Nano-convergence
2014- 研討會論文 A methodology for studying the effect of overcharge on the safety of lithium-ion batteries(Invited) Feng Leng and Cher Ming Tan
2014- 研討會論文 Extending electromigration modeling from test structures to Integrated circuit layout level Cher Ming Tan
2014- 研討會論文 Extending electromigration modeling from test structures to Integrated circuit layout level(Invited) Cher Ming Tan
2014- 研討會論文 Product Reliability Assurance – The manifestation of the Core Values of Chinese Culture Cher Ming Tan
2014- 研討會論文 Product Reliability Assurance – The manifestation of the Core Values of Chinese Culture(Invited) Cher Ming Tan
2014- 研討會論文 Reliability Lifetime Extrapolation of high power LEDs under humidity test – A revisit(Invited) Cher Ming Tan and Preetpal Singh
2014- 研討會論文 Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test(Invited) Cher Ming Tan and Udit Narula
2014- 研討會論文 The effect of temperature on the electrochemistry in Lithium-ion batteries Feng Leng, Cher Ming Tan, Michael Pecht, JiYe Zhang
2013- 期刊論文 Effects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for high power light-emitting diode in switching applications Cher Ming Tan, Sihan Chen, Jacky Kong IEEE Transactions On Nanotechnology
2013- 期刊論文 Electromigration Modeling at Circuit Layout Level C. M. Tan and F. He SpringerBrief on Reliability
2013- 期刊論文 Optimal maintenance strategy of deteriorating system under imperfect maintenance & inspection using mixed inspection scheduling M. D. Le and C. M. Tan Reliability Engineering & System Safety
2013- 期刊論文 Rapid ULSI Interconnect Reliability Analysis Using Neural Networks Yizhen Tian, Feifei He, Qi-Jun Zhang, Cher Ming Tan, Jianguo Ma IEEE Transactions On Devices and Materials Reliability
2013- 期刊論文 Systematic root cause analysis for GaP green light LED degradation C. M. Tan and C. S. Lai. IEEE Transactions On Devices and Materials Reliability
2013- 專書 Electromigration Modeling at Circuit Layout Level C. M. Tan and F. He SpringerBrief on Reliability
2013- 研討會論文 ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device Cher Ming Tan and Xiangchen Chen
2013- 研討會論文 ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device(Invited) Cher Ming Tan and Xiangchen Chen
2013- 研討會論文 Effects of carbon loading on the performance of functionalized carbon nanotube polymer heat sink for ultra high power light-emitting diode S. H. Chen, C. M. Tan, E. Tan, and J. Kong
2013- 研討會論文 Investigation of work function and surface energy of aluminum - an AB-Initio study S. Cheng, C. M. Tan, T. Deng, F. He, S Zhang, and H. Su
2013- 研討會論文 Model the Physics of Micro-crack formation in Alumimum under high temperature cycling(Invited) Cher Ming Tan, Shuai Zhang, Feifei He, Xi Zhu and Haibin Su
2013- 研討會論文 Modeling and Analysis of Gate-All-Around Silicon Nanowire FET Xiangchen Chen and Cher Ming Tan
2013- 研討會論文 Monte Carlo simulation of fatigue crack initiation at elevated temperature F. He and C. M. Tan
2013- 研討會論文 Real Time Monitoring and Characterizing of Li-ion Batteries Aging Feng Leng, Cher Ming Tan, Raghavendra Arunachala, Andreas Jossen
2013- 研討會論文 Reliability Evaluation and Improvement for High Power LED Driver Lan Song and Cher Ming Tan
2012-12 期刊論文 Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief K. Ghosh, J. Zhang, L. Zhang, Y. Dong, H. Li, C. M. Tan, G. Xia, and C. S. Tan Physics Express
2012-11 期刊論文 3D simulation-based research on the effect of interconnect structures on circuit reliability F. He and C. M. Tan. World Journal of Modelling and Simulation
2012-11 研討會論文 3D electromigration modeling at circuit level (Invited) C. M. Tan and F. He
2012-11 研討會論文 Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited) C. M. Tan and C. Fu
2012-11 技術報告 Physics of electromigration in today ULSI interconnections (Tutorial) C. M. Tan
2012-10 期刊論文 Comparison of electromigration simulation in test structure and actual circuit F. He and C. M. Tan Applied Mathematical Modelling
2012-09 期刊論文 Degradation behavior of high power light emitting diode under high frequency switching S. H. Chen, C. M. Tan, G. H. Tan, and F. He Microelectronics Reliability
2012-09 期刊論文 Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints Y.D.Han, H.Y. Jing, S.M.I. Nai, L.Y. Xu, C.M. Tan, J.Wei Journal of Electronic Materials
2012-09 期刊論文 Reliability study of LED driver - a case study of black box testing S. Lan, C. M. Tan, and K. Wu. Microelectronics Reliability
2012-09 研討會論文 Recent Development of Reliability and Maintenance (Invited) C. M. Tan
2012-08 期刊論文 Effect of IC layout on the reliability of CMOS amplifiers F. He and C. M. Tan Microelectronics Reliability
2012-08 期刊論文 Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test S. H. Chen, C. M. Tan, and E. Chen Microelectronics Reliability
2012-08 期刊論文 Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei Intermetallics
2012-07 研討會論文 Study of humidity reliability of solid state lighting (Invited) C. M. Tan
2012-05 期刊論文 Applications of Finite element Methods for Reliability Study of ULSI Interconnections C. M. Tan, W. Li, and Z. Gan Microelectronics Reliability
2012-05 研討會論文 Estimation of SoC/SoH of cell and RUL of battery pack for EV Application (Invited) C. M. Tan, M. D. Le, and F. Leng
2012-05 研討會論文 SoC and SoH Estimation of battery cell and modules for electric vehicles (Keynote) C. M. Tan, M. D. Le, and F. Leng
2012-03 期刊論文 Rapid light output degradation of GaN based packaged LED in the early stage of humidity test C. M. Tan, S. H. Chen, and E. Chen IEEE Transactions On Devices and Materials Reliability
2012-02 期刊論文 Electromigration reliability of interconnections in RF low noise amplifier circuit F. He and C. M. Tan. Microelectronics Reliability
2012- 期刊論文 Applications of multi-walled carbon nanotube in electronic packaging C. M. Tan, C. Baudot, Y. D. Han, and H. Jing Nanoscale Research Letters
2012- 期刊論文 Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan Journal of Materials Science: Materials in Electronics
2012- 期刊論文 Interfacial reaction and shear strength of Ni coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling Y.D Han, H.Y Jing, S.M.L Nai, L.Y. Xu, C.M Tan and J. Wei Intermetallics
2012- 研討會論文 3D electromigration modeling at circuit level C. M. Tan and F. He
2012- 研討會論文 Degradation behaviour of high power light emitting diode under high frequency switching S. H. Chen, C. M. Tan, and G. H. Tan
2012- 研討會論文 Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes C. M. Tan and C. Fu
2012- 研討會論文 Estimation of SoC/SoH of cell and RUL of battery pack for EV Application C. M. Tan, M. D. Le, and F. Leng
2012- 研討會論文 Physics of electromigration in today ULSI interconnections C. M. Tan.
2012- 研討會論文 Recent Development of Reliability and Maintenance C. M. Tan
2012- 研討會論文 Reliability study of LED driver - a case study of black box testing S. Lan, C. M. Tan, and K. Wu
2012- 研討會論文 SoC and SoH Estimation of battery cell and modules for electric vehicles C. M. Tan, M. D. Le, and F. Leng
2012- 研討會論文 Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay K. Ghosh, J. Zhang, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan
2012- 研討會論文 Study of humidity reliability of solid state lighting C. M. Tan.
2012- 研討會論文 TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current J. Zhang, K. Ghosh, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan
2011-10 期刊論文 Comparison of SOI and PSOI LDMOS using electrical-thermal-stress coupled field modeling C. M. Tan and G. Huang IEEE Transactions on Electron Devices
2011-07 期刊論文 Effect of hydrophilicity of carbon nanotube arrays on the release rate and activity of recombinant human bone morphogenetic protein-2 J. H. Zhao, C. M. Tan, K. T. Beng, and S. A. F. Peel Nanotechnology
2011-07 研討會論文 Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited) C. M. Tan, Z. Gan, and W. Li
2011-06 研討會論文 Applications of multi-walled carbon nanotube (Invited) C. M. Tan, C. Baudot, Y. D. Han, and H. Jing
2011-05 期刊論文 Maintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for high yield etching process M.D. Le and C.M. Tan IEEE Trans. On Semiconductor Manufacturing
2011- 期刊論文 Covalent functionalization of carbon nanotubes and their use in dielectric epoxy composites to improve heat dissipation C. Baudot and C. M. Tan Carbon
2011- 期刊論文 Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes Y. D. Han, S. M. L. Nai, H. Y. Jing, L. Y. Xu, C. M. Tan, and J. Wei Journal of Materials Science-Materials in Electronics
2011- 期刊論文 Electrical-thermal-stress coupled-field effect in SOI and partial SOI lateral power diode G. Huang and C. M. Tan IEEE Transactions on Power Electronics
2011- 專書 Applications of finite element methods for reliability studies on ULSI Interconnections C. M. Tan, W. Li, Z. Gan, and Y. Hou Springer Verlag
2011- 研討會論文 Applications of Finite element Methods for Reliability Study of ULSI Interconnections C. M. Tan, Z. Gan, and W. Li
2011- 研討會論文 Applications of multi-walled carbon nanotube C. M. Tan, C. Baudot, Y. D. Han, and H. Jing
2011- 研討會論文 Automated wafer defect map generation for process yield improvement C. M. Tan and K. T. Lau
2011- 研討會論文 Black’s equation for today’s ULSI interconnect electromigration W. Li and C. M. Tan.
2011- 研討會論文 Black’s equation for today’s ULSI interconnect electromigration (Invited) W. Li and C. M. Tan
2011- 研討會論文 Contamination Assessment of Inductive Couple Plasma Etching Chamber under Mixture of Recipes using Statistical Method C. M. Tan and M. D. Le.
2011- 研討會論文 Ensuring Accuracy in Optical and Electrical Measurement of Ultra-Bright LEDs during Reliability Test, S. H. Chen, C. M. Tan, and E. Chen
2011- 研討會論文 On-chip RF energy harvesting circuit for image sensor J. Zhang, X. Y. Zhang, Z. L. Chen, K. Y. See, C. M. Tan, and S. S. Chen.
2011- 研討會論文 Performance evaluation of covalently functionalized carbon nano-tube polymer heat sink for ultra high power LED S. H. Chen, C. M. Tan, M. H. Tan, and B. K. Chen
2010-11 期刊論文 Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy S. Li, A. K. Ng, J. W. Rong, C. M. Tan, Y, Yang, and Y Chen Nanoscale,
2010-11 期刊論文 FTIR spectroscopy as a tool for nano-material characterization C. Baudot, C. M. Tan, and J. C. Kong Infrared Physics & Technology
2010-10 期刊論文 Microstructure and mechanical properties of CrN films fabricated by high power pulsed magnetron discharge plasma immersion ion implantation and deposition Z. Wu, X. Tian, Z. Wang, C. Gong, S. Yang, C. M. Tan, and P. K. Chu Applied Surface Science
2010-06 專書 Electromigration in ULSI Interconnections C. M. Tan World Scientific
2010-02 期刊論文 Interface fracture toughness assessment of solder joints using double cantilever beam test S. Z. Y. Loo, P. C. Lee, Z. X. Lim, N. Yantara, T. Y. Tee, C. M. Tan, and Z. Chen International Journal of Modern Physics B
2010- 期刊論文 Addressing the challenges in solder resistance measurement for electromigration test Y. C. Tan, C. M. Tan, and T. C. Ng Microelectronics Reliability
2010- 期刊論文 Circuit level interconnect reliability study using 3D circuit model F. He and C. M. Tan Microelectronics Reliability
2010- 期刊論文 Electromigration performance of through silicon via (TSV) - A modeling approach Y. C. Tan, C. M. Tan, X. W. Zhang, T. C. Chai, and D. Q. Yu Microelectronics Reliability
2010- 期刊論文 Hot carrier reliability of power SOI EDNMOS J. Liao, C. M. Tan and G. Spierings IEEE Transactions on Power Electronics
2010- 期刊論文 Indentation size effect on the creep behavior of a SnAgCu solder Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei International Journal of Modern Physics B
2010- 期刊論文 Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model, F. He and C. M. Tan. Microelectronics Reliability
2010- 期刊論文 Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder Han, Y.D.; Jing, H.Y.; Nai, S.M.L.; Xu, L.Y.; Tan, C.M.; Wei, J. Journal of Electronic Materials
2010- 期刊論文 Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects C. M. Fu, C. M. Tan, S. H. Wu, and H. B. Yao Microelectronics Reliability
2010- 專書論文 Changing Reliability Physics of Interconnect from Micro- to Nanotechnology Tan Cher Ming and Hou Yuejin Ceramic Integration and Joining Technologies: From Macro to Nanoscale
2010- 研討會論文 A possible reality on battery-less low-power portable electronics C. M. Tan, K. Y. See, J. W. Zhang, M. J. Xu, C. C. Boon, K. S. Yeo, and M. A. Do
2010- 研討會論文 Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes S. M. L Nai, Y. D. Han, H. Y. Jing, L. Y. Xu, C. M. Tan, and J. Wei
2010- 研討會論文 Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder Y. D. Han, L. Y. Xu, H. Y. Jing, C. M. Tan, S. M. L Nai, and J. Wei
2010- 研討會論文 Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency C. M. Tan and N. Raghavan
2010- 研討會論文 Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei
2010- 研討會論文 New Driving Forces in ULSI Electromigration and its implication to IC Designers(Invited) Cher Ming Tan
2010- 研討會論文 Protein immobilization on nanostructured surfaces with different wettability Han, Z.J.; Shakerzadeh, M.; Tay, B.K.; Tan, C.M.
2010- 研討會論文 Study of humidity reliability of high power LEDS C. M. Tan, B. K. Chen, and M. Xiong
2010- 研討會論文 Study of humidity reliability of high power LEDS (Invited) C. M. Tan, B. K. Chen, and M. Xiong
2010- 研討會論文 Wireless energy harvesting using serially connected voltage doublers J. W. Zhang, L. B. Wang, K. Y. See, C. M. Tan, C. C. Boon, K. S. Yeo, and M. A. Do
2009- 期刊論文 A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints Y.D. Han, H.Y. Jing, S.M.L .Nai, C.M. Tan, J. Wei, L.Y Xu, S.R. Zhang Journal of Physics D: Applied Physics
2009- 期刊論文 Analysis of humidity effects on the degradation of high-power white LEDs C. M. Tan, B. K. E. Chen, G. Xu, and Y. Liu Microelectronics Reliability
2009- 期刊論文 Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI) J. Liao, C. M. Tan and G. Spierings Microelectronics Reliability
2009- 期刊論文 Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials Y. Hou and C. M. Tan Semiconductor Science and Technology
2009- 期刊論文 Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects W. Li, C. M. Tan, and N. Raghavan Journal of Applied Physics
2009- 期刊論文 Electromigration in width transition copper interconnect A. Roy, Y. Hou, and C. M. Tan. Microelectronics Reliability
2009- 期刊論文 Electrowetting control of cassie-to-wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites Z. Han, B. Tay, C. M. Tan, M. Shakerzadeh, and K. Ostrikov. ACS Nano
2009- 期刊論文 Local bond average for the size and temperature dependence of elastic and vibronic properties of nanostructures M. Gu, C. Q. Sun, C. M. Tan, and S. Wang International Journal of Nanotechnology
2009- 期刊論文 Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. Tan, and J. Wei International Journal of Nanoscience
2009- 期刊論文 Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems C. M. Tan and N. Raghavan Reliability Engineering & System Safety
2009- 期刊論文 Review of electromigration modeling of IC Interconnects J. G. Ma, M. Yao, and C. M. Tan. Journal of the University of Electronic Science and Technology of China
2009- 期刊論文 Solubility, dispersion and bonding of functionalised carbon nanotubes in epoxy resins C. Baudot and C. M. Tan. International Journal of Nanotechnology
2009- 專書論文 Reliability Assessment of Integrated Circuits and its Misconception C. M. Tan Integrated Circuits, Photodiodes and Organic Field Effect Transistors
2009- 研討會論文 3D circuit model for 3D IC reliability study C. M. Tan and F. He
2009- 研討會論文 3D circuit model for 3D IC reliability study (Invited) C. M. Tan and F. He
2009- 研討會論文 Application of FTIR for the study of functional molecules grafting on carbon nanotubes C. Baudot, C. M. Tan, J. Kong, F. Buonocore, and A. Di-Mateo.
2009- 研討會論文 Comparative study of non-standard power diodes C. M. Tan, L. Sun, N. Raghavan, C. Hsu, and C. Wang
2009- 研討會論文 Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth Y. D. Han, H. Y. Jing, S. M. L. Nai, L. Y. Xu, C. M. TAN, and J. Wei
2009- 研討會論文 Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, and J. Wei
2009- 研討會論文 Extending the useful life of solar cell through Nano TiO2 film coating,” presented at Advanced Materials for Nanotechnology C. M. Tan
2009- 研討會論文 Going green for discrete power diode manufacturing C. M. Tan, L. Sun, and C. Wang
2009- 研討會論文 Indentation size effect on the creep behavior of a Sn-Ag-Cu solder Y. D. Han, H. Y. Jing, S. M. L. Nai, Y. C. Liu, C. M. Tan, J. Wei, and L.Y. Xu
2009- 研討會論文 Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes Y. D. Han, H. Y. Jing, S. M. L. Nai, Y. C. Liu, C. M. Tan, J. Wei, and L. Y. Xu.
2009- 研討會論文 Product Excellence in Global Competitive Market(Invited) C.M. Tan
2009- 研討會論文 Requirement for accurate interconnect temperature measurement for Electromigration test Y. Hou and C. M. Tan
2009- 研討會論文 Solid State Lighting Reliability(Invited) C.M. Tan
2009- 研討會論文 TSV Reliability(Invited) C.M. Tan
2009- 研討會論文 The influence of Nano TiO2 film thickness on its photo-catalytic and hydrophilic properties C. M. Tan, E. Q. Kuan, and R. Cai
2009- 研討會論文 Transient electrical thermal analysis of ESD process using 3-D finite element method Y. Hou and C.M. Tan
2009- 研討會論文 Using nanoparticles and carbon nanotubes to enhance the properties of a lead free solder S. M. L. Nai, Y. D. Han, H. Y. Jing, C. M. Tan, and J. Wei.
2008-06 研討會論文 A holistic numerical modeling for interconnect electromigration (Invited) C. M. Tan and W. Li
2008- 期刊論文 A bimodal 3-parameter lognormal mixture distribution for electromigration failures C. M. Tan and N. Raghavan Thin Solid Films
2008- 期刊論文 A framework to Practical Predictive Maintenance Modeling for Multi-State Systems C. M. Tan and N. Raghavan Reliability Engineering & System Safety
2008- 期刊論文 Stress-induced voiding study in integrated circuit interconnects Y. Hou and C. M. Tan Semiconductor Science and Technology
2008- 期刊論文 Very high current density package level electromigration test for copper interconnects A. Roy and C. M. Tan Journal of Applied Physics
2008- 專書 Simulated Annealing C. M. Tan IN-TECH Publishing
2008- 專書論文 Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing C. M. Tan and N. Raghavan Simulated Annealing
2008- 研討會論文 A holistic numerical modeling for interconnect electromigration C. M. Tan and W. Li
2008- 研討會論文 A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress Y. D. Han, C. M. Tan and W. Jun
2008- 研討會論文 Finite element modeling for Interconnect Reliability Study(Invited) C.M. Tan
2008- 研討會論文 Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system C. M. Tan and Y. Liu.
2008- 研討會論文 Fracture Toughness Assessment of a solder joint using double cantilever beam specimens P. Cheng, A. Lee, Z. X. Lim, N. Yantara, S. Z. Y. Loo, T. Y. Tee, C. M. Tan and Z. Chen
2008- 研討會論文 Humidity effect on the degradation of packaged ultra-bright white LEDs C. M. Tan, B. K. Chen, R. Tew
2008- 研討會論文 Methodologies for size, and temperature dependent change of materials properties M. Gu, C. Q. Sun, C. M. Tan, and S. Wang
2008- 研討會論文 Nano-tailoring of carbon nanotube as nano-fillers for composite materials applications C. Baudot, C. M. Tan, and C. Wang
2008- 研討會論文 Size effect in Cu nano-interconnects and its implication on electromigration Y. Hou and C. M. Tan.
2008- 研討會論文 Statistical modeling of via redundancy effects on interconnect reliability N. Raghavan and C. M. Tan
2008- 研討會論文 The multiple temperature heater platforms for solder Electromigration test conducted at room temperature Y. Hou and C. M. Tan
2008- 研討會論文 Use of high altitude balloon platforms for small satellite testing I. V. McLoughlin, A. M. Prakash, S. Shukla, S. H. Tan, K. Arichandran, C. M. Tan, V. S. Sawant, and R. K. Manchanda.
2008- 技術報告 Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system (Tutorial) C. M. Tan and Y. Liu
2007- 期刊論文 Aligned carbon nanotubes for through-wafer interconnects T. Xu, Z. Wang, J. Miao, X. Chen, and C. M. Tan Applied Physics Letters
2007- 期刊論文 An approach to statistical analysis of gate oxide breakdown mechanisms C. M. Tan and N. Raghavan Microelectronics Reliability
2007- 期刊論文 Application of Gamma Distribution in Electromigration for Submicron Interconnects C. M. Tan, N. Raghavan, and A. Roy Journal of Applied Physics
2007- 期刊論文 Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling W. Li, C. M. Tan, and Y. Hou Journal of Applied Physics
2007- 期刊論文 Electromigration in ULSI Interconnects C. M. Tan and A. Roy Materials Science and Engineering R-Reports
2007- 期刊論文 Enhanced Finite Element Modelling of Cu Electromigration using ANSYS and Matlab W. Li and C. M. Tan Microelectronics Reliability
2007- 期刊論文 Finite element modeling of capacitive coupling voltage contrast C. M. Tan, S. Yanuar, and T. C. Chai Microelectronics Reliability
2007- 期刊論文 Lifetime modeling for stress-induced voiding in integrated circuit interconnections C. M. Tan and Y. Hou Applied Physics Letters
2007- 期刊論文 Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure A. Roy and C. M. Tan Thin Solid Films
2007- 期刊論文 Reverse breakdown voltage measurement for power P+NN+ rectifier C. M. Tan and G. Huang Journal of Electronic Testing-Theory and Applications
2007- 期刊論文 Revisit to the finite element modeling of electromigration for narrow interconnects C. M. Tan and Y. Hou Journal of Applied Physics
2007- 期刊論文 Room temperature observation of point defect on gold surface using thermovoltage mapping A. Roy, C. M. Tan, S. OShea, H. Kedar, and W. Hofbauer Microelectronics Reliability
2007- 期刊論文 Root cause analysis based maintenance policy C. M. Tan and N. Raghavan International Journal of Quality and Reliability Management
2007- 期刊論文 Size, temperature and bond nature dependence of elasticity and its derivatives on extensibility, debye temperature, and heat capacity of nanostructures M. X. Gu, C. Q. Sun, Z. Chen, T. C. A. Yeung, S. Li, C. M. Tan, and V. Nosik Physical Review B
2007- 期刊論文 Unveiling the electromigration physics of ULSI interconnects through statistics C. M. Tan and N. Raghavan Semiconductor Science and Technology
2007- 研討會論文 An approach to statistical analysis of gate oxide breakdown mechanisms C. M. Tan and N. Raghavan
2007- 研討會論文 Blech effect in Cu interconnects with oxide and low-k dielectrics Y. Hou and C. M. Tan
2007- 研討會論文 Electromigration in ULSI Interconnection C. M. Tan
2007- 研討會論文 Electromigration in ULSI Interconnection (Keynote) C. M. Tan
2007- 研討會論文 Enhanced finite element modelling of Cu electromigration using ANSYS and Matlab W. Li and C. M. Tan
2007- 研討會論文 Finite element modeling of capacitive coupling voltage contrast C. M. Tan, S. Yanuar, and T. C. Chai
2007- 研討會論文 Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data C. M. Tan and F. He
2007- 研討會論文 Room temperature observation of point defect on gold surface using thermovoltage mapping A. Roy, C. M. Tan, S. OShea, and W. Hofbauer
2007- 研討會論文 Statistical analysis of multi-censored electromigration data using the EM algorithm N. Raghavan and C. M. Tan
2007- 研討會論文 The physical limit and manufacturability of power diode with carrier lifetime control C. M. Tan, L. Sun, N. Raghavan, G. Huang, C. Hsu, and C. Wang
2006- 期刊論文 Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification M. X. Gu, T. C. A. Yeung, V. Nosik, and C. M. Tan Journal of Applied Physics
2006- 期刊論文 Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding C. M. Tan, W. Yu, and W. Jun Applied Physics Letters
2006- 期刊論文 Development of highly accelerated electromigration test C. M. Tan, W. Li, K. T. Tan, and F. Low Microelectronics Reliability
2006- 期刊論文 Device level electrical-thermal-stress coupled-field modeling G. Huang and C. M. Tan Microelectronics Reliability
2006- 期刊論文 Electromigration in damascene copper interconnects of line width down to 100 nm A. Roy, R. Kumar, C. M. Tan, T. Wong, and C. H. Tung Semiconductor Science and Technology
2006- 期刊論文 Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect A. Roy and C. M. Tan Microelectronics Reliability
2006- 期刊論文 Feasibility study of the application of voltage contrast to printed circuit board C. M. Tan, Z. Gan, and T.C. Chai Microelectronics Reliability
2006- 期刊論文 Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects C. M. Tan and A. Roy Thin Solid Films
2006- 期刊論文 Low temperature sol-gel intermediate layer wafer bonding C. M. Tan, S. Deng, J. Wei, W. B. Yu, S. M. L. Nai, and H. Xie Thin Solid Films
2006- 研討會論文 A comprehensive predictive maintenance model for equipment maintenance in the semiconductor industry C. M. Tan and N. Raghavan
2006- 研討會論文 A comprehensive semi-empirical mobility model for strained-Si N-MOSFETs,” N. Raghavan, N. Hwang, and C. M. Tan.
2006- 研討會論文 A cost model for the predictive maintenance policy of a multi-state system C. M. Tan and N. Raghavan
2006- 研討會論文 Development of highly accelerated electromigration test C. M. Tan, W. Li, K. T. Tan, and F. Low.
2006- 研討會論文 Device level electrical-thermal-stress coupled-field modeling G. Huang and C. M. Tan
2006- 研討會論文 Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling W. Li and C. M. Tan
2006- 研討會論文 Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect A. Roy and C. M. Tan
2006- 研討會論文 Mapping of solder mask covered interconnects on high density printed circuit board C. M. Tan, Y. X. Tay, C. W. Goh, and T. C. Chai
2006- 研討會論文 ULSI Interconnect Reliability(Invited) C.M. Tan
2005-12 研討會論文 Maintenance policy for predictive maintenance (Invited) C. M. Tan
2005- 期刊論文 Current crowding effect on copper dual damascene via bottom failure for ULSI applications C. M. Tan, A. Roy, A. V. Vairagar, A. Krishnamoorthy, and S. G. Mhaisalkar IEEE Transactions on Device and Materials Reliability
2005- 期刊論文 Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications C. M. Tan, Z. Gan, W. F. Ho, S. Chen, and R. Liu Microelectronics Reliability
2005- 期刊論文 Effect of medium vacuum on low temperature wafer bonding W. B. Yu, C. M. Tan, J. Wei, S. S. Deng, and G. Huang Journal of Micromechanics and Microengineering
2005- 期刊論文 Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects C. M. Tan, A. Roy, K. T. Tan, D. Sim, K. Ye, and F. Low Microelectronics Reliability
2005- 期刊論文 Humidity study of a-Si PV cell C. M. Tan, B. K. Chen, and K. P. Toh Microelectronics Reliability
2005- 期刊論文 Investigation of weight-on-wheel switch failure in F-16 aircraft C. M. Tan, K. M. Ang, L. H. Tay, and Y. M. Tan Engineering Failure Analysis
2005- 期刊論文 Mathematical model for low-temperature wafer bonding under medium vacuum and its application W. B. Yu, J. Wei, and C. M. Tan. IEEE Transactions on Advanced Packaging
2005- 期刊論文 Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc Z. Gan, G. Yu, Z. Zhao, C. M. Tan, and B. K. Tay Journal of the American Ceramic Society
2005- 期刊論文 Mechanism of sol-gel intermediate layer low temperature wafer bonding C. M. Tan, S. Deng, J. Wei, and W. B. Yu. Journal of Physics D-Applied Physics
2005- 期刊論文 Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist C. M. Tan, K. P. Lim, T. C. Chai, and J. Lim Microelectronics Reliability
2005- 期刊論文 Reliability screening through electrical testing for press-fit alternator power diode in automotive application C. M. Tan, J. Chiu, R. Liu, and G. Zhang Microelectronics Reliability
2005- 期刊論文 Study of carbon in thermal oxide formed on 4H-SiC by XPS P. Zhao, E. Rusli, J. H. Xia, C. M. Tan, Y. Liu, C. C. Tin, S. F. Yoon, W. G. Zhu, and J. Ahn Silicon Carbide and Related Materials 2004, Material Science Forum
2005- 期刊論文 Temperature dependence of the field emission of multiwalled carbon nanotubes C. M. Tan, J. J. Jia, and W. Yu Applied Physics Letters
2005- 期刊論文 “Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures A. Roy, C. M. Tan, R. Kumar, and X. T. Chen Microelectronics Reliability
2005- 研討會論文 Device temperature and stress distributions in power diode - a finite element method G. Huang and C. M. Tan
2005- 研討會論文 Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film C. M. Tan, J. Jia, L. K. Ang, K. T. Ng, and Y. C. Foo
2005- 研討會論文 Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures A. Roy, C. M. Tan, R. Kumar, and X. T. Chen
2005- 研討會論文 Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects C. M. Tan, A. Roy, K. T. Tan, D. S. K. Ye, and F. Low
2005- 研討會論文 Examine the impact of maintenance policy for predictive maintenance N. Raghavan and C. M. Tan
2005- 研討會論文 Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure A. Roy and C. M. Tan
2005- 研討會論文 Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board K. P. Lim, J. Lim, C. M. Tan, and T. C. Chai
2005- 研討會論文 Is electron wind force the sole driving force in electromingration of ULSI interconnection? C. M. Tan
2005- 研討會論文 Is electron wind force the sole driving force in electromingration of ULSI interconnection? (Invited) C. M. Tan
2005- 研討會論文 Maintenance policy for predictive maintenance C. M. Tan
2005- 研討會論文 Making wafer bonding viable for mass production C. M. Tan, W. B. Yu, and J. Wei
2005- 研討會論文 New analysis technique for time to failure data in copper electromigration C. M. Tan, V. A. Anand, G. Zhang, A. Krishnamoorthy, and S. Mhaisalkar
2005- 研討會論文 Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist C. M. Tan, T. C. Chai, J. Lim, and K. P. Lim
2005- 研討會論文 Predictive maintenance and its impact to business decision C. M. Tan
2005- 研討會論文 Predictive maintenance and its impact to business decision (Invited) C. M. Tan
2005- 研討會論文 Reliability screening through electrical testing for press-fit alternator power diode in automotive application C. M. Tan, J. Chiu, R. Liu, and G. Zhang
2005- 研討會論文 Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature Wei, J.; Deng, S.S.; Tan, C.M.
2005- 研討會論文 Stress migration reliability of wide Cu interconnects with Gouging Vias Y. K. Lim, A. Roy, K. L. Pey, C. M. Tan, C. S. Seet, T. J. Lee, and D. Vigar
2004-09 期刊論文 Study of interactions between α-Ta films and SiO2 under rapid thermal annealing Yuan, Z.L.; Zhang, D.H.; Li, C.Y.; Prasad, K.; Tan, C.M. Thin Solid Films
2004-09 期刊論文 Thermal stability of Cu/α-Ta/SiO2/Si structures Yuan, Z.L.; Zhang, D.H.; Li, C.Y.; Prasad, K.; Tan, C.M. Thin Solid Films
2004-06 研討會論文 Determining maintenance strategy from root cause analysis and reliability data analysis (Invited) C. M. Tan, B. K. Khoo, and J, Png
2004-05 研討會論文 Reliabiilty Analysis and Application with MATLAB (Invited) C. M. Tan
2004-01 研討會論文 Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis(FMEA) (Invited) C. M. Tan
2004-01 研討會論文 Methodology for Build-in Reliability(Invited) Cher Ming Tan
2004- 期刊論文 Barrier layer effects on reliabilities of copper metallization Z. W. Yang, D. H. Zhang, C. Y. Li, C. M. Tan, and K. Prasad Thin Solid Films
2004- 期刊論文 Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects C. M. Tan, G. Zhang, and Z. Gan IEEE Transactions on Device and Materials Reliability
2004- 期刊論文 Identifying key parameters for risk based inspections (RBI) C. M. Tan Hydrocarbon Asia
2004- 期刊論文 Influence of applied load on vacuum wafer bonding at low temperature W. B. Yu, C. M. Tan, J. Wei, S. S. Deng, and S. M. L. Nai Sensors and Actuators A-Physical
2004- 期刊論文 Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc Z. Gan, Y. Zhang, G. Yu, C. M. Tan, S. P. Lau, and B. K. Tay Journal of Applied Physics
2004- 期刊論文 Overcoming intrinsic weakness of ULSI metallization electromigration performances C. M. Tan and G. Zhang Thin Solid Films
2004- 期刊論文 Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc Z. H. Gan, G. Q. Yu, B. K. Tay, C. M. Tan, Z. W. Zhao, and Y. Q. Fu Journal of Physics D-Applied Physics
2004- 期刊論文 Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology G. Zhang, C. M. Tan, K. T. Tan, K. Y. Sim, and W. Y. Zhang Microelectronics Reliability
2004- 期刊論文 Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, and C. M. Tan Thin Solid Films
2004- 期刊論文 Thermal Stability of Cu/a-Ta/SiO2/Si structures Z. L. Yuan, D. H. Zhang, C. Y. Li, J. Sudijono, and C. M. Tan Thin Solid Films
2004- 期刊論文 Thermally induced stress in partial SOI structure during high temperature processing Z. Gan and C. M. Tan Microelectronic Engineering
2004- 研討會論文 Application of FMEA for build-in reliability and maintenance C. M. Tan, B. K. Khoo
2004- 研討會論文 Application of FMEA for build-in reliability and maintenance (Invited) C. M. Tan, B. K. Khoo
2004- 研討會論文 Building empirical model through simulation a case study C. M. Tan and Z. Gan
2004- 研討會論文 Current crowding effect on submicron copper dual damascene via bottom failure A. Roy and C. M. Tan
2004- 研討會論文 Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications C. M. Tan, Z. Gan, W. F. Ho, S. Chen, and R. Liu
2004- 研討會論文 Determining maintenance strategy from root cause analysis and reliability data analysis C. M. Tan, B. K. Khoo, and J, Png
2004- 研討會論文 Effect of current crowding on copper dual damascene via bottom failure for ULSI applications A. Roy, C. M. Tan, V. V. Anand, K. Ahila, G. Zhang, and M. G. Subodh
2004- 研討會論文 Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing G. Huang, C. M. Tan, Z. Gan, G. Zhang, W. Yu, and W. Jun
2004- 研討會論文 Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing Guangyu Huang; Cher Ming Tan; Zhenghao Gan; Wei Jun; Guan Zhang; Weibo Yu
2004- 研討會論文 Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) C. M. Tan.
2004- 研討會論文 Industry-university R&D collaboration: expectation and reality C. M. Tan, Y. H. Sng, and H. K. Tang
2004- 研討會論文 Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer J. Wei, S. S. Deng, C. M. Tan, and C. K. Wong.
2004- 研討會論文 Low temperature wafer bonding in medium vacuum W. B. Yu, J. Wei, C. M. Tan, and S. S. Deng
2004- 研討會論文 Low temperature wafer bonding process using sol-gel intermediate layer S. S. Deng, J. Wei, C. M. Tan, W. B. Yu, S. M. L. Nai, and H. Xie.
2004- 研討會論文 New useful information from simple forward I-V measurement of a power diode C. M. Tan, Z. Gan, W. F. Ho, R. Liu, and S. Chen
2004- 研討會論文 Reliabiilty Analysis and Application with MATLAB C. M. Tan
2004- 研討會論文 Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology G. Zhang, C. M. Tan, K. T. Tan, K. Y. Sim, and W. Y. Zhang.
2004- 研討會論文 Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer S. S. Deng, J. Wei, C. M. Tan, and W. B. Yu
2003- 期刊論文 A new method for deposition of cubic Ta diffusion barrier for Cu metallization Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, L. J. Tang, and C. M. Tan Thin Solid Films
2003- 期刊論文 Failure mechanisms of aluminum bond pad peeling during thermosonic bonding C. M. Tan and Z. Gan IEEE Transactions on Device and Materials Reliability
2003- 期刊論文 Low temperature silicon wafer bonding by sol-gel processing, S. S. Deng, J. Wei, C. M. Tan, S. M. L. Nai, W. B. Yu, and H. Xie International Journal of Computational Engineering Science
2003- 期刊論文 Methodology for customers focus build-in reliability C. M. Tan International Journal of Quality and Reliability Management
2003- 期刊論文 Non-destructive void size determination in copper metallization under passivation Z. Gan, C. M. Tan, and G. Zhang IEEE Transactions on Device and Materials Reliability
2003- 期刊論文 Temperature and stress distribution in the SOI structure during fabrication C. M. Tan, Z. Gan, and X. Gao IEEE Transactions on Semiconductor Manufacturing
2003- 研討會論文 A novel technique to re-construct three dimensional void in passivated metal interconnects C. M. Tan, Z. Gan, K. Prasad, and D. H. Zhang
2003- 研討會論文 Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects G. Zhang, C. M. Tan, Z. Gan, K. Prasad, and D. H. Zhang.
2003- 研討會論文 Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test C. M. Tan, A. C. M. Lim, C. T. Y. Tai, G. Zhang, H. S. Park, and S. M. Ong
2003- 研討會論文 Effectiveness of delta VF test to detect solder integrity in power diode C. M. Tan and Z. Gan
2003- 研討會論文 Effects of Cu surface cleanness on electromigration reliability of Cu interconnects H. S. Park, J. K. Low, C. M. Tan, and A. See
2003- 研討會論文 Growth of carbon nanotubes using ZrFe catalyst layer and their field emission properties L. Huang, S. P. Lau, C. M. Tan, Z. Sun, and B. K. Tay
2003- 研討會論文 Improving the reverse blocking capability of carrier stored trench-gate bipolar transistor C. M. Tan, Y. F. Wong, P. H. Teoh, G. Huang
2003- 研討會論文 Influence of applied load on wafer bonding in vacuum W. Yu, J. Wei, C. M. Tan, S. Deng, and S. M. L. Nai
2003- 研討會論文 Influence of plasma treatment and cleaning on vacuum wafer bonding W. Yu, C. M. Tan, J. Wei, S. Deng, and S. M. L. Nai.
2003- 研討會論文 Influence of super-thin oxide layer on device fabricated on partial SOI substrate W. Yu, C. M. Tan, and G. Zhang
2003- 研討會論文 Investigation of the physical processes during electromigration of ULSI interconnection C. M. Tan and G. Zhang
2003- 研討會論文 Investigation of the physical processes during electromigration of ULSI interconnection (Invited) C. M. Tan and G. Zhang
2003- 研討會論文 Low temperature Wafer bonding(Invited) C. M. Tan
2003- 研討會論文 Low temperature silicon wafer bonding by sol-gel processing S. S. Deng, J. Wei, C. M. Tan, S. M. L. Nai, H. Xie, and W. B. Yu
2003- 研討會論文 Overcoming intrinsic weakness of ULSI metallization on electromigration performances C. M. Tan and G. Zhang
2003- 研討會論文 Reliability Data Analysis(Invited) C. M. Tan
2003- 研討會論文 Silicon-to-silicon wafer bonding efficiency by sol-gel process S. S. Deng, C. M. Tan, J. Wei, S. M. L. Nai, and W. B. Yu
2003- 研討會論文 Study of interaction between a-Ta films and SiO2 under rapid thermal annealing Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, L. J. Tang, C. M. Tan, R. Kumar, and P.D. Foo
2002- 期刊論文 Application of wigner-ville distribution in electromigration noise analysis C. M. Tan and S. Y. Lim IEEE Transactions on Device and Materials Reliability
2002- 期刊論文 Metastability in tritiated amorphous silicon S. Zukotynski, F. Gaspari, N. Kherani, T. Kosteski, K. Law, W. T. Shmayda, C. M. Tan Journal of Non-Crystalline solids
2002- 研討會論文 Characterization of a-Ta diffusion barrier for copper metallization Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, C. M. Tan, R. Kumar, and P. D. Foo
2002- 研討會論文 Cubic Ta diffusion barrier layers for Cu metallization Z. L. Yuan, D. H. Zhang, C. Y. Li, K. Prasad, C. M. Tan, Y. J. Yuan, P. W. Lu, R. Kumar, and P. D. Foo
2002- 研討會論文 Diffusion studies of Cu in Si and low-k dielectric materials K. Prasad, X. L. Yuan, C. M. Tan, D. H. Zhang, C. Y. Li, S. R. Wang, S. Y. J. Yuan, J. L. Xie, D. Gui, and P. D. Foo
2002- 研討會論文 Improvement of Ta diffusion barrier by NH3 plasma pre-treatment Z. L. Yuan, C. Y. Lia, D. H. Zhang, K. Prasad, C. M. Tan, Y. J. Yuan, P. W. Lu, R. Kumar, and P. D. Foo
2002- 研討會論文 Novel rapid nondestructive technique for locating tiny voids in metallization line Z. Gan, C. M. Tan, K. Prasad, D. H. Zhang, and G. Zhang
2002- 研討會論文 QFD implementation in a discrete semiconductor industry T. K. Neo and C. M. Tan
2002- 研討會論文 Reliability Data Analysis(Keynote) Cher Ming Tan
2001- 期刊論文 A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT) C. M. Tan and K. N. C. Yeo Journal of Electronic Testing-Theory and Applications
2001- 研討會論文 Analysis of electromigration test data C. M. Tan, W. L. See, and J. K. C. Tey
2001- 研討會論文 Backside copper contamination issues in CMOS integrated circuits K. Prasad, D. H. Zhang, C. M. Tan
2001- 研討會論文 Effects of a thin flash layer on the diffusion of Cu, Ta, Si, and O in the Cu/TaN/SiO2/Si structures S. W. Loh, D. H. Zhang, C. Y. Li, R. Liu, A. T. S. Wee, K. Prasad, C. M. Tan, Y. K. Lee, P. D. Foo, and J. Xie
2001- 研討會論文 Metastability in tritiated amorphous silicon S. Zukotynski, F. Gaspari, N. Kherani, T. Kosteski, K. Law, W. T. Shmayda, and C. M. Tan
2001- 研討會論文 Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis, S. Y. Lim, C. M. Tan, K. Prasad, and D. H. Zhang
2000- 研討會論文 A new quality control parameter in wafer fabrication for wire bonding integrity C. M. Tan and G. Zhang
2000- 研討會論文 Integrating device modeling in QFD implementation for power electronics applications T. K. Neo and C. M. Tan
2000- 研討會論文 Reliability data analysis software development G. Zhang and C. M. Tan
2000- 研討會論文 Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT) C. M. Tan and K. N. C. Yeo.
2000- 研討會論文 Selection of failure time within test time interval for group reliability data analysis G. Zhang and C. M. Tan
1999- 期刊論文 Effect of BOE etching time on wire bonding quality C. M. Tan IEEE Transactions on Components and Packaging Technologies
1999- 期刊論文 Using power diode models for circuit simulations - a comprehensive review C. M. Tan and K. J. Tseng IEEE Transactions on Industrial Electronics
1999- 研討會論文 Thermal stress distribution in the SOI structure X. F. Gao, C. M. Tan, and W. L. Goh
1998- 期刊論文 Failure analysis of bond pad metal peeling using FIB and AFM C. M. Tan, E. Er, Y. Hua, and V. Chai IEEE Transactions on Components and Packaging Technologies
1995- 研討會論文 Computerization of quality control in electronics components industry C. M. Tan.
1992- 期刊論文 Electronic properties of n-i-n-i doping superlattices C. M. Tan, J. M. Xu, and S. Zukotynski Journal of Applied Physics
1991- 期刊論文 Assessment of the performance potential of a quantum resonant tunneling structure under current density constraint C. M. Tan and J. Xu International Journal of Electronics
1990- 期刊論文 Effect of Current Density on the Electrochemical Dissolution of Germanium and Zinc Selenide C. M. Tan, S. Zukotynski, and H. Mar Journal of the Electrochemical Society
1990- 期刊論文 Study of resonant tunneling structures: a hybrid incremental airy function plane wave approach C. M. Tan, J. Xu, and S. Zukotynski Journal of Applied Physics
1989- 期刊論文 Single Wafer Miniature Hall-Effect Keyboard C. M. Tan and S. Zukotynski. IEEE Transactions on Industrial Electronics